Abstract: A semiconductor device package includes a substrate, a semiconductor chip, a first ring structure and a second ring structure. The substrate includes a surface. The semiconductor chip is over the surface of the substrate. The first ring structure is over the surface of the substrate. The second ring structure is over the surface of the substrate, wherein the first ring structure is between the semiconductor chip and the second ring structure.

Abstract: Various embodiments of the present application are directed towards a one-time-programmable (OTP) implementation using magnetic junctions. In some embodiments, an array comprises multiple magnetic junctions in multiple columns and multiple rows, and the magnetic junctions comprise a first magnetic junction and a second magnetic junction. The first and second magnetic junctions comprise individual top ferromagnetic elements and individual bottom ferromagnetic elements, and further comprise individual barrier elements between the top and bottom ferromagnetic elements. A first barrier element of the first magnetic junction electrically separates first top and bottom ferromagnetic elements of the first magnetic junction. A second barrier element of the second magnetic junction has undergone breakdown, such that it has defects defining a leakage path between second top and bottom ferromagnetic elements of the second magnetic junction.

Abstract: A lighting apparatus has a heat sink sleeve module, a light support module, a driver and two terminals. The heat sink sleeve module defines a containing space and has a first inner surface and a second inner surface. The light support module disposed at least partly in the containing space. The light support module having a top plate, a first side plate and a second side plate. The top plate is mounted with a LED module. The first side plate and the second side plate are respectively appressed to the first inner surface and the second inner surface.

Abstract: A method includes forming a source/drain region, and in a vacuum chamber or a vacuum cluster system, preforming a selective deposition to form a metal silicide layer on the source/drain region, and a metal layer on dielectric regions adjacent to the source/drain region. The method further includes selectively etching the metal layer in the vacuum chamber, and selectively forming a metal nitride layer on the metal silicide layer. The selectively forming the metal nitride layer is performed in the vacuum chamber or a vacuum cluster system without vacuum break.

Abstract: Embodiments of the present disclosure describe signaling of positioning measurement indications or measurement gap requests. Other embodiments may be described and claimed.

Abstract: Disclosed are a compound as shown in formula I or formula II or a pharmaceutically acceptable salt thereof, wherein R1 is selected from pyrazinyl or substituted pyrazinyl; and R2 is selected from pyrazinyl or substituted pyrazinyl, phenyl or substituted phenyl, alkyl or substituted alkyl.

Abstract: A device with a noise shaping function in sampling frequency control includes a first adder, an N-bit quantizer, a mapping circuit, a second adder, a first D flip-flop, a scaler, and a second D flip-flop. The first adder generates a first value according to an input signal, a second value, and a third value. The N-bit quantizer outputs a codeword to a controller according to the first value. Frequency adjusting orders corresponding to codewords outputted by the N-bit quantizer are between a smallest predetermined negative value and a largest positive predetermined value, the controller utilizes an adjusting order corresponding to the codeword to make a frequency generator generate adjusted sampling frequency, and N is an integer greater than 2. The first D flip-flop, the scaler, and the second D flip-flop are used for providing a high-pass filter effect to the device.

Abstract: A semiconductor package includes a semiconductor die and a connection structure. The semiconductor die is laterally encapsulated by an insulating encapsulant. The connection structure is disposed on the semiconductor die, the connection structure is electrically connected to the semiconductor die, and the connection structure includes at least one first via, first pad structures, second vias, a second pad structure and a conductive terminal. The at least one first via is disposed over and electrically connected to the semiconductor die. The first pad structures are disposed over the at least one first via, wherein the at least one first via contacts at least one of the first pad structures. The second vias are disposed over the first pad structures, wherein the second vias contact the first pad structures.

Abstract: A mobile device includes a body, a motor, a transmission assembly and two driven components. The motor and the transmission assembly are disposed at the body. The transmission assembly includes a differential, two shafts and two stoppers. The differential is coupled to the motor. The two shafts are respectively coupled to the two opposite sides of the differential. The two stoppers are respectively disposed corresponding to the two shafts. The two driven components are respectively connected to the two shafts. When one of the two shafts is locked by the corresponding stopper, the motor may still drive the other shaft and the driven component connected thereto to rotate relative to the body through the differential. A transmission assembly is also provided.

Abstract: A plasma processing apparatus is provided. The apparatus includes a lower sheltering module. The apparatus further includes an upper sheltering module arranged adjacent to the lower sheltering module. The apparatus includes an upper plate and an upper PEZ ring positioned around the upper plate. The apparatus also includes a shadowing unit that includes a number of engaging parts in the form of arcs detachably positioned on the upper PEZ ring. In addition, the apparatus includes a plasma generation module for generating plasma in the peripheral region of the lower sheltering module and the upper sheltering module.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a recess in a layer. The recess has two opposite first inner walls and two opposite second inner walls, the first inner walls are spaced apart by a first distance, the second inner walls are spaced apart by a second distance, and the first distance is less than the second distance. The method includes depositing a first covering layer in the recess. The first covering layer covering the first inner walls is thinner than the first covering layer covering the second inner walls. The method includes removing the first covering layer over the first inner walls and a bottom surface of the recess.

