Abstract: Systems and methods for optical communication are provided. For instance, a method for optical communication can include receiving, by a first coupling module, a power-on signal from a first electronic device coupled to the first coupling module. The method can also include relaying, by the first coupling module, a first optical signal to a second coupling module coupled to a second electronic device. The method can also include relaying, by the second coupling module, in response to receipt of the first optical signal, a second optical signal to the first coupling module. The method can also include activating, by the first coupling module, in response to receipt of the second optical signal, a data transfer circuit for relaying data via an optical communication interface between the first coupling module and the second coupling module.

Abstract: Systems and methods for optical communication are provided. For instance, a method for optical communication can include receiving, by a first coupling module, a power-on signal from a first electronic device coupled to the first coupling module. The method can also include relaying, by the first coupling module, a first optical signal to a second coupling module coupled to a second electronic device. The method can also include relaying, by the second coupling module, in response to receipt of the first optical signal, a second optical signal to the first coupling module. The method can also include activating, by the first coupling module, in response to receipt of the second optical signal, a data transfer circuit for relaying data via an optical communication interface between the first coupling module and the second coupling module.

Abstract: Systems and methods for optical communication are provided. For instance, a method for optical communication can include receiving, by a first coupling module, a power-on signal from a first electronic device coupled to the first coupling module. The method can also include relaying, by the first coupling module, a first optical signal to a second coupling module coupled to a second electronic device. The method can also include relaying, by the second coupling module, in response to receipt of the first optical signal, a second optical signal to the first coupling module. The method can also include activating, by the first coupling module, in response to receipt of the second optical signal, a data transfer circuit for relaying data via an optical communication interface between the first coupling module and the second coupling module.

Abstract: Systems and methods for optical communication are provided. For instance, a method for optical communication can include receiving, by a first coupling module, a power-on signal from a first electronic device coupled to the first coupling module. The method can also include relaying, by the first coupling module, a first optical signal to a second coupling module coupled to a second electronic device. The method can also include relaying, by the second coupling module, in response to receipt of the first optical signal, a second optical signal to the first coupling module. The method can also include activating, by the first coupling module, in response to receipt of the second optical signal, a data transfer circuit for relaying data via an optical communication interface between the first coupling module and the second coupling module.

Abstract: A magnetic field probe and a probe head thereof are disclosed herein. The probe head includes an inner metal layer, a shielding unit, and a filtering unit. The inner metal layer receives a magnetic field to be measured. The shielding unit, including a first shielding metal layer and a second shielding metal layer, shields the inner metal layer. The first and the second shielding metal layer are respectively stacked above and below the inner metal layer. The filtering unit, including a first filtering metal layer and a second filtering metal layer, filters out an electric field interfering with the inner metal layer. The first filtering metal layer is stacked between the first shielding metal layer and the inner metal layer. The second filtering metal layer is stacked between the second shielding metal layer and the inner metal layer.

Abstract: A magnetic field probe and a probe head thereof are disclosed herein. The probe head includes an inner metal layer, a shielding unit, and a filtering unit. The inner metal layer receives a magnetic field to be measured. The shielding unit, including a first shielding metal layer and a second shielding metal layer, shields the inner metal layer. The first and the second shielding metal layer are respectively stacked above and below the inner metal layer. The filtering unit, including a first filtering metal layer and a second filtering metal layer, filters out an electric field interfering with the inner metal layer. The first filtering metal layer is stacked between the first shielding metal layer and the inner metal layer. The second filtering metal layer is stacked between the second shielding metal layer and the inner metal layer.

Abstract: A magnetic field probe and a probe head thereof are disclosed herein. The probe head includes an inner metal layer, a shielding unit, and a filtering unit. The inner metal layer receives a magnetic field to be measured. The shielding unit, including a first shielding metal layer and a second shielding metal layer, shields the inner metal layer. The first and the second shielding metal layer are respectively stacked above and below the inner metal layer. The filtering unit, including a first filtering metal layer and a second filtering metal layer, filters out an electric field interfering with the inner metal layer. The first filtering metal layer is stacked between the first shielding metal layer and the inner metal layer. The second filtering metal layer is stacked between the second shielding metal layer and the inner metal layer.

Abstract: A magnetic field probe, a magnetic field measurement system, and a magnetic field measurement method are provided. The magnetic field probe includes a probe head. The probe head includes a first and second inner metal layer. The first inner metal layer includes a first sensing part and a first connecting part coupled thereto. The first sensing part is configured for detecting a magnetic field signal of a device under test to form a first magnetic field distribution signal. The second inner metal layer includes a second sensing part and a second connecting part coupled thereto. The second sensing part is configured for detecting the magnetic field signal of the device under test to form a second magnetic field distribution signal. A distance between the first sensing part and the device under test is smaller than that between the second sensing part and the device under test.

Abstract: A magnetic field probe, a magnetic field measurement system, and a magnetic field measurement method are provided. The magnetic field probe includes a probe head. The probe head includes a first and second inner metal layer. The first inner metal layer includes a first sensing part and a first connecting part coupled thereto. The first sensing part is configured for detecting a magnetic field signal of a device under test to form a first magnetic field distribution signal. The second inner metal layer includes a second sensing part and a second connecting part coupled thereto. The second sensing part is configured for detecting the magnetic field signal of the device under test to form a second magnetic field distribution signal. A distance between the first sensing part and the device under test is smaller than that between the second sensing part and the device under test.

Abstract: A magnetic field probe and a probe head thereof are disclosed herein. The probe head includes an inner metal layer, a shielding unit, and a filtering unit. The inner metal layer receives a magnetic field to be measured. The shielding unit, including a first shielding metal layer and a second shielding metal layer, shields the inner metal layer. The first and the second shielding metal layer are respectively stacked above and below the inner metal layer. The filtering unit, including a first filtering metal layer and a second filtering metal layer, filters out an electric field interfering with the inner metal layer. The first filtering metal layer is stacked between the first shielding metal layer and the inner metal layer. The second filtering metal layer is stacked between the second shielding metal layer and the inner metal layer.