Patents by Inventor Yichao SHI

Yichao SHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130637
    Abstract: System and method for sensing movement such as chest movement of each of a plurality of target test subjects by: transmitting, at each of N transmitting antennas (TXs) of a phased multiple-input multiple-output (phased-MIMO) radar, a common frequency modulated continuous wave (FMCW) signal in each of a plurality of time division multiplex (TDM) slots, each TDM slot having associated with it a respective weight selected in accordance with a transmit steering vector configured to cause a coherent summation of transmitted signal in a desired direction ?0 toward at least one target; receiving target-reflected energy associated with the transmitted FMCW signals at a virtual array formed by stacking signal from P TDM slots received via M receiving antennas (RXs) of the phased-MIMO radar; and processing an output of the virtual array to extract therefrom signal received from the desired direction ?0 to determine thereby target movement in the desired direction ?0.
    Type: Application
    Filed: October 18, 2023
    Publication date: April 25, 2024
    Applicant: Rutgers, The State University of New Jersey
    Inventors: Athina Petropulu, Yingying Chen, Zhaoyi Xu, Chung-Tse Michael Wu, Cong Shi, Tianfang Zhang, Shuping Li, Yichao Yuan
  • Patent number: 11309209
    Abstract: A wafer holder and a wafer transfer apparatus, system and method are disclosed. The wafer holder is mounted onto the wafer transfer apparatus and includes a holder body and a sucker. The holder body defines a first opening, while the sucker includes a first skirt. The first skirt is located on one side of the holder body and connected to the first opening. A groove is formed at a joint between the first skirt and the first opening. The groove is located at an outer side of the first skirt, and is able to relief stresses produced at a base portion of the sucker during deformation of the first skirt.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: April 19, 2022
    Assignee: Shanghai Micro Electronics Equipment (Group) Co., Ltd.
    Inventors: Gang Wang, Rongjun Zhang, Xiaoyu Jiang, Yichao Shi, Kai Liu, Junpeng Chen
  • Publication number: 20210393422
    Abstract: The present disclosure provides a kirigami-inspired injectable stent system. The stent systems and methods enable radial/circumferential and longitudinal delivery of an extended release of therapeutics within tubular structures of the body, such as the GI tract and trachea. According to some aspects, a kirigami-based injectable stent system is provided that can enable drug release through deposition of therapeutic-coated needles of the stent in the tubular mucosa, such as often found in the gastrointestinal tract or trachea.
    Type: Application
    Filed: June 21, 2021
    Publication date: December 23, 2021
    Inventors: Sahab BABAEE, Yichao SHI, Saeed ABBASALIZADEH, Robert LANGER, Carlo TRAVERSO
  • Patent number: 10782615
    Abstract: Disclosed is a silicon wafer processing device; a pre-aligned optical assembly and an edge exposure assembly are provided on a synchronous bi-directional motion module, reducing the occupied space of the device and saving the installation cost; and furthermore, a synchronous bi-directional motion module, a rotation unit and a position compensation unit on a bottom plate are controlled by means of a control assembly, so as to reduce the operational complexity; and moreover, the synchronous bi-directional motion module is controlled to drive the pre-aligned optical assembly and the edge exposure assembly to simultaneously move, so that the operations of pre-aligning and edge exposure can be performed on silicon wafers of different sizes, thereby saving the switching time and increasing the work efficiency. Further disclosed is a method for processing a silicon wafer using a silicon wafer processing device.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: September 22, 2020
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Gang Wang, Yichao Shi, Jie Jiang, Dongliang Huang, Haijun Song
  • Publication number: 20200286772
    Abstract: A wafer holder and a wafer transfer apparatus, system and method are disclosed. The wafer holder is mounted onto the wafer transfer apparatus and includes a holder body and a sucker. The holder body defines a first opening, while the sucker includes a first skirt. The first skirt is located on one side of the holder body and connected to the first opening. A groove is formed at a joint between the first skirt and the first opening. The groove is located at an outer side of the first skirt, and is able to relief stresses produced at a base portion of the sucker during deformation of the first skirt.
    Type: Application
    Filed: March 29, 2018
    Publication date: September 10, 2020
    Inventors: Gang WANG, Rongjun ZHANG, Xiaoyu JIANG, Yichao SHI, Kai LIU, Junpeng CHEN
  • Publication number: 20200192228
    Abstract: Disclosed is a silicon wafer processing device; a pre-aligned optical assembly and an edge exposure assembly are provided on a synchronous bi-directional motion module, reducing the occupied space of the device and saving the installation cost; and furthermore, a synchronous bi-directional motion module, a rotation unit and a position compensation unit on a bottom plate are controlled by means of a control assembly, so as to reduce the operational complexity; and moreover, the synchronous bi-directional motion module is controlled to drive the pre-aligned optical assembly and the edge exposure assembly to simultaneously move, so that the operations of pre-aligning and edge exposure can be performed on silicon wafers of different sizes, thereby saving the switching time and increasing the work efficiency. Further disclosed is a method for processing a silicon wafer using a silicon wafer processing device.
    Type: Application
    Filed: April 27, 2018
    Publication date: June 18, 2020
    Inventors: Gang WANG, Yichao SHI, Jie JIANG, Dongliang HUANG, Haijun SONG