Abstract: A integrated circuit includes a first, a second, a third, and a fourth gate, a first input pin and a first conductor. The first and third gate are on a first level. The second and fourth gate are on a second level. The second gate is coupled to the first gate. The fourth gate is coupled to the third gate. The first input pin extends in a second direction, is on a first metal layer above a front-side of a substrate, is coupled to the first gate, and configured to receive a first input signal. The first input pin is electrically coupled to the third gate by the first, second or fourth gate. The first conductor extends in the first direction, is on a second metal layer below a back-side of the substrate, and is coupled to the second and fourth gate.

Abstract: A device including a first vertical field effect transistor having a first drain/source region and a second drain/source region, and a second vertical field effect transistor having a third drain/source region and a fourth drain/source region. The device including a first power contact situated on a frontside of the device and coupled to the first drain/source region, a second power contact situated on the frontside of the device and coupled to the third drain/source region, and a contact situated on a backside of the device and coupled to the second drain/source region and to the fourth drain/source region.

Abstract: An integrated circuit includes a first-type active-region structure and a second-type active-region structure extending in a first direction and a first terminal-conductor and a second terminal-conductor extending in a second direction. The integrated circuit also includes a first power stub and a second power stub in a first metal layer and a first power line and a second power line in a second metal layer. The integrated circuit further includes a first via connector directly connected between the first power stub and the first terminal-conductor, a second via connector directly connected between the second power stub and the second terminal-conductor, a third via connector directly connected between the first power stub and the first power line, and a fourth via connector directly connected between the second power stub and the second power line.

Abstract: A semiconductor structure includes a first upper source/drain region, a second upper source/drain region, a first lower source/drain contact, a second lower source/drain contact, and a third conductive region. The first upper source/drain contact is disposed at a first elevation. The second upper source/drain contact is disposed at the first elevation. The first lower source/drain contact is disposed at a second elevation. The second lower source/drain contact is disposed at the second elevation. The third conductive region is disposed at a third elevation. A projection area of the third conductive region is disposed between a projection area of the first upper source/drain contact and a projection area of the second upper source/drain contact. The third elevation is disposed between the first elevation and the second elevation.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a semiconductor substrate, a contact structure, a first conductive element, and a first dielectric spacer structure. The semiconductor substrate includes an active region and an isolation structure. The contact structure is on the active region of the semiconductor substrate. The first conductive element is on the isolation structure of the semiconductor substrate. The first dielectric spacer structure is between the contact structure and the first to conductive element. The first dielectric spacer structure has a first concave surface facing the first conductive element.

Abstract: The present disclosure provides a method of manufacturing a semiconductor structure. The method includes providing a semiconductor substrate including an active region and an isolation structure. The method also includes forming a contact structure on the active region of the semiconductor substrate. The method further includes forming a dielectric spacer on opposite sides of the contact structure. The method also includes forming a conductive element on the isolation structure of the semiconductor substrate, wherein the dielectric spacer has a concave surface facing the conductive element.

Abstract: The present application provides a method of fabricating bit line contacts. The method includes steps of depositing an insulative layer and a sacrificial layer on the substrate; forming a photosensitive layer on the sacrificial layer; performing a first exposure process to expose the photosensitive layer to actinic radiation through a first mask; performing a first developing process to form an intermediate pattern on the sacrificial layer; performing a second exposure process to expose the intermediate pattern to the actinic radiation through a second mask; performing a second developing process to form a target pattern on the sacrificial layer; performing a first etching process to remove portions of the sacrificial layer exposed by the target pattern; performing a second etching process to form a plurality of trenches in the insulative layer; and depositing a conductive material into the plurality of trenches to form the bit line contacts.

Abstract: The present application provides a method of processing a substrate. The method of processing the substrate includes steps of forming a photosensitive layer on the substrate; performing a first exposure process to expose the photosensitive layer to actinic radiation through a first mask; performing a first developing process to remove portions of the photosensitive layer exposed to the actinic radiation and form an intermediate pattern; performing a second exposure process to expose the intermediate pattern to the actinic radiation through a second mask; performing a second developing process to remove portions of the intermediate pattern shielded from the actinic radiation and form a target pattern; and performing an etching process to remove portions of the substrate exposed by the target pattern.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a semiconductor substrate, a contact structure, a first conductive element, and a first dielectric spacer structure. The semiconductor substrate includes an active region and an isolation structure. The contact structure is on the active region of the semiconductor substrate. The first conductive element is on the isolation structure of the semiconductor substrate. The first dielectric spacer structure is between the contact structure and the first to conductive element. The first dielectric spacer structure has a first concave surface facing the first conductive element.

Abstract: The present disclosure provides a method of manufacturing a semiconductor structure. The method includes providing a semiconductor substrate including an active region and an isolation structure. The method also includes forming a contact structure on the active region of the semiconductor substrate. The method further includes forming a dielectric spacer on opposite sides of the contact structure. The method also includes forming a conductive element on the isolation structure of the semiconductor substrate, wherein the dielectric spacer has a concave surface facing the conductive element.

Abstract: The invention relates to an environmentally friendly fuel made of rubber and a manufacturing method thereof. The manufacturing method comprises the steps of pulverizing a rubber material into rubber powder; and mixing the rubber powder with a toxin elimination material to eliminate deleterious compositions such as chlorine and sulfur, wherein the toxin elimination material comprises a non-halogen flame retardant and a desulfurizing agent.

