Patents by Inventor Yi

Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11038737
    Abstract: The embodiments of the present disclosure disclose a method for uplink multiuser data transmission and a system for uplink multiuser multiple input multiple output. The method includes: sending, by an access point AP, indication information to at least two stations STAs, wherein the indication information is used for indicating that the at least two STAs perform an uplink multiuser data transmission; receiving, by the AP, uplink data sent by the at least two STAs through channels from the at least two STAs to the AP, respectively; and demodulating, by the AP, the uplink data sent by the at least two STAs using receiving beams corresponding to pre-estimated channels from the at least two STAs to the AP, respectively.
    Type: Grant
    Filed: December 23, 2015
    Date of Patent: June 15, 2021
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Xun Yang, Yi Luo
  • Patent number: 11038877
    Abstract: Embodiments of the disclosure provide systems and methods for determining fingerprint information of a terminal device in a transportation service. An exemplary system may include a communication interface configured to establish a communication link between first and second terminal devices and receive user data from the first terminal device associated with a user of the transportation service. The communication interface may also be configured to receive authentication information authenticating the second terminal device. The system may also include a memory configured to store the user data and at least one processor coupled to the memory. The at least one processor is configured to determine a first fingerprint of the first terminal device based on the user data after receiving the authentication information authenticating the second terminal device.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: June 15, 2021
    Assignee: BEIJING DIDI INFINITY TECHNOLOGY AND DEVELOPMENT CO., LTD.
    Inventors: Xiaoyong Yi, Yu Wang, Fengmin Gong
  • Patent number: 11038014
    Abstract: A semiconductor device and a method of forming the same, the semiconductor device includes a substrate, a gate structure, a first dielectric layer, a second dielectric layer, a first plug and two metal lines. The substrate has a shallow trench isolation and an active area, and the gate structure is disposed on the substrate to cover a boundary between the active area and the shallow trench isolation. The first dielectric layer is disposed on the substrate, to cover the gate structure, and the first plug is disposed in the first dielectric layer to directly in contact with a conductive layer of the gate structure and the active area. The second dielectric layer is disposed on the first dielectric layer, with the first plug and the gate being entirely covered by the first dielectric layer and the second dielectric layer. The two metal lines are disposed in the second dielectric layer.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: June 15, 2021
    Assignees: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Feng-Yi Chang, Fu-Che Lee, Yi-Ching Chang, Kai-Lou Huang, Ying-Chih Lin, Gang-Yi Lin
  • Patent number: 11037846
    Abstract: A semiconductor package structure includes a substrate, a die electrically connected to the substrate, and a first encapsulant. The die has a front surface and a back surface opposite to the front surface. The first encapsulant is disposed between the substrate and the front surface of the die. The first encapsulant contacts the front surface of the die and the substrate.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: June 15, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chien-Hua Chen, Hsu-Chiang Shih, Cheng-Yuan Kung, Hung-Yi Lin
  • Patent number: 11038580
    Abstract: Various embodiments provide a method for determining polarization information and a device thereof. In those embodiments, a first polarization information set sent by a transmitting device can be received by the receiving device. The first polarization information set includes at least one piece of first polarization information. A quality set comprising at least one quality of a received signal can be determined by the receiving device. The first polarization information corresponds to a quality of the received signal in the quality set, and the received signal is sent by the transmitting device to the receiving device through a non-line-of-sight channel. An optimal quality in the quality set can be determined by the receiving device. The optimal quality has a minimum degradation degree of the received signal in the quality set. The receiving device can then send the first polarization information corresponding to the optimal quality to the transmitting device.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: June 15, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Teng Ma, Kun Li, Yi Chen
  • Patent number: 11036254
    Abstract: A foldable electronic input device having a folded mode and an unfolded mode is provided. The foldable electronic input device includes a first body having a first surface and a second surface opposite to the first surface and a second body having a third surface. A first input area and a second input area are disposed on the first surface and the second surface, respectively. The third input area is disposed on the third surface. When in the folded mode, the second body is located directly below the first body and the third surface faces the second surface. When in the unfolded mode, the first body is located beside the second body, the second surface forms a plane with the third surface, and the second input area and the third input area constitute a fourth input area. A portable electronic device including the foldable electronic input device is also provided.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: June 15, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jyh-Chyang Tzou, Hsiao-Wen Tseng, Yi-Hsun Liu, Yao-Hsien Yang, Han-Tsai Liu
  • Patent number: 11037693
    Abstract: A process for producing a transparent conductive film, comprising (a) providing a graphene oxide gel; (b) dispersing metal nanowires in the graphene oxide gel to form a suspension; (c) dispensing and depositing the suspension onto a substrate; and (d) removing the liquid medium to form the film. The film is composed of metal nanowires and graphene oxide with a metal nanowire-to-graphene oxide weight ratio from 1/99 to 99/1, wherein the metal nanowires contain no surface-borne metal oxide or metal compound and the film exhibits an optical transparence no less than 80% and sheet resistance no higher than 300 ohm/square. This film can be used as a transparent conductive electrode in an electro-optic device, such as a photovoltaic or solar cell, light-emitting diode, photo-detector, touch screen, electro-wetting display, liquid crystal display, plasma display, LED display, a TV screen, a computer screen, or a mobile phone screen.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: June 15, 2021
    Assignee: Global Graphene Group, Inc.
