Patents by Inventor Yi-Chen Wu

Yi-Chen Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250132284
    Abstract: Embodiments of the present disclosure provide a bond stage for bonding a semiconductor integrated circuit (IC) die. The bond stage includes a bonding platform having a top surface and a bottom surface opposing the top surface, a first actuator operable to tilt the bonding platform about a first rotation axis, and a plurality of contact sensors disposed at the bonding platform.
    Type: Application
    Filed: October 24, 2023
    Publication date: April 24, 2025
    Inventors: Amram EITAN, Hui-Ting LIN, Chih-Yuan CHIU, Kai Jun ZHAN, Yi Chen WU
  • Publication number: 20250002696
    Abstract: An extrudable biodegradable composition includes seaweed nanocellulose in the range of 1 to 3 wt %; a seaweed derivative in the range of 40-99 wt %; biodegradable polymer in the range of 0-30 wt %; plasticizer in the range of 0-25 wt %; and crosslinking agent in the range of 0-15 wt %. The extrudable biodegradable composition has a viscosity greater than approximately 500 cP and an extruded product made from the extrudable biodegradable composition has a controlled water soluble or water resistant property with a tensile strength of approximately 10 to 30 MPa.
    Type: Application
    Filed: November 10, 2022
    Publication date: January 2, 2025
    Inventors: Sum Hang, Grace POON, Yi Chen WU, Ka Yee HO
  • Publication number: 20230378123
    Abstract: A disclosed system is configured to bond a chip to a substrate and includes a chip processing subsystem that is configured to receive the chip and to expose the chip to a first plasma, and a substrate processing subsystem that is configured to receive the substrate and to expose the substrate to a second plasma. The system further includes a bonding subsystem that is configured to align the chip with the substrate, to force the chip and the substrate into direct mechanical contact with one another by application of a compressive force, and to apply heat to at least one of the chip or the substrate. Application of the compressive force and the heat thereby bonds the chip to the substrate. The first and second plasmas may include H2/N2, H2/Ar, H2/He, NH3/N2, NH3/Ar, or NH3/He and the chip and substrate may be maintained in a low oxygen environment.
    Type: Application
    Filed: May 20, 2022
    Publication date: November 23, 2023
    Inventors: Hui-Min Huang, Kai Jun Zhan, Yi Chen Wu, Wei-Hung Lin, Ming-Da Cheng
  • Publication number: 20190176452
    Abstract: The preset invention provides a method for manufacturing a case having patterns. By using the properties of repeated adherence and rinsability of the adhesive layer on the patch, an oily figure on an oil-proof figure card is adhered to a transparent case. Then the appearance of the case can be altered at will.
    Type: Application
    Filed: December 7, 2017
    Publication date: June 13, 2019
    Inventors: YI-CHEN WU, CHUN-LAN CHAO
  • Publication number: 20180169606
    Abstract: An apparatus for producing an inorganic powder and an apparatus for producing and classifying an inorganic powder are provided, wherein the apparatus for producing an inorganic powder includes an insulating tube, at least one pair of annular RF electrodes, and a gas supply apparatus. The pair of annular RF electrodes surrounds the outer circumference of the insulating tube to generate a first electric field region outside the insulating tube and generate a second electric field region having a plasma torch in the insulating tube after being turned on. The gas supply apparatus supplies a reaction mist and an inert gas into the insulating tube to thermally degrade and oxidize the reaction mist into an inorganic powder via the plasma torch.
    Type: Application
    Filed: December 5, 2017
    Publication date: June 21, 2018
    Applicant: Industrial Technology Research Institute
    Inventors: Chun-An Lu, Yuan-Ling Tsai, Chiung-Hsiung Chen, Yi-Chen Wu, Shih-Chin Lin
  • Patent number: 9829990
    Abstract: A flexible keyboard cover film and a control process of the flexible keyboard cover film are provided. The flexible keyboard cover film allows a user to perform a touch function and is suitable for covering a keyboard of a computer, and the flexible keyboard cover film includes a flexible transparent base material, a touch device, and an input/output (I/O) interface. The flexible transparent base material covers the keyboard. The touch device is located on the flexible transparent base material and is electrically connected to the computer through the I/O interface.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: November 28, 2017
    Assignee: HannsTouch Solution Incorporated
    Inventors: Hung-Yi Huang, Yi-Chen Wu
  • Patent number: 9816664
    Abstract: The present invention relates to a support for electronic device, which comprises an accommodating member. The accommodating member includes three accommodating space. A first support plate, a second support plate and a third support plate are deposed in three accommodating space. A second foldable part is disposed between the second support plate and a third support plate. In addition, the third support plate and the first support plate are disposed symmetrically on both sides of the second support plate. The fixing member is disposed on a first edge of the first support plate, a second edge of the second support plate, and a third edge of the third support plate. The fixing member connects and fixes each pair of said first edge, said second edge, and said third edge. Then the support for electronic device forms a stereoscopic shape.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: November 14, 2017
    Assignee: Triwood Technology Co., Ltd.
