Patents by Inventor Yi-Yeh Yang

Yi-Yeh Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240087955
    Abstract: A method and apparatus for forming tungsten features in semiconductor devices is provided. The method includes exposing a top opening of a feature formed in a substrate to a physical vapor deposition (PVD) process to deposit a tungsten liner layer within the feature. The PVD process is performed in a first processing region of a first processing chamber and the tungsten liner layer forms an overhang portion, which partially obstructs the top opening of the feature. The substrate is transferred from the first processing region of the first processing chamber to a second processing region of a second processing chamber without breaking vacuum. The overhang portion is exposed to nitrogen-containing radicals in the second processing region to inhibit subsequent growth of tungsten along the overhang portion. The feature is exposed to a tungsten-containing precursor gas to form a tungsten fill layer over the tungsten liner layer within the feature.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 14, 2024
    Inventors: Yi XU, Xianyuan ZHAO, Zhimin QI, Aixi ZHANG, Geraldine VASQUEZ, Dien-Yeh WU, Wei LEI, Xingyao GAO, Shirish PETHE, Wenting HOU, Chao DU, Tsung-Han YANG, Kyoung-Ho BU, Chen-Han LIN, Jallepally RAVI, Yu LEI, Rongjun WANG, Xianmin TANG
  • Patent number: 10490502
    Abstract: A power distribution network adapted to provide power to a plurality of components in an integrated circuit is provided. The power distribution network includes a power distribution trunk path, a plurality of first power distribution branch paths, and a plurality of second power distribution branch paths. The power distribution trunk path is used for transmitting the power. A long axis direction of the power distribution trunk path is a first direction. The first power distribution branch paths and the second power distribution branch paths are electrically connected to the power distribution trunk path. A long axis direction of the first power distribution branch paths is a second direction different from the first direction. A long axis direction of the second power distribution branch paths is a third direction different from the first direction and the second direction.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: November 26, 2019
    Assignee: Faraday Technology Corp.
    Inventors: Yi-Yeh Yang, Wang-Chin Chen, Po-Chen Lo, Shang-Ru Lin, Jen-Hsing Lin, Jin-Cheng Chen
  • Publication number: 20190122986
    Abstract: A power distribution network adapted to provide power to a plurality of components in an integrated circuit is provided. The power distribution network includes a power distribution trunk path, a plurality of first power distribution branch paths, and a plurality of second power distribution branch paths. The power distribution trunk path is used for transmitting the power. A long axis direction of the power distribution trunk path is a first direction. The first power distribution branch paths and the second power distribution branch paths are electrically connected to the power distribution trunk path. A long axis direction of the first power distribution branch paths is a second direction different from the first direction. A long axis direction of the second power distribution branch paths is a third direction different from the first direction and the second direction.
    Type: Application
    Filed: January 3, 2018
    Publication date: April 25, 2019
    Applicant: Faraday Technology Corp.
    Inventors: Yi-Yeh Yang, Wang-Chin Chen, Po-Chen Lo, Shang-Ru Lin, Jen-Hsing Lin, Jin-Cheng Chen