Patents by Inventor Yi-Yu Lu

Yi-Yu Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162833
    Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.
    Type: Application
    Filed: November 13, 2023
    Publication date: May 16, 2024
    Inventors: Yi-Sheng CHANG, Cheng-Chan HSU, Chia-Wei CHU, Chun-Yu YANG, Deng-Cyun HUANG, Yi-Hsun CHIU, Chien-An LAI, Yu-Tai WANG, Chi-Shou HO, Zhi-Yuan WU, Ko-Wen LU
  • Patent number: 11983475
    Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pin-Dai Sue, Po-Hsiang Huang, Fong-Yuan Chang, Chi-Yu Lu, Sheng-Hsiung Chen, Chin-Chou Liu, Lee-Chung Lu, Yen-Hung Lin, Li-Chun Tien, Yi-Kan Cheng
  • Publication number: 20240144098
    Abstract: Aspects of the present disclosure provide an automated labeling system. For example, the automated labeling system can include an automated labeling module (ALM) configured to receive wireless signals and ground truth of learning object and label the wireless signals with the ground truth when receiving the ground truth to generate labeled training data. The automated labeling system can also include a training database coupled to the ALM. The training database can be configured to store the labeled training data.
    Type: Application
    Filed: October 16, 2023
    Publication date: May 2, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chao Peng WANG, Chia-Da LEE, Po-Yu CHEN, Hsiao-Chien CHIU, Yi-Cheng LU
  • Publication number: 20240072075
    Abstract: An electronic device including a substrate, a first electrode layer, a photodiode, an insulating layer, a second electrode layer, and a first transparent conductive layer is provided. The first electrode layer is disposed on the substrate. The photodiode is disposed on the first electrode layer and is electrically connected to the first electrode layer. The insulating layer is disposed on the photodiode. The second electrode layer is disposed on the insulating layer and is electrically connected to the photodiode. The first transparent conductive layer is disposed on the insulating layer and contacts the second electrode layer. A manufacturing method of an electronic device is also provided.
    Type: Application
    Filed: July 18, 2023
    Publication date: February 29, 2024
    Applicants: InnoCare Optoelectronics Corporation, Innolux Corporation
    Inventors: Chin-Chi Chen, Ting-Yu Chen, Yi-Ju Tseng, Ji-Zhen Lu
  • Publication number: 20240066635
    Abstract: A laser machining device includes a pulsed laser generator, an accommodation chamber, a bandwidth broadening unit and a pulse compression unit. The pulsed laser generator is configured to emit a pulsed laser. The accommodation chamber has a gas inlet. The bandwidth broadening unit is disposed in the accommodation chamber, and is configured to broaden a frequency bandwidth of the pulsed laser to obtain a broad bandwidth pulsed laser. The pulse compression unit is disposed in the accommodation chamber. The bandwidth broadening unit and the pulse compression unit are arranged in order along a laser propagation path, and the pulse compression unit is configured to compress a pulse duration of the broad bandwidth pulsed laser.
    Type: Application
    Filed: October 5, 2022
    Publication date: February 29, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yi-Chi LEE, Bo-Han CHEN, Chih-Hsuan LU, Ping-Han WU, Zih-Yi LI, Shang-Yu HSU
  • Publication number: 20240071656
    Abstract: A circuit protection device includes a first temperature sensitive resistor, a second temperature sensitive resistor, an electrically insulating multilayer, a first and second electrode layer, and at least one external electrode. The first temperature sensitive resistor and the second temperature sensitive resistor are electrically connected in parallel, and have a first upper electrically conductive layer and a second lower electrically conductive layer, respectively. The electrically insulating multilayer includes an upper insulating layer, a middle insulating layer, and a lower insulating layer. The upper insulating layer is between the first upper electrically conductive layer and the first electrode layer. The middle layer is laminated between the first temperature sensitive resistor and the second temperature sensitive resistor. The lower insulating layer is between the second lower electrically conductive layer and the second electrode layer.
    Type: Application
    Filed: January 13, 2023
    Publication date: February 29, 2024
    Inventors: Chien Hui WU, Yung-Hsien CHANG, Cheng-Yu TUNG, Ming-Hsun LU, Yi-An SHA
  • Patent number: 7505790
    Abstract: The present invention discloses an antenna diversity switch, used for receiving and transmitting RF signals for dual-mode co-existence wireless communication system. The antenna diversity switch comprises a first transmitting port; a second transmitting port; a receiving port; a first control unit, electrically connected between the first transmitting port and a first antenna; a second control unit, electrically connected between the first transmitting port and a second antenna; a third control unit, electrically connected between the second transmitting port and the first antenna; a forth control unit, electrically connected between the second transmitting port and the second antenna; a fifth control unit, electrically connected between the receiving port and the first antenna; a sixth control unit, electrically connected between the receiving port and the second antenna. The antenna diversity switch according to the present invention meets the requirement of IEEE 802.
    Type: Grant
    Filed: June 7, 2005
    Date of Patent: March 17, 2009
    Assignees: Integrated Systems Solution Corp.
    Inventors: Sheng-Fuh Chang, Wen-Lin Chen, Yi-Yu Lu, Hung-Cheng Chen, Shu-Fen Tang, Albert Chen