Patents by Inventor Yidong Guo

Yidong Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145618
    Abstract: A photovoltaic module, including a laminate including a solder strip; and a junction box arranged on a surface of the laminate and including a plate connected to the solder strip by laser soldering. The plate has a first region and a second region, in which a region covered by the solder strip on the plate is the first region, and a region not covered by the solder strip on the plate is the second region. A soldering seam formed by laser soldering includes a first soldering seam and a second soldering seam. The first soldering seam is located in the first region, and the first soldering seam extends through the solder strip into the plate along a thickness direction of the laminate. The second soldering seam is located in the second region, and the second soldering seam extends directly into the plate along the thickness direction of the laminate.
    Type: Application
    Filed: December 5, 2023
    Publication date: May 2, 2024
    Applicants: SHANGHAI JINKO GREEN ENERGY ENTERPRISE MANAGEMENT CO., LTD., ZHEJIANG JINKO SOLAR CO., LTD.
    Inventors: Zhiqiu GUO, Yidong HU, Yichao YAO
  • Publication number: 20240120426
    Abstract: Embodiments of the present disclosure relates to a photovoltaic module and a method for producing the photovoltaic module. The photovoltaic module includes a photovoltaic laminate and a junction box. The photovoltaic laminate includes a plurality of solar cells, at least one solder strip, a rear plate and a wiring member. The at least one solder strip is electrically connected with the wiring member. The junction box includes a bonding pad. The wiring member passes through an opening defined on the rear plate and abuts the bonding pad, and the wiring member is connected with the bonding pad by laser welding. A plurality of weld seams are formed in a welding region. Each weld seam extends from the wiring member towards interior of the bonding pad, and an extension depth of each weld seam in the bonding pad is not greater than 80% of a thickness of the bonding pad.
    Type: Application
    Filed: December 20, 2022
    Publication date: April 11, 2024
    Inventors: Zhiqiu GUO, Yidong HU, Yichao YAO
  • Patent number: 10790341
    Abstract: An array substrate, a fabrication method thereof, and an organic light-emitting diode display device are provided; the array substrate (10) comprises a base substrate (100), the base substrate (100) including a display region (102) and a peripheral region (101) surrounding the display region (102), the display region (102) including: a plurality of data lines (12) and a plurality of gate lines (11) intersecting with each other, a plurality of pixel regions (21), formed in a matrix and defined by the plurality of data lines (12) and the plurality of gate lines (11) intersecting with each other formed on the base substrate (100), wherein a thin film transistor (32) is formed in each of the plurality of pixel regions (21); and further, the array substrate (10) also comprises at least one solar cell unit (31), which, together with the thin film transistor (32), is located on a same side of the base substrate (100), and is formed in at least one of the plurality of pixel regions (21) and the peripheral region (101
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: September 29, 2020
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yidong Guo, Chunping Long
  • Publication number: 20180217421
    Abstract: Embodiments of the present disclosure provide a display substrate and manufacturing method thereof and a display device. The method of manufacturing the display substrate comprises: forming a pattern including an active layer on a base substrate using an amorphous silicon material, the active layer including at least one step region having a film thickness greater than a film thickness of other regions of the active layer; crystallizing the amorphous silicon material in the active layer into a polysilicon material.
    Type: Application
    Filed: May 23, 2016
    Publication date: August 2, 2018
    Inventors: Shantao Chen, Huijuan Zhang, Yidong Guo
  • Publication number: 20170338293
    Abstract: The present disclosure provides an array substrate, a method for fabricating the same and a display apparatus, which belongs to the field of display technology and may alleviate at least a problem of wide bezel of a display apparatus in the related art. The array substrate includes a display region and a periphery region abutting the display region, the display region being provided with a plurality of AM-OLEDs therein. The array substrate further includes a plurality of PM-OLEDs provided in the periphery region, wherein both of the plurality of AM-OLEDs and the plurality of PM-OLEDs are electrically connected to a power supply driving unit. Since the plurality of PM-OLEDs capable of emitting light are disposed in the periphery region, the array substrate according to the present disclosure can realize a narrow-bezel design.
    Type: Application
    Filed: October 13, 2016
    Publication date: November 23, 2017
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Yidong GUO
  • Publication number: 20160343780
    Abstract: An array substrate, a fabrication method thereof, and an organic light-emitting diode display device are provided; the array substrate (10) comprises a base substrate (100), the base substrate (100) including a display region (102) and a peripheral region (101) surrounding the display region (102), the display region (102) including: a plurality of data lines (12) and a plurality of gate lines (11) intersecting with each other, a plurality of pixel regions (21), formed in a matrix and defined by the plurality of data lines (12) and the plurality of gate lines (11) intersecting with each other formed on the base substrate (100), wherein a thin film transistor (32) is formed in each of the plurality of pixel regions (21); and further, the array substrate (10) also comprises at least one solar cell unit (31), which, together with the thin film transistor (32), is located on a same side of the base substrate (100), and is formed in at least one of the plurality of pixel regions (21) and the peripheral region (101
    Type: Application
    Filed: November 19, 2015
    Publication date: November 24, 2016
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yidong Guo, Chunping Long