Patents by Inventor Yi-Yung Wu
Yi-Yung Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6431687Abstract: A manufacturing method of monolithic integrated thermal bubble inkjet print heads and the structure for the same. The method utilizes semiconductor manufacturing technologies to configure various elements in a thermal bubble inkjet print head, such as ink channels, an ink slot, an energy transducer, an orifice plate, on a single substrate. The ink channels are formed on an top surface of the substrate using the anisotropic etching technique. The ink slot is formed on a back surface of the substrate using the anisotropic etching technique. The energy transducer and the orifice plate are formed in order above the ink channels using the coating and etching techniques. This thermal bubble inkjet print head manufacturing method is particularly useful in the all batch process without employing the steps of precision alignment joint for the orifice plate in a conventional inkjet print head. Therefore, the method can greatly increase production efficiency and lower production costs.Type: GrantFiled: March 20, 2001Date of Patent: August 13, 2002Assignee: Industrial Technology Research InstituteInventors: Dong-Sing Wuu, Chen-Yu Cheng, Je-Ping Hu, Yi-Yung Wu, Yih-Shing Lee
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Publication number: 20020075359Abstract: A manufacturing method of monolithic integrated thermal bubble inkjet print heads and the structure for the same. The method utilizes semiconductor manufacturing technologies to configure various elements in a thermal bubble inkjet print head, such as ink channels, an ink slot, an energy transducer, an orifice plate, on a single substrate. The ink channels are formed on an top surface of the substrate using the anisotropic etching technique. The ink slot is formed on a back surface of the substrate using the anisotropic etching technique. The energy transducer and the orifice plate are formed in order above the ink channels using the coating and etching techniques. This thermal bubble inkjet print head manufacturing method is particularly useful in the all batch process without employing the steps of precision alignment joint for the orifice plate in a conventional inkjet print head. Therefore, the method can greatly increase production efficiency and lower production costs.Type: ApplicationFiled: March 20, 2001Publication date: June 20, 2002Inventors: Dong-Sing Wuu, Chen-Yu Cheng, Je-Ping Hu, Yi-Yung Wu, Yih-Shing Lee
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Patent number: 6406134Abstract: A monolithic ink-jet print head and a method of fabricating the same are proposed, which not only can allow the nozzle device to be highly secured to the ink-jet print head, but also can allow the overall manufacturing process for the ink-jet print head to be more simplified and thus more cost-effective to implement as compared to the prior art. The monolithic ink-jet print head is constructed on a print-control chip formed with an array of transducers. A plurality of ink barrier layers are then formed from a first polymer over the print-control chip for separating the transducers from each other; and subsequently, a nozzle device is formed from a second polymer over the ink barrier layer. The second polymer is substantially equal or at least close in thermal expansion coefficient to the first polymer used to form the ink barrier layer.Type: GrantFiled: January 22, 1999Date of Patent: June 18, 2002Assignee: Industrial Technology Research InstituteInventors: Je-Ping Hu, Yi-Yung Wu, Daniel Y. Lan, Yi-Hsuan Lai, Hui-Fang Wang
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Publication number: 20020048943Abstract: A method of manufacturing a printhead chip comprising the steps of first forming a resistive layer and a conductive layer over a substrate, wherein the resistive layer and the conductive layer act as a heater and a conductive line respectively. Thereafter, at least one insulating layer is deposited over the conductive layer and the resistive layer. Next, at least one metallic layer is deposited over the insulating layer without performing any intermediate photolithographic or etching operations, and then the metallic layer is patterned to form a contact opening. The contact opening passes through the metallic layer and the insulating layer while exposing a portion of the conductive layer. Subsequently, a metal plug is formed in the contact opening so that the metallic layer and the conductive layer are connected, thereby forming an electric circuit. Finally, a thick film is formed over the metallic layer acting as an ink channel for the printhead.Type: ApplicationFiled: August 3, 1998Publication date: April 25, 2002Inventors: CHIEH-WEN WANG, MING-LING LEE, YUAN-LIANG LAN, YI-YUNG WU, HUI-FANG WANG
