Patents by Inventor Yiben Ye

Yiben Ye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Single-stage and multi-stage low power interconnect architectures
    Patent number: 7190286
    Abstract: An interconnect architecture is provided to reduce power consumption. A first driver may drive signals on a first interconnect and a second driver may drive signals on a second interconnect. The first driver may be powered by a first voltage and the second driver may be powered by a second voltage different than the first voltage.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: March 13, 2007
    Assignee: Intel Corporation
    Inventors: Maged M. Ghoneima, Peter Caputa, Muhammad M. Khellah, Ram Krishnamurthy, James W. Tschanz, Yiben Ye, Vivek K. De, Yehea I. Ismail
  • Single-stage and multi-stage low power interconnect architectures
    Patent number: 6992603
    Abstract: An interconnect architecture is provided to reduce power consumption. A first driver may drive signals on a first interconnect and a second driver may drive signals on a second interconnect. The first driver may be powered by a first voltage and the second driver may be powered by a second voltage different than the first voltage.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: January 31, 2006
    Assignee: Intel Corporation
    Inventors: Maged M. Ghoneima, Peter Caputa, Muhammad M. Khellah, Ram Krishnamurthy, James W. Tschanz, Yiben Ye, Vivek K. De, Yehea I Ismail