Patents by Inventor Yi-Zen Yeh

Yi-Zen Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultra-thin, electronically conductive slice for button use
    Patent number: 8237071
    Abstract: An ultra-thin, electrically conductive slice for button use, which includes a non-metallic matrix and a metal mesh. The metal mesh is provided in the non-metallic matrix. A plurality of metal touch points are provided on the metal mesh and exposed out of a surface of the non-metallic matrix so as to enable the surface of the non-metallic matrix to form a dense, electrically conductive mesh. The non-metallic matrix is rubber or silica. The metal mesh is electrically conductive.
    Type: Grant
    Filed: June 1, 2010
    Date of Patent: August 7, 2012
    Inventor: Yi-Zen Yeh
  • Ultra-thin, electronically conductive slice for button use
    Publication number: 20100300853
    Abstract: An ultra-thin, electrically conductive slice for button use, which includes a non-metallic matrix and a metal mesh. The metal mesh is provided in the non-metallic matrix. A plurality of metal touch points are provided on the metal mesh and exposed out of a surface of the non-metallic matrix so as to enable the surface of the non-metallic matrix to form a dense, electrically conductive mesh. The non-metallic matrix is rubber or silica. The metal mesh is electrically conductive.
    Type: Application
    Filed: June 1, 2010
    Publication date: December 2, 2010
    Inventor: Yi-Zen Yeh