Patents by Inventor Yian LAN

Yian LAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12274105
    Abstract: Disclosed are a leadframe, a bracket and an LED device. The leadframe includes a first photo-etched metal part, having a first electrode and a chip placement layer thereon, which has a greater length for short and long edges than those of the first electrode; and a second photo-etched metal part, composed of a second electrode and a connection layer thereon, which has a greater length for short and long edges than those of the second electrode; wherein a first long edge of the chip placement layer is flush with a first long edge of the first electrode, and a first long edge of the connection layer is flush with a first long edge of the second electrode; and wherein the chip placement layer and the connection layer are provided with L-shaped pins at corners of their first long edges to cover sidewalls of the corresponding corners.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: April 8, 2025
    Assignee: APT ELECTRONICS CO., LTD.
    Inventors: Guowei David Xiao, Chuiming Wan, Zhaoming Zeng, Yu Hou, Wenmin Zhu, Yian Lan
  • Patent number: 12176466
    Abstract: An LED device and a bracket thereof. The bracket includes a first photo-etched metal part, composed of a first electrode and a chip placement layer stacked thereon, wherein an area of the chip placement layer is greater than an area of the first electrode; a second photo-etched metal part, composed of a second electrode and a connection layer stacked thereon; wherein a first insulation trench is provided between the first electrode and the second electrode, and a second insulation trench is provided between the chip placement layer and the connection layer. The LED device and the bracket thereof can increase the placement area for placing LED chips, thereby improving the luminance of the LED device.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: December 24, 2024
    Assignee: APT ELECTRONICS CO., LTD.
    Inventors: Chuiming Wan, Zhaoming Zeng, Yian Lan, Linshan Li, Wenmin Zhu, Guowei David Xiao
  • Publication number: 20230011594
    Abstract: Disclosed are a leadframe, a bracket and an LED device. The leadframe includes a first photo-etched metal part, having a first electrode and a chip placement layer thereon, which has a greater length for short and long edges than those of the first electrode; and a second photo-etched metal part, composed of a second electrode and a connection layer thereon, which has a greater length for short and long edges than those of the second electrode; wherein a first long edge of the chip placement layer is flush with a first long edge of the first electrode, and a first long edge of the connection layer is flush with a first long edge of the second electrode; and wherein the chip placement layer and the connection layer are provided with L-shaped pins at corners of their first long edges to cover sidewalls of the corresponding corners.
    Type: Application
    Filed: October 21, 2019
    Publication date: January 12, 2023
    Inventors: Guowei David XIAO, Chuiming WAN, Zhaoming ZENG, Yu HOU, Wenmin ZHU, Yian LAN
  • Publication number: 20220344546
    Abstract: An LED device and a bracket thereof. The bracket includes a first photo-etched metal part, composed of a first electrode and a chip placement layer stacked thereon, wherein an area of the chip placement layer is greater than an area of the first electrode; a second photo-etched metal part, composed of a second electrode and a connection layer stacked thereon; wherein a first insulation trench is provided between the first electrode and the second electrode, and a second insulation trench is provided between the chip placement layer and the connection layer. The LED device and the bracket thereof can increase the placement area for placing LED chips, thereby improving the luminance of the LED device.
    Type: Application
    Filed: October 21, 2019
    Publication date: October 27, 2022
    Inventors: Chuiming WAN, Zhaoming ZENG, Yian LAN, Linshan LI, Wenmin ZHU, Guowei David XIAO