Abstract: An environmental-friendly fuel is provided which comprises 65 wt % to 95 wt % of a plurality of fine granules of recycled material mixed with 5 wt % to 35 wt % of a halogen-free flame retardant. The plurality of fine granules of recycled material are pulverized from waste polyurethane foamed material recovered from discarded objects.

Abstract: The present invention is related to a clean energy generating device which includes coiled or spiral shaped conductors, for receiving electromagnetic wave and inducing electric current, and elements which can create magnetic fields passing through the coiled or spiral shaped conductors for rectifying alternating current (AC) and transforming random electron movement from heat into direct current (DC) at the same time. The direct current (DC) is usable by an electronic device to supply power. The length, number of circles and the radius of the circles of the coiled or spiral shaped conductors are not limited and can be adjusted for receiving and rectifying effect. Thus, this invention make effective use of electromagnetic radiation and heat in the air to produce electricity. Furthermore, it can be combined with a specially designed unit to produce hydrogen from water to achieve output of clean energy fuel and practical purposes.

Abstract: The present invention is related to an energy recycling device. The energy recycling device includes a substrate, multiple miniature receivers, for receiving infrared radiation, on the substrate and multiple current rectifiers electrically connected to the miniature receivers respectively. The miniature receivers transform the infrared radiation into alternating currents (AC). The current rectifiers rectify the alternating currents (AC) so as to transform the alternating currents (AC) into direct currents (DC). Thereby, the infrared radiation received by the miniature receivers can be first transformed into the alternating currents (AC) with extremely high frequencies, and then the alternating currents (AC) with extremely high frequencies can be transformed into direct currents (DC) usable by an electronic device. Accordingly, infrared can be used to supply power.

Abstract: The present invention is related to an energy recycling device. The energy recycling device includes a substrate, multiple miniature receivers, for receiving infrared radiation, on the substrate and multiple current rectifiers electrically connected to the miniature receivers respectively. The miniature receivers transform the infrared radiation into alternating currents (AC). The current rectifiers rectify the alternating currents (AC) so as to transform the alternating currents (AC) into direct currents (DC). Thereby, the infrared radiation received by the miniature receivers can be first transformed into the alternating currents (AC) with extremely high frequencies, and then the alternating currents (AC) with extremely high frequencies can be transformed into direct currents (DC) usable by an electronic device. Accordingly, infrared can be used to supply power.

Abstract: A hand-wearing assembly has a main body and a side mirror mount. The main body is a loop and has a connecting top. The side mirror mount is connected with and stands on the connecting top. The side mirror mount has a mirror face facing a rear end of the connecting top and is capable of being connected with a side mirror. The side mirror mount allows the side mirror to stand above a wrist or a back of a hand. Accordingly, a rider can see a rear sight at ease via the standing side mirror. With a slight movement of the hand, the position of the side mirror is easily adjusted to enable the rider to see all the rear area from all directions, or to check the positions of the following cyclists.

Abstract: A ball-hitting glove assembly for boxing training has a glove, a ball and a rope. The glove has a palm section, a hand back section and a finger section. The rope is mounted securely on the glove and has a glove end and a ball end. The glove end of the rope is mounted securely on the hand back section. The ball end is opposite to the glove end of the rope. The ball is mounted securely on the ball end of the rope. The ball-hitting glove assembly is easily carried and is convenient for boxing-training at any time when a user travels or exercises outside. This is greatly practical for those who like boxing.

Abstract: A glove has a body, a side mirror pad and a side mirror. The body has a palm segment having a palm back surface and a wrist segment connected to the palm segment. The side mirror pad is connected to the palm back surface of the palm segment of the body and has a mirror face, a securing end and a connecting end. The securing end is connected to the palm back surface of the palm segment of the body. The connecting end is selectively connected detachably to the securing end and the palm back surface of the palm segment. The side mirror is mounted on the mirror face of the side mirror pad.

Abstract: A yoga glove has a palm section, a back section and a finger section. The palm section has a thumb hole formed through the palm section. An edge of the palm section has a front segment and a rear segment. An extending length of the back section is longer than that of the palm section. An edge of the back section has a front segment and a rear segment. The rear segment of the edge of the back section is connected securely with that of the edge of the palm section. The finger section is crescent shaped. An edge of the finger section is connected securely with the front segments of the palm section and the back section. Therefore, the ergonomically curved yoga glove can match the curved shape of the hand and stay close to the hand.

Abstract: A LED lighting fixture with a rotating terminal block is revealed. The LED lighting fixture includes a housing with a connection hole on one end. Positioning teeth are arranged at an inner edge of the connection hole and a rotating shaft sleeve with a stop flange against the connection hole is mounted in the connection hole. Moreover, positioning teeth corresponding to the positioning teeth of the connection hole are disposed on an inner side of the stop flange. A threaded segment threaded with a terminal block for connection and positioning is set on an outer edge of the rotating shaft sleeve. Thus the housing can be rotated directly and the positioning teeth of the housing and the positioning teeth of the rotating shaft sleeve are engaged and locked with each other so as to make the housing rotate around the terminal block. Therefore, the lighting angle is adjusted optimally.