Abstract: Examples of dual core connectors and connection systems are disclosed. In an implementation, a dual core connector comprises a plug assembly and an engagement assembly, the plug assembly comprises a housing and ferrules. The housing has a through hole that penetrates through a first surface and an opposing second surface of the housing. The ferrules are both located within the housing and extend in the length direction of the housing, and axes of the ferrules are separately located at two sides of the through hole. The engagement assembly comprises an engagement member and a shaft body, one end of the shaft body is connected to the engagement member, and the other end of the shaft body is rotatably connected within the through hole, and when the shaft body is rotated relative to the housing into a locked position, the shaft body and the housing can lock together.

Abstract: A memory device for deep neural network, DNN, accelerators, a method of fabricating a memory device for deep neural network, DNN, accelerators, a method of convoluting a kernel [A] with an input feature map [B] in a memory device for a deep neural network, DNN, accelerator, a memory device for a deep neural network, DNN, accelerator, and a deep neural network, DNN, accelerator.

Abstract: A method for making a three-dimensional (3-D) module includes the steps of: A) forming a laminate of alternate ceramic tape layers and internal electrode layers on a substrate; B) etching said laminate to form first and second capacitor stacks at said first and second locations; C) firing said first and second capacitor stacks integrally; D) forming first and second pairs of external electrodes on said first and second capacitor stacks, respectively.

Abstract: A capacitive sensor, an electronic device, and an electronic device control method are disclosed and relate to the field of sensor technologies. The capacitive sensor includes at least one plate pair. Each plate pair includes a first plate and a second plate that are placed opposite to each other. A ratio of a plate length of each plate pair to a spacing in the plate pair is greater than 1 and less than or equal to 30. The capacitive sensor can detect an air gesture of a user based on fringe field effect and has advantages of a small size and low energy consumption.

Abstract: A method for making a three-dimensional (3-D) module includes the steps of: A) forming a laminate of alternate ceramic tape layers and internal electrode layers on a substrate; B) etching said laminate to form first and second capacitor stacks at said first and second locations; C) firing said first and second capacitor stacks integrally; D) forming first and second pairs of external electrodes on said first and second capacitor stacks, respectively.

Abstract: The present invention discloses a multi-bit-per-cell three-dimensional resistive random-access memory (3D-RRAMMB). It comprises a plurality of RRAM cells stacked above a semiconductor substrate. Each RRAM cell comprises a RRAM layer, which is switched from a high-resistance state to a low-resistance state during programming. By adjusting the programming current, the programmed RRAMs have different resistances.

Abstract: The present invention discloses a multi-bit-per-cell three-dimensional resistive random-access memory (3D-RRAMMB). It comprises a plurality of RRAM cells stacked above a semiconductor substrate. Each RRAM cell comprises a RRAM layer, which is switched from a high-resistance state to a low-resistance state during programming. By adjusting the programming current, the programmed RRAMs have different resistances.

Abstract: Structures and formation methods of a semiconductor device structure are provided. The method includes forming a dielectric layer over a semiconductor substrate and forming an opening in the dielectric layer to expose a conductive element. The method also includes forming a conductive layer over the conductive element and modifying an upper portion of the conductive layer using a plasma operation to form a modified region. The method further includes forming a conductive plug over the modified region.

Abstract: Overhang reduction methods are disclosed. In some embodiments, a method includes forming a recess in a dielectric layer, the recess defining first sidewalls of the dielectric layer. The method also includes depositing a first conductive layer over an upper surface of the dielectric layer and the sidewalls of the dielectric layer, the first conductive layer having a first overhang, removing the first overhang of the first conductive layer using an etchant selected from the group consisting of a halide of the first conductive layer, Cl2, BCl3, SPM, SC1, SC2, and combinations thereof, and filling the recess with a second conductive layer.

Abstract: Structures and formation methods of a semiconductor device structure are provided. The method includes forming a dielectric layer over a semiconductor substrate and forming an opening in the dielectric layer to expose a conductive element. The method also includes forming a conductive layer over the conductive element and modifying an upper portion of the conductive layer using a plasma operation to form a modified region. The method further includes forming a conductive plug over the modified region.