Abstract: A moisture curable silylated composition comprising: a polymer (A) comprising at least 2 alkoxysilyl terminal groups of formula (I): wherein R1 represents a hydrocarbon-based divalent radical comprising from 5 to 15 carbon atoms; R2 represents a C2-C4 alkylene; R3 represents a C1-C6 alkylene; R4 and R5 each represent a C1-C4 alkyl; R6 represents H or a radical comprising 1 to 6 carbon atoms; n is an integer such that Mw of the block of formula —[OR2]n— is 300 to 40000 g/mole; m is an integer different from 0 such that the Mw of the polymer (A) is between 500 to 50000 g/mole, and p is an integer equal to 0, 1 or 2; a polymer (B) comprising at least 2 alkoxysilyl terminal groups of formula (II): wherein R2, R4, R5, n and p are such as defined for formula (I); and an alkoxy modified silsesquioxane (C).

Abstract: The invention relates to a composition comprising: —a moisture-crosslinkable polymer, —at least 1% by weight of unexpanded heat-expandable organic particles, and—at least 20% by weight of an inorganic filler, the weight percentages being with respect to the total weight of the composition. The invention also relates to a method for bonding substrates implementing the composition according to the invention. Furthermore, the invention relates to an article comprising the composition according to the invention. The invention further relates to a method for separating substrates implementing the composition according to the invention and comprising a heating step. Finally, the invention relates to the uses of the composition according to the invention.

Abstract: A moisture curable silylated composition comprising: a polymer (A) comprising at least 2 alkoxysilyl terminal groups of formula (I): wherein R1 represents a hydrocarbon-based divalent radical comprising from 5 to 15 carbon atoms; R2 represents a C2-C4 alkylene; R3 represents a C1-C6 alkylene; R4 and R5 each represent a C1-C4 alkyl; R6 represents H or a radical comprising 1 to 6 carbon atoms; n is an integer such that Mw of the block of formula —[OR2]n— is 300 to 40000 g/mole; m is an integer different from 0 such that the Mw of the polymer (A) is between 500 to 50000 g/mole, and p is an integer equal to 0, 1 or 2; a polymer (B) comprising at least 2 alkoxysilyl terminal groups of formula (II): wherein R2, R4, R5, n and p are such as defined for formula (I); and an alkoxy modified silsesquioxane (C).

Abstract: 1) Moisture curable silylated adhesive composition comprising: from 20% to 50% weight of a silane modified APAO; from 2% to 15% weight of a filler consisting of expanded hollow thermoplastic polymer microspheres; and from 10% to 60% weight of a tackifying agent. 2) Method for manufacturing an assembly product comprising: heating at from 130° C. to 180° C. said composition to make it liquid enough to be applied on a substrate, then coating said composition on the surface of a primary substrate, then putting into contact the coated surface of the primary substrate with the surface of a secondary substrate, then chemically curing the coated composition with water, preferably with atmospheric moisture.