Patents by Inventor Yican Cheng

Yican Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low-profile connector assembly and methods
    Patent number: 7845975
    Abstract: An electrical connector assembly having shielded cage assembly with a plurality of ports for receiving modules. In one embodiment, the modules comprise SFP (small form-factor pluggable) modules, and the electrical connector assembly is adapted for low-profile applications, thereby optimizing the amount of area and volume occupied by the SFP assembly. In one variant, the SFP modules are pluggable into individual ports, whereby two modules are interconnected to a single header connector interconnected to a motherboard. Methods of manufacturing the connector assembly are also disclosed.
    Type: Grant
    Filed: January 29, 2008
    Date of Patent: December 7, 2010
    Assignee: Pulse Engineering, Inc.
    Inventors: Yican Cheng, Tsou Cheng Jung, Mark Jackson
  • Low-profile connector assembly and methods
    Publication number: 20080299826
    Abstract: An electrical connector assembly having shielded cage assembly with a plurality of ports for receiving modules. In one embodiment, the modules comprise SFP (small form-factor pluggable) modules, and the electrical connector assembly is adapted for low-profile applications, thereby optimizing the amount of area and volume occupied by the SFP assembly. In one variant, the SFP modules are pluggable into individual ports, whereby two modules are interconnected to a single header connector interconnected to a motherboard. Methods of manufacturing the connector assembly are also disclosed.
    Type: Application
    Filed: January 29, 2008
    Publication date: December 4, 2008
    Inventors: Yican Cheng, Tsou Cheng Jung, Mark Jackson