Patents by Inventor Yiching LIANG

Yiching LIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Planar patch clamp devices and methods for fabrication and use
    Patent number: 9146227
    Abstract: A planar patch clamp device includes a substrate comprising a first planar surface, a second planar surface opposing the first planar surface, and an inside surface defining an aperture extending from the first planar surface to the second planar surface; and an adhesion layer conformally disposed on the substrate including on the inside surface, wherein the adhesion layer defines a shape of the aperture, and the aperture is smooth and free of sharp corners. The substrate may be composed of silicon or a silicon-inclusive compound, and the adhesion layer may be composed of a glass material having a low-temperature reflow property. The device may be annealed to reflow the adhesion layer, thereby providing the aperture with smooth surfaces.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: September 29, 2015
    Assignee: Molecular Devices, LLC
    Inventor: Yiching Liang
  • PLANAR PATCH CLAMP DEVICES AND METHODS FOR FABRICATION AND USE
    Publication number: 20120169320
    Abstract: A planar patch clamp device includes a substrate comprising a first planar surface, a second planar surface opposing the first planar surface, and an inside surface defining an aperture extending from the first planar surface to the second planar surface; and an adhesion layer conformally disposed on the substrate including on the inside surface, wherein the adhesion layer defines a shape of the aperture, and the aperture is smooth and free of sharp corners. The substrate may be composed of silicon or a silicon-inclusive compound, and the adhesion layer may be composed of a glass material having a low-temperature reflow property. The device may be annealed to reflow the adhesion layer, thereby providing the aperture with smooth surfaces.
    Type: Application
    Filed: December 15, 2011
    Publication date: July 5, 2012
    Applicant: MOLECULAR DEVICES, LLC
    Inventor: Yiching LIANG