Patents by Inventor Yichi YEN

Yichi YEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEIGHT ADJUSTABLE SEMICONDUCTOR WAFER SUPPORT
    Publication number: 20230326785
    Abstract: A height adjustable semiconductor wafer support is provided. The height adjustable semiconductor wafer support includes a chuck for supporting a semiconductor wafer, an adjustment mechanism having a top surface for supporting the chuck, and a stage coupled to the adjustment mechanism such that movement of the top surface of the adjustment mechanism relative to the stage changes a distance between the top surface of the adjustment mechanism and a top surface of the stage.
    Type: Application
    Filed: June 15, 2023
    Publication date: October 12, 2023
    Inventors: Ming SHING, Yichi YEN, Chun Liang CHEN, Kuo Lun LO
  • Height adjustable semiconductor wafer support
    Patent number: 11715665
    Abstract: A height adjustable semiconductor wafer support is provided. The height adjustable semiconductor wafer support includes a chuck for supporting a semiconductor wafer, an adjustment mechanism having a top surface for supporting the chuck, and a stage coupled to the adjustment mechanism such that movement of the top surface of the adjustment mechanism relative to the stage changes a distance between the top surface of the adjustment mechanism and a top surface of the stage.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: August 1, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Ming Shing, Yichi Yen, Chun Liang Chen, Kuo Lun Lo
  • HEIGHT ADJUSTABLE SEMICONDUCTOR WAFER SUPPORT
    Publication number: 20210249298
    Abstract: A height adjustable semiconductor wafer support is provided. The height adjustable semiconductor wafer support includes a chuck for supporting a semiconductor wafer, an adjustment mechanism having a top surface for supporting the chuck, and a stage coupled to the adjustment mechanism such that movement of the top surface of the adjustment mechanism relative to the stage changes a distance between the top surface of the adjustment mechanism and a top surface of the stage.
    Type: Application
    Filed: February 11, 2020
    Publication date: August 12, 2021
    Inventors: Ming Shing LIN, Yichi YEN, Sky CHEN, Gwo-Lun LOU