    Inventors: Yi-jun Lin, Aruna Zhamu, Bor Z. Jang
  • Patent number: 11035948
    Abstract: The disclosure discloses a virtual reality feedback device, and a positioning method, a feedback method, and a positioning system thereof. The method for positioning a virtual reality feedback device includes: obtaining first time point information of a first microwave signal, wherein the first time point information includes a reception time point and a transmission time point of the first microwave signal; obtaining a second time point information of a second microwave signal, wherein the second time point information includes a reception time point and a transmission time point of the second microwave signal; and determining a position of the virtual reality feedback device according to a transmission speed of the first microwave signal, a transmission speed of the second microwave signal, the first time point information, and the second time point information.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: June 15, 2021
    Assignees: BOE Technology Group Co., Ltd., Hefei BOE Optoelectronics Technology Co., Ltd.
    Inventors: Hui Luo, Hui Wang, Xin Yi, Yanni Liu
  • Patent number: 11038256
    Abstract: An antenna structure includes a metal housing, a first radiator, and an isolating portion. The metal housing includes a front frame, a backboard, and a side frame. The side frame is positioned between the front frame and the backboard. The side frame defines a slot and the front frame defines a gap. The gap communicates with the slot and extends across the front frame. The metal housing is divided into at least a long portion and a short portion by the slot and the gap. The first radiator is positioned adjacent to the short portion. The isolating portion is connected to the first radiator to improve isolation between the short portion and the first radiator.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: June 15, 2021
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Cheng-Han Lee, Yi-Wen Hsu, Wei-Xuan Ye
  • Patent number: 11035940
    Abstract: Methods, apparatus and systems for monitoring a presence or a motion of an object in a proximity of an apparatus are described. In one example, a described apparatus is in a venue for wireless proximity monitoring. The apparatus comprises: a transmitter, a receiver, and a processor. The transmitter is configured for transmitting a wireless signal through a wireless multipath channel, wherein the wireless multipath channel is impacted by a motion of an object within a proximity of the apparatus. The receiver is configured for: receiving the wireless signal through the wireless multipath channel between the transmitter and the receiver, and obtaining a time series of channel information (TSCI) of the wireless multipath channel based on the wireless signal received by the receiver. The processor is configured for monitoring the motion of the object within the proximity of the apparatus based at least partially on the TSCI.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: June 15, 2021
    Assignee: ORIGIN WIRELESS, INC.
    Inventors: Qinyi Xu, Yi Han, Hung-Quoc Duc Lai, Beibei Wang, Oscar Chi-Lim Au, K. J. Ray Liu
  • Patent number: 11035528
    Abstract: A light emitting device comprises a coherent source generating coherent light, a diffusing element, and a light guide part. The diffusing element includes first and second surfaces opposite to each other, and disperses the coherent light from the coherent source to generate incoherent light. The light guide part is provided on the side of the first surface of the diffusing element; it guides the coherent light emitting from the coherent source to be incident on the first surface to form a first light path, guides a part of incoherent light emitting from the first surface to emit through the first light path, guides the remaining incoherent light to emit through a second light path, and separates the first and second light paths. The luminous flux of the incoherent light emitting through the first light path is less than that of the incoherent light emitting through the second light path.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: June 15, 2021
    Assignee: APPOTRONICS CORPORATION LIMITED
    Inventors: Fei Hu, Yi Li, Yi Yang, Liangliang Cao
  • Patent number: 11037861
    Abstract: An interconnect structure and a method of forming an interconnect structure are provided. The interconnect structure is formed over a carrier substrate, upon which a die may also be attached. Upon removal of the carrier substrate and singulation, a first package is formed. A second package may be attached to the first package, wherein the second package may be electrically coupled to through vias formed in the first package.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: June 15, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen, Chiung-Han Yeh, Der-Chyang Yeh
  • Publication number: 20210173464
    Abstract: A system for visualizing power signal sequence is disclosed, and comprises: a microprocessor and a control module. The microprocessor comprises a first conversion unit and a second conversion unit. The first conversion unit is used for converting a power-on signal received from a power management chip to a first digital signal, and the second conversion unit is adopted for converting a power-off signal received form the power management chip to a second digital signal. After receiving the first digital signal and the second digital signal from the microprocessor, and the control module outputs a plurality of power monitoring data to an electronic device, such that a user easily knows the power signal state of the host computer by the system of the present invention.
