Patents by Inventor Yick Kuen Lee

Yick Kuen Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090110346
    Abstract: A diffusion and laser photoelectrically coupled integrated circuit signal line, wherein photoelectrically coupled pairs are formed on integrated circuit chips utilizing a diffusion light or a laser light emitted by LED or the photoelectrically coupled pairs are arranged in an array to form photoelectrically coupled matrixes on the chips are used as signal lines connecting integrated circuits; furthermore a light emission is made to hollow light emitter and placed on the integrated circuit chip; a hollow reflective sheet is located on the bottom surface of the chip and under the light emitting body where a send-receiving photosensitive module is disposed around and a hollow reflective sheet or a semitransparent diffusion sheet is placed over; and the same processed chips are stacked up. The present invention solves the problem of signal transmission bandwidth between the computer chips, increasing the present arithmetic capability and reducing the volume of the supercomputer.
    Type: Application
    Filed: October 27, 2008
    Publication date: April 30, 2009
    Inventor: Yick Kuen Lee
  • Patent number: 7460743
    Abstract: A diffusion and laser photoelectrically coupled integrated circuit signal line, wherein photoelectrically coupled pairs are formed on integrated circuit chips utilizing a diffusion light or a laser light emitted by LED or the photoelectrically coupled pairs are arranged in an array to form photoelectrically coupled matrixes on the chips are used as signal lines connecting integrated circuits; furthermore a light emission is made to hollow light emitter and placed on the integrated circuit chip; a hollow reflective sheet is located on the bottom surface of the chip and under the light emitting body where a send-receiving photosensitive module is disposed around and a hollow reflective sheet or a semitransparent diffusion sheet is placed over; and the same processed chips are stacked up. The present invention solves the problem of signal transmission bandwidth between the computer chips, increasing the present arithmetic capability and reducing the volume of the supercomputer.
    Type: Grant
    Filed: August 1, 2005
    Date of Patent: December 2, 2008
    Inventor: Yick Kuen Lee
  • Publication number: 20080107373
    Abstract: A diffusion and laser photoelectrically coupled integrated circuit signal line, wherein photoelectrically coupled pairs are formed on integrated circuit chips utilizing a diffusion light or a laser light emitted by LED or the photoelectrically coupled pairs are arranged in an array to form photoelectrically coupled matrixes on the chips are used as signal lines connecting integrated circuits; furthermore a light emission is made to hollow light emitter and placed on the integrated circuit chip; a hollow reflective sheet is located on the bottom surface of the chip and under the light emitting body where a send-receiving photosensitive module is disposed around and a hollow reflective sheet or a semitransparent diffusion sheet is placed over; and the same processed chips are stacked up. The present invention solves the problem of signal transmission bandwidth between the computer chips, increasing the present arithmetic capability and reducing the volume of the supercomputer.
    Type: Application
    Filed: August 1, 2005
    Publication date: May 8, 2008
    Inventor: Yick Kuen Lee