    Inventor: Yi-Chen Wu
  • Publication number: 20170299113
    Abstract: The present invention relates to a support for electronic device, which comprises an accommodating member. The accommodating member includes three accommodating space. A first support plate, a second support plate and a third support plate are deposed in three accommodating space. A second foldable part is disposed between the second support plate and a third support plate. In addition, the third support plate and the first support plate are disposed symmetrically on both sides of the second support plate. The fixing member is disposed on a first edge of the first support plate, a second edge of the second support plate, and a third edge of the third support plate. The fixing member connects and fixes each pair of said first edge, said second edge, and said third edge. Then the support for electronic device forms a stereoscopic shape.
    Type: Application
    Filed: September 6, 2016
    Publication date: October 19, 2017
    Inventor: YI-CHEN WU
  • Publication number: 20160239100
    Abstract: A flexible keyboard cover film and a control process of the flexible keyboard cover film are provided. The flexible keyboard cover film allows a user to perform a touch function and is suitable for covering a keyboard of a computer, and the flexible keyboard cover film includes a flexible transparent base material, a touch device, and an input/output (I/O) interface. The flexible transparent base material covers the keyboard. The touch device is located on the flexible transparent base material and is electrically connected to the computer through the I/O interface.
    Type: Application
    Filed: May 26, 2015
    Publication date: August 18, 2016
    Inventors: Hung-Yi Huang, Yi-Chen Wu
  • Publication number: 20130335962
    Abstract: The present disclosure relates to a light emitting diode (LED) light fixture including a frame, a light diffuser coupled to the frame, at least one LED array disposed adjacent at least one side wall of the frame and a waveform reflector panel having at least one two troughs and one crest disposed between the two troughs. The at least one LED array is disposed at an angle relative to the side wall side wall of the frame and the waveform reflector is positioned to receive and light generated by the LED array and to reflect the light through the light diffuser.
    Type: Application
    Filed: March 15, 2013
    Publication date: December 19, 2013
    Applicants: KENMOS TECHNOLOGY CO., LTD., PIXI LIGHTING LLC
    Inventors: YI-CHEN WU, CHIEN-FENG HUNG, CHIH-CHIEH KAO, JOHN ARAKI, I-CHUN CHEN
  • Publication number: 20080202800
    Abstract: A re-routing method and the circuit thereof, used to rearrange the external circuit coupled with the integrated circuit (IC), comprises the steps of providing a plurality of first conductive plate on the substrate of the IC to form an isolation layer; providing a plurality of second conductive plates on the isolation layer, wherein each of the second conductive plates is moved in isovector with each of the corresponding first conductive plates as the center, each of the second conductive plates electrically connected with each of the first conductive plates. Therefore, according to move the second conductive plates in isovector, the probe card may be reused for circuit testing to save the cost and reduce the material management.
    Type: Application
    Filed: April 25, 2008
    Publication date: August 28, 2008
    Inventors: Ming-Hong Kuo, Bor-Doou Rong, Yi-Chen Wu, Hsin-I Cheng
  • Patent number: 7399521
    Abstract: A carbon-containing metal matrix composite material and a method for producing the same are described, wherein the graphitized vapor grown carbon fibers (VGCF) on which a metal carbide film is formed via a sintering step, so as to improve the compounding quality and increase the content of the carbon material in the metal matrix, are dispersed uniformly in the metal matrix. The graphitized VGCF used in the present invention can be unidirectional VGCF or the VGCF having a three-dimensional linkage structure.
    Type: Grant
    Filed: January 6, 2006
    Date of Patent: July 15, 2008
    Assignee: Yonyu Plastics Co., Ltd.
    Inventors: Chun-Shan Wang, Ya-Jen Huang, Chin-Tien Kuo, Yi-Chen Wu
  • Publication number: 20070160841
    Abstract: A carbon-containing metal matrix composite material and a method for producing the same are described, wherein the graphitized vapor grown carbon fibers (VGCF) on which a metal carbide film is formed via a sintering step, so as to improve the compounding quality and increase the content of the carbon material in the metal matrix, are dispersed uniformly in the metal matrix. The graphitized VGCF used in the present invention can be unidirectional VGCF or the VGCF having a three-dimensional linkage structure.
    Type: Application
    Filed: January 6, 2006
    Publication date: July 12, 2007
    Inventors: Chun-Shan Wang, Ya-Jen Huang, Chin-Tien Kuo, Yi-Chen Wu
  • Publication number: 20060284635
    Abstract: A re-routing method and the circuit thereof, used to rearrange the external circuit coupled with the integrated circuit (IC), comprises the steps of providing a plurality of first conductive plate on the substrate of the IC to form an isolation layer; providing a plurality of second conductive plates on the isolation layer, wherein each of the second conductive plates is moved in isovector with each of the corresponding first conductive plates as the center, each of the second conductive plates electrically connected with each of the first conductive plates. Therefore, according to move the second conductive plates in isovector, the probe card may be reused for circuit testing to save the cost and reduce the material management.
    Type: Application
    Filed: January 3, 2006
    Publication date: December 21, 2006
    Inventors: Ming-Hong Kuo, Bor-Doou Rong, Yi-Chen Wu, Hsin-I Cheng
  • Patent number: D869595
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: December 10, 2019
    Assignee: KRISS INDUSTRIES ASIA LTD.
    Inventors: Li-Te Cheng, Yi-Chen Wu