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Publication number: 20020020921Abstract: A method of manufacturing a printhead chip comprising the steps of first forming a resistive layer and a conductive layer over a substrate, wherein the resistive layer and the conductive layer act as a heater and a conductive line respectively. Thereafter, at least one insulating layer is deposited over the conductive layer and the resistive layer. Next, at least one metallic layer is deposited over the insulating layer without performing any intermediate photolithographic or etching operations, and then the metallic layer is patterned to form a contact opening. The contact opening passes through the metallic layer and the insulating layer while exposing a portion of the conductive layer. Subsequently, a metal plug is formed in the contact opening so that the metallic layer and the conductive layer are connected, thereby forming an electric circuit. Finally, a thick film is formed over the metallic layer acting as an ink channel for the printhead.Type: ApplicationFiled: April 19, 2001Publication date: February 21, 2002Inventors: Chieh-Wen Wang, Ming-Ling Lee, Yuan-Liang Lan, Yi-Yung Wu, Hui-Fang Wang
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Publication number: 20010048452Abstract: A method for fabricating a high-density ink-jet print head that utilizes a common high-density nozzle plate as a base for aligning a multiple of ink-jet printing modules. The high-density nozzle plate has wide body, high-density, high-resolution nozzles. The nozzle plate is fabricated using conventional electrochemical machining or laser machining techniques. The nozzle plate is able to provide not only a base for aligning each ink-jet printing module, but also the alignment necessary for the whole group of the ink-jet printing modules so that all modules are aligned properly. Therefore, the alignment operation can be carried out without the need for sophisticated alignment equipment and the alignment accuracy is high.Type: ApplicationFiled: April 13, 1998Publication date: December 6, 2001Inventors: YUAN-LIANG LAN, YI-YUNG WU, CHIEH-WEN WANG, MING-LING LEE, YI-HSUAN LAI
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Patent number: 6280021Abstract: A structure of ink slots on an ink-jet printhead chip. The structure includes a plurality of firing chambers and a plurality of ink reservoirs. Each of the firing chambers has a heater and is enclosed by a plurality of walls, so each of the firing chambers is isolated. The ink reservoirs are respectively connected to the firing chambers by ink slots and each of the ink reservoirs is also isolated. Additionally, distances of the ink slots are equal.Type: GrantFiled: March 16, 1999Date of Patent: August 28, 2001Assignee: Industrial Technology Research InstituteInventors: Yi-Yung Wu, Je-Ping Hu, Yi-Hsuan Lai, Yuh-Horng Chuang, Chieh-Wen Wang
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Patent number: 6209993Abstract: A method for fabricating a printhead chip. A silicon substrate having a first surface and a second surface is provided. A plurality of grooves is formed in the first surface by an etching process. A plurality of ink slots are formed in each of the grooves. Overflow grooves are formed in the first surface beside the grooves. A plurality of firing chambers is formed on the second surface. Each of the firing chambers is respectively connected to each of the ink slots.Type: GrantFiled: March 29, 1999Date of Patent: April 3, 2001Assignee: Industrial Technology Research InstituteInventors: Chieh-Wen Wang, Yi-Yung Wu, Hung-Lieh Hu, Ming-Ling Lee
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Patent number: 6140909Abstract: A heat-generating resistor comprised essentially of Ru and Ta at the following composition ratios:22 atom percent .ltoreq.Ru.ltoreq.66 atom percent and34 atom percent .ltoreq.Ta.ltoreq.78 atom percent,and an ink jet head which includes said heat-generating resistor are provided.Type: GrantFiled: July 14, 1999Date of Patent: October 31, 2000Assignee: Industrial Technology Research InstituteInventors: Yi-Yung Wu, Dong-Sing Wuu, Chia-Chi Chan, Ray-Hua Horng
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Patent number: 6126260Abstract: A method of prolonging the lifetime of a thermal-bubble-ink-jet print head. A first pulse is provided to a heater of the print head for generating a first bubble to expel an ink drop. A second pulse is provided to the heater after a delay time for generating a second bubble is generated. The second pulse is not large enough to expel another ink drop.Type: GrantFiled: May 28, 1998Date of Patent: October 3, 2000Assignee: Industrial Technology Research InstituteInventors: Yuan-Liang Lan, Ming-Ling Lee, Yi-Yung Wu, Chu-Wen Chen, Ten-Hsing Jaw
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Patent number: 6076732Abstract: A holographic spectroscope for a two-motor reflection system for generating scanning patterns in which a light beam is first reflected by a first reflector connected to a first motor electrically connected to a first control circuit. A second reflector for reflecting the light beam reflected by the first reflector is connected to a second motor electrically connected to a second control circuit and to form scanning patterns. A holographic spectroscope for diffracting the scanning patterns is mounted in the optical path of the light beam from the second reflector. Therefore, the scanning patterns can be improved to be more variable.Type: GrantFiled: July 9, 1997Date of Patent: June 20, 2000Assignee: Industrial Technology Research InstituteInventors: Yuan-Liang Lan, Chu-Wen Chen, Yi-Yung Wu