Patents by Inventor Yian Yi ZHANG

Yian Yi ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ETCHING AND MECHANICAL GRINDING FILM-LAYERS STACKED ON A SEMICONDUCTOR SUBSTRATE
    Publication number: 20190214263
    Abstract: In some embodiments, a method of forming an integrated circuit includes providing a semiconductor substrate having an electronic circuit formed on a front side, and having a first material layer located over a second side of the substrate and a second material layer located between the first material layer and the second side. At least a portion of the first material layer is removed using a first chemical etching process, thereby exposing the second material layer. At least a portion of the second material layer is removed using a second chemical etching process. A portion of the substrate is then mechanically removed from the second side.
    Type: Application
    Filed: February 22, 2019
    Publication date: July 11, 2019
    Inventors: Jian Jun KONG, She Yu TANG, Yian Yi ZHANG, Qin Xu YU, Sheng Pin YANG