    Type: Application
    Filed: June 5, 2020
    Publication date: June 10, 2021
    Inventors: PU-SUNG LIN, TSENG-HUA TUNG, YI-HSIEN LIU, CHIEN-HSUN LIN, CHANG-TING LIU
  • Publication number: 20210176778
    Abstract: The present invention relates to a method for performing uplink transmissions by a user equipment in a wireless communication system. In particular, the method includes the steps of: transmitting a data unit to a network using a configured uplink grant; receiving an uplink grant for retransmission of the data unit from the network; determining a retransmission timing using a parameter related to a retransmission delay; and retransmitting the data unit to the network using the uplink grant for retransmission on the determined retransmission timing. Especially, the configured uplink grant is shared by the user equipment and another user equipment, and the parameter indicates at least one instance of retransmission delay.
    Type: Application
    Filed: January 17, 2019
    Publication date: June 10, 2021
    Inventors: Jeonggu LEE, Sunyoung LEE, Seungjune YI
  • Publication number: 20210175387
    Abstract: A method of manufacturing display device is disclosed. a substrate includes a basal layer and metal contacts on the top surface. An insulation layer is disposed on the top surface and includes a first mounting surface and a bottom surface. Multiple grooves are formed on the insulation layer and each extends from the first mounting surface to the bottom surface. The grooves respectively correspond to the metal contacts and expose respective metal contacts. An electromagnetic force is provided with a direction from the basal layer toward the insulation layer. A droplet containing multiple micro components is provided on the first mounting surface. A configuration of an electrode of the micro component corresponds to a configuration of one of the grooves. The electrode is attracted to the corresponding groove by the electromagnetic force so as to electrically contact the metal contact.
    Type: Application
    Filed: February 21, 2021
    Publication date: June 10, 2021
    Applicant: PlayNitride Inc.
    Inventors: Tzu-Yu Ting, Yu-Hung Lai, Hsiang-Wen Tang, Yi-Chun Shih
  • Publication number: 20210173967
    Abstract: Systems and methods for generating a remodeling plan for a property are disclosed. An exemplary system includes a communication interface configured to receive a floor plan of the property and a remodeling preference. The system further includes at least one processor configured to obtain structural data of the property based on the floor plan and obtain a neural network model based on the remodeling preference. The neural network model is trained using sample floor plans and sample remodeling data for the remodeling preference. The at least one processor is further configured to learn structural remodeling information based on the floor plan and the structural data using the neural network model. The at least one processor is also configured to generate the remodeling plan for the property based on the structural remodeling information. The remodeling plan identifies one or more structures in the floor plan for remodeling.
    Type: Application
    Filed: February 19, 2021
    Publication date: June 10, 2021
    Applicant: Ke.com (Beijing) Technology Co., Ltd.
    Inventors: Bin YANG, Yilang HU, Yi ZHU, Chengcong XIN, Chong SU, Shili DENG
  • Publication number: 20210173739
    Abstract: Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures, the subset of bits comprise compressed code. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.
    Type: Application
    Filed: February 18, 2021
    Publication date: June 10, 2021
    Inventors: Yu-Der Chih, Ching-Huang Wang, Yi-Chun Shih, Meng-Chun Shih, C.Y. Wang
  • Publication number: 20210175111
    Abstract: A method of transferring a plurality of micro devices is provided. The method includes: arranging the micro devices on a carrier substrate in a hexagonal manner; arranging a plurality of pick-up portions of a transfer head in a rectangular manner; and picking up the micro devices from the carrier substrate by the pick-up portions.
    Type: Application
    Filed: December 8, 2019
    Publication date: June 10, 2021
    Inventor: Li-Yi CHEN
  • Patent number: D922370
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: June 15, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jyh-Chyang Tzou, Hsiao-Wen Tseng, Yao-Hsien Yang, Yi-Hsun Liu
  • Patent number: D922499
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: June 15, 2021
    Assignee: SHENZHEN HONGYUHAO TRADING CO., LTD.
    Inventor: Yi Chen