Patents by Inventor Yichen Ma

Yichen Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240417249
    Abstract: An apparatus for forming CO2-free hydrogen and carbon nanomaterials from methane is described. The apparatus comprises: a gliding arc discharge, GAD, device arranged to generate a plasma; and a passageway including an inlet for the methane and an outlet for the hydrogen and carbon and/or carbon nanomaterials, wherein the passageway extends, at least in part, through the GAD device wherein, in use, the methane is reacted in the generated plasma at temperatures of at most 400° C. and atmospheric pressure, thereby forming the hydrogen from at least some of the methane. A method is also described.
    Type: Application
    Filed: October 14, 2022
    Publication date: December 19, 2024
    Inventors: Xin TU, Yichen MA
  • Publication number: 20240234465
    Abstract: A photosensor provided herein includes a sensing structure and a microlens. The sensing structure includes an epitaxial layer, a deep trench and a scattering structure. The epitaxial layer has an illuminated surface and a non-illuminated surface. The deep trench isolation is located along an edge of the epitaxial layer. The scattering structure is embedded in the epitaxial layer and extends inwardly from the illuminated surface. The scattering structure includes a first circular ring pattern and a peripheral pattern. The deep trench isolation surrounds the scattering structure, the peripheral pattern is connected with the deep trench isolation and the first circular ring pattern is separated from the peripheral pattern and the deep trench isolation. The microlens is disposed on the epitaxial layer, wherein the illuminated surface of the epitaxial layer is relatively close to the microlens than the non-illuminated surface.
    Type: Application
    Filed: October 19, 2022
    Publication date: July 11, 2024
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Eknath Sarkar, Yichen Ma, Yu-Chieh Lee, Chee-Wee Liu
  • Publication number: 20240136382
    Abstract: A photosensor provided herein includes a sensing structure and a microlens. The sensing structure includes an epitaxial layer, a deep trench and a scattering structure. The epitaxial layer has an illuminated surface and a non-illuminated surface. The deep trench isolation is located along an edge of the epitaxial layer. The scattering structure is embedded in the epitaxial layer and extends inwardly from the illuminated surface. The scattering structure includes a first circular ring pattern and a peripheral pattern. The deep trench isolation surrounds the scattering structure, the peripheral pattern is connected with the deep trench isolation and the first circular ring pattern is separated from the peripheral pattern and the deep trench isolation. The microlens is disposed on the epitaxial layer, wherein the illuminated surface of the epitaxial layer is relatively close to the microlens than the non-illuminated surface.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 25, 2024
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Eknath Sarkar, Yichen Ma, Yu-Chieh Lee, Chee-Wee Liu