Abstract: A method for making iridium oxide nanoparticles includes dissolving an iridium salt to obtain a salt-containing solution, mixing a complexing agent with the salt-containing solution to obtain a blend solution, and adding an oxidating agent to the blend solution to obtain a product mixture. A molar ratio of a complexing compound of the complexing agent to the iridium salt is controlled in a predetermined range so as to permit the product mixture to include iridium oxide nanoparticles.

Abstract: A overload protection switch with a reverse restart switching structure that has a seesaw lampshade provided with a protruding block which extending downward from the outside of the seesaw lampshade to ensure that the seesaw lampshade and the moving rod are accurately positioned in the ON and OFF positions in the housing to form a three-stage switching type with bidirectional positioning and forms an overload protection switch that can continuously maintain sufficient insulation distance and does not reduce the insulation distance due to fatigue decay of the binary alloy conductive plate.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a semiconductor substrate, a contact structure, a first conductive element, and a first dielectric spacer structure. The semiconductor substrate includes an active region and an isolation structure. The contact structure is on the active region of the semiconductor substrate. The first conductive element is on the isolation structure of the semiconductor substrate. The first dielectric spacer structure is between the contact structure and the first to conductive element. The first dielectric spacer structure has a first concave surface facing the first conductive element.

Abstract: A server for knowledge recommendation for defect review. The server includes a processor electronically coupled to an electronic storage device storing a plurality of knowledge files related to wafer defects. The processor is configured to execute a set of instruction to cause the server to: receive a request for knowledge recommendation for inspecting an inspection image from a defect classification server; search for a knowledge file in the electronic storage device that matches the inspection image; and transmit the search result to the defect classification server.

Abstract: A defect displaying method is provided in the disclosure. The method comprises acquiring defect group information from an image of a wafer, wherein the defect group information includes a set of correlations between a plurality of defects identified from the image and one or more corresponding assigned defect types and displaying at least some of the plurality of defects according to their corresponding assigned defect types.

Abstract: The instant invention provides a capacitor package structure having a functional coating and the method for manufacturing the same. The method includes coating a silane coupling agent with a general formula of Y(CH2)nSiX3 on a capacitor element for forming the functional coating, in which X can be a same or different substituents and is selected from the group consisting of chloride, methoxy group, ethoxy group, methoxyethoxy group and acetoxy group, Y is a vinyl group, an amino group, an epoxy group, a methacryloyloxy group, a thiol group, a uramino group or an isobutyl group; and coating a conductive dispersion on the functional coating for enabling a polymer composite material in the functional coating to be connected to the surface of the capacitor element through the silane coupling agent.

Abstract: A defect displaying method is provided in the disclosure. The method comprises acquiring defect group information from an image of a wafer, wherein the defect group information includes a set of correlations between a plurality of defects identified from the image and one or more corresponding assigned defect types and displaying at least some of the plurality of defects according to their corresponding assigned defect types.

Abstract: A server for knowledge recommendation for defect review. The server includes a processor electronically coupled to an electronic storage device storing a plurality of knowledge files related to wafer defects. The processor is configured to execute a set of instruction to cause the server to: receive a request for knowledge recommendation for inspecting an inspection image from a defect classification server; search for a knowledge file in the electronic storage device that matches the inspection image; and transmit the search result to the defect classification server.

Abstract: A capacitor package structure is provided. The capacitor package structure includes a capacitor element which includes a functional coating disposed on a surface thereon and a conductive polymer layer disposed on the functional coating. A conductive polymer composite material in the conductive polymer layer is connected to the surface of the capacitor element through a silane coupling agent in the functional coating. The silane coupling agent has a general formula of Y(CH2)nSiX3, wherein n is an integer of 0 to 3. X is same or different substituent selected from the group consisting of: chloride, methoxy group, ethoxy group, methoxyethoxy group, and acetoxy group, and Y is a vinyl group, an amino group, an epoxy group, a methacryloyloxy group, a thiol group, a uramino group or an isobutyl group.

Abstract: The instant invention provides a capacitor package structure having a functional coating and the method for manufacturing the same. The method includes coating a silane coupling agent with a general formula of Y(CH2)nSiX3 on a capacitor element for forming the functional coating, in which X can be a same or different substituents and is selected from the group consisting of chloride, methoxy group, ethoxy group, methoxyethoxy group and acetoxy group, Y is a vinyl group, an amino group, an epoxy group, a methacryloyloxy group, a thiol group, a uramino group or an isobutyl group; and coating a conductive dispersion on the functional coating for enabling a polymer composite material in the functional coating to be connected to the surface of the capacitor element through the silane coupling agent.

Abstract: The instant disclosure provides a soluble nanoparticle solution for a capacitor and a capacitor package structure including the same. The soluble nanoparticle solution at least includes a polyol, a glycol, a soluble nanoparticle and a dispersing agent. The polyol has a molecular weight ranging from 50 to 1000 g/mol, and the glycol has 2 to 8 carbon atoms.

Abstract: A device case has a body forming a compartment holding an electronic device with a back facing camera lens and a front side with a user interface display and front facing camera lens. The device case has a movable lens cover attached to the body and held by the body when moved to any of an open position, a first position, and a second position. The movable lens cover, in the open position, leaves the front facing camera lens, the user interface display, and the back facing camera lens exposed. The movable lens cover, in the first position, covers the back facing camera lens while leaving the user interface display and the front facing camera lens exposed, and when in the second position, covers both the front facing camera lens and the back facing camera lens while leaving the user interface display exposed.

Abstract: A solid electrolytic chip capacitor is provided which comprises a substrate layer, an electrical insulating block, a conductive polymer layer, a patterned reinforcement layer, and an electrode layer. The electrical insulating block is formed on the substrate layer to define an anode region and a cathode region on the substrate layer. The conductive polymer layer is formed to cover the cathode region of the substrate layer. The patterned reinforcement layer is formed to cover the conductive polymer. The electrode layer is formed to cover the patterned reinforcement layer. Whereby, the mechanical strength of the chip solid electrolytic capacitor can be improved without loss of capacitance.

Abstract: A solid electrolytic chip capacitor is provided which comprises a substrate layer, an electrical insulating block, a conductive polymer layer, a patterned reinforcement layer, and an electrode layer. The electrical insulating block is formed on the substrate layer to define an anode region and a cathode region on the substrate layer. The conductive polymer layer is formed to cover the cathode region of the substrate layer. The patterned reinforcement layer is formed to cover the conductive polymer. The electrode layer is formed to cover the patterned reinforcement layer. Whereby, the mechanical strength of the chip solid electrolytic capacitor can be improved without loss of capacitance.

Abstract: The instant disclosure relates to a manufacturing method of capacitor cathode foil structure, comprising the following steps. The first step is providing a base foil, subsequently inserting the foil into a reactor. The next step is executing a heating process for heat the base foil to a temperature region of 400° C. to 1000° C. The next step is directing a carbon containing precursor gas into the reactor. The last step is executing a cooling process for cooling the base foil to a temperature below 100° C. to deposit a graphene-based layer on one surface of the base foil, wherein the graphene-based layer is consisted of a plurality of graphene-based thin films in stacked arrangement.