Abstract: A package-on-package structure includes a first package, a second package and first intermetallic features. The first package includes at least one semiconductor die, an insulating encapsulant, a redistribution layer and conductive pads. The insulating encapsulant is encapsulating the semiconductor die. The redistribution layer is disposed on the insulating encapsulant. The conductive pads are located at a surface of the insulating encapsulant. The second package is stacked on the first package and electrically connected to the conductive pads through connectors. The first intermetallic features are sandwiched in between the conductive pads and the connectors and have a control region and a growth region. The connectors are connected to the control region, and the growth region spreads out from a periphery of the control region such that the spreading of the growth region extends away from the conductive pads in a direction towards the semiconductor die.

Abstract: The present invention provides compounds, compositions thereof, and methods of using the same.

Abstract: A humidity-controlled storage device includes a plurality of panels configured to form an enclosed volume. A first panel of the plurality of panels includes inlet and outlet ports. The storage device further includes a purge system with a gas inlet pipe, a gas supply system, and a gas extraction system. The gas inlet pipe includes a nozzle and a cylindrical portion coupled to the inlet port. The gas supply system is configured to supply a purge gas to the gas inlet pipe. The gas inlet pipe is configured to output the purge gas into the enclosed volume in a direction that creates a circular or an oval gas flow pattern within the enclosed volume. The gas extraction system is coupled to the outlet port and is configured to extract the purge gas from the enclosed volume.

Abstract: An online system provides group recommendations by applying a set of sourcing rules to identify a plurality of candidate groups and then generating scores for the candidate groups. The sourcing rules can be configured to identify a relatively small subset of the groups maintained by the online system. After the candidate groups are identified, the online system generates a score for each candidate group, ranks the candidate groups based on the scores, and sends high-ranking candidate groups to the target user to be displayed as recommended groups. As a result, the online system generates a smaller number of scores, which advantageously allows for the online system to provide group recommendations to users in a more computationally efficient manner.

Abstract: A fixed-focus projection lens including a first lens group, an aperture stop and a second lens group arranged sequentially along an optical axis of the fixed-focus projection lens in a direction from an outgoing side to an incoming side. The first lens group includes a first lens element to the sixth lens element arranged sequentially along the optical axis in a direction from the outgoing side to the incoming side. The second lens group includes a seventh lens element to an eleventh lens element arranged sequentially along the optical axis in a direction from the outgoing side to the incoming side. The material of the first lens element is plastic. The material of the second lens element to the eleventh lens element is glass. The fixed-focus projection lens of the disclosure has a smaller size, good optical quality and good durability of high temperature.

Abstract: Methods of inhibiting the replication of influenza viruses in a biological sample or patient, of reducing the amount of influenza viruses in a biological sample or patient, and of treating influenza in a patient, comprises administering to said biological sample or patient an effective amount of a compound represented by Structural Formula (I): or a pharmaceutically acceptable salt thereof, wherein the values of Structural Formula (IA) are as described herein. A compound is represented by Structural Formula (IA) or a pharmaceutically acceptable salt thereof, wherein the values of Structural Formula (IA) are as described herein. A pharmaceutical composition comprises an effective amount of such a compound or pharmaceutically acceptable salt thereof, and a pharmaceutically acceptable carrier, adjuvant or vehicle.

Abstract: An embodiment is a method of fabricating a semiconductor structure. The method includes utilize uses of a multi-layer structure disposed on a pattern defining layer. In some embodiments, a method of fabricating a semiconductor structure includes forming a first multi-layer structure on a pattern defining layer disposed on a film stack on a substrate, patterning the first multi-layer structure to form an aperture in the first multi-layer structure, forming a first cut opening in the pattern defining layer through the aperture defined by the first multi-layer structure, and forming a second multi-layer structure on the pattern defining layer, a portion of the second multi-layer structure being disposed in the first cut opening.

Abstract: A data exchange agreement between a first user and a second user is written, by a data exchange platform, into a block chain. The data exchange agreement is associated with first data. A first key is received, by the data exchange platform and from a first device associated with the first user. The first key is used for decrypting encrypted first data. The received first key is transmitted by the data exchange platform to a second device associated with the second user.

Abstract: An electrical connector has an insulative body, a group of first conductive terminals and a group of second conductive terminals fixed to the insulative body, a grounding metal plate and an outer shielding shell. A front part of the shell forms a first mating cavity and a rear part of the shell forms a second mating cavity. An insertion space is formed between elastic extending arms of the first terminal group and elastic extending arms of the second terminal group. An electrical connector combination, which includes the electrical connector and a circuit board, is further provided. An inserted portion of the circuit board can be correspondingly inserted into the insertion space and can be elastically interposed by the elastic extending arms of the first terminal group and the elastic extending arms of the second terminal group so as to be correspondingly electrically connected.