Patents by Inventor Yifan Guo

Yifan Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150326182
    Abstract: A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3×1016 cm?3 at a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Application
    Filed: April 14, 2015
    Publication date: November 12, 2015
    Inventors: Howard E. Chen, Yifan Guo, Dinhphuoc Vu Hoang, Mehran Janani, Tin Myint Ko, Philip John Lehtola, Anthony James LoBianco, Hardik Bhupendra Modi, Hoang Mong Nguyen, Matthew Thomas Ozalas, Sandra Louise Petty-Weeks, Matthew Sean Read, Jens Albrecht Riege, David Steven Ripley, Hongxiao Shao, Hong Shen, Weimin Sun, Hsiang-Chih Sun, Patrick Lawrence Welch, Peter J. Zampardi, JR., Guohao Zhang
  • Patent number: 9041472
    Abstract: A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3×1016 cm?3 at a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: May 26, 2015
    Assignee: Skyworks Solutions, Inc.
    Inventors: Howard E. Chen, Yifan Guo, Dinhphuoc Vu Hoang, Mehran Janani, Tin Myint Ko, Philip John Lehtola, Anthony James LoBianco, Hardik Bhupendra Modi, Hoang Mong Nguyen, Matthew Thomas Ozalas, Sandra Louise Petty-Weeks, Matthew Sean Read, Jens Albrecht Riege, David Steven Ripley, Hongxiao Shao, Hong Shen, Weimin Sun, Hsiang-Chih Sun, Patrick Lawrence Welch, Peter J. Zampardi, Jr., Guohao Zhang
  • Patent number: 8987889
    Abstract: An integrated electromagnetic interference (EMI) shield for a semiconductor module package. The integrated EMI shield includes a plurality of wirebond springs electrically connected between a ground plane in the substrate of the package and a conductive layer printed on the top of the package mold compound. The wirebond springs have a defined shape that causes a spring effect to provide contact electrical connection between the tops of the wirebond springs and the conductive layer. The wirebond springs can be positioned anywhere in the module package, around all or some of the devices included in the package, to create a complete EMI shield around those devices.
    Type: Grant
    Filed: June 9, 2014
    Date of Patent: March 24, 2015
    Assignee: Skyworks Solutions, Inc.
    Inventors: Patrick Lawrence Welch, Yifan Guo
  • Publication number: 20140353807
    Abstract: An integrated electromagnetic interference (EMI) shield for a semiconductor module package. The integrated EMI shield includes a plurality of wirebond springs electrically connected between a ground plane in the substrate of the package and a conductive layer printed on the top of the package mold compound. The wirebond springs have a defined shape that causes a spring effect to provide contact electrical connection between the tops of the wirebond springs and the conductive layer. The wirebond springs can be positioned anywhere in the module package, around all or some of the devices included in the package, to create a complete EMI shield around those devices.
    Type: Application
    Filed: June 9, 2014
    Publication date: December 4, 2014
    Inventors: Patrick Lawrence Welch, Yifan Guo
  • Patent number: 8748230
    Abstract: An integrated electromagnetic interference (EMI) shield for a semiconductor module package. The integrated EMI shield includes a plurality of wirebond springs electrically connected between a ground plane in the substrate of the package and a conductive layer printed on the top of the package mold compound. The wirebond springs have a defined shape that causes a spring effect to provide contact electrical connection between the tops of the wirebond springs and the conductive layer. The wirebond springs can be positioned anywhere in the module package, around all or some of the devices included in the package, to create a complete EMI shield around those devices.
    Type: Grant
    Filed: January 14, 2013
    Date of Patent: June 10, 2014
    Assignee: Skyworks Solutions, Inc.
    Inventors: Patrick L. Welch, Yifan Guo
  • Publication number: 20140002188
    Abstract: A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3×1016 cm?3 at a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Application
    Filed: June 13, 2013
    Publication date: January 2, 2014
    Applicant: SKYWORKS SOLUTIONS, INC.
    Inventors: Howard E. Chen, Yifan Guo, Dinhphuoc Vu Hoang, Mehran Janani, Tin Myint Ko, Philip John Lehtola, Anthony James LoBianco, Hardik Bhupendra Modi, Hoang Mong Nguyen, Matthew Thomas Ozalas, Sandra Louise Petty-Weeks, Matthew Sean Read, Jens Albrecht Riege, David Steven Ripley, Hongxiao Shao, Hong Shen, Weimin Sun, Hsiang-Chih Sun, Patrick Lawrence Welch, Peter J. Zampardi, JR., Guohao Zhang
  • Patent number: 8373264
    Abstract: An integrated electromagnetic interference (EMI) shield for a semiconductor module package. The integrated EMI shield includes a plurality of wirebond springs electrically connected between a ground plane in the substrate of the package and a conductive layer printed on the top of the package mold compound. The wirebond springs have a defined shape that causes a spring effect to provide contact electrical connection between the tops of the wirebond springs and the conductive layer. The wirebond springs can be positioned anywhere in the module package, around all or some of the devices included in the package, to create a complete EMI shield around those devices.
    Type: Grant
    Filed: December 2, 2010
    Date of Patent: February 12, 2013
    Assignee: Skyworks Solutions, Inc.
    Inventors: Patrick L. Welch, Yifan Guo
  • Publication number: 20110084378
    Abstract: An integrated electromagnetic interference (EMI) shield for a semiconductor module package. The integrated EMI shield includes a plurality of wirebond springs electrically connected between a ground plane in the substrate of the package and a conductive layer printed on the top of the package mold compound. The wirebond springs have a defined shape that causes a spring effect to provide contact electrical connection between the tops of the wirebond springs and the conductive layer. The wirebond springs can be positioned anywhere in the module package, around all or some of the devices included in the package, to create a complete EMI shield around those devices.
    Type: Application
    Filed: December 2, 2010
    Publication date: April 14, 2011
    Applicant: SKYWORKS SOLUTIONS, INC.
    Inventors: Patrick L. Welch, Yifan Guo
  • Publication number: 20090127695
    Abstract: A substrate pad in a semiconductor package having a geometry and structure that facilitates providing a solder joint to the pad that has enhanced structural integrity and resistance to mechanical impact. The pad may include a plated metal stud that anchors the solder to the pad interface, providing a more compliant solder joint, even when lead-free solder is used.
    Type: Application
    Filed: November 19, 2007
    Publication date: May 21, 2009
    Inventors: Patrick Kim, Mark A. Kuhlman, Yifan Guo, Anthony LoBianco, Robert W. Warren
  • Patent number: 6310403
    Abstract: A method of manufacturing components includes providing a substrate (110, 531, 631, 700) having a first coefficient of thermal expansion (CTE), having a first surface (111), and supporting a first plurality of interconnects located over the first surface in a first predetermined pattern. The method also includes providing another substrate (190) having a second CTE, having a second surface (195), and supporting a second plurality of interconnects located over the second surface in a second predetermined pattern. The method further includes assembling together the two substrates at a first temperature outside of a temperature range of approximately 25 to 30° C.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: October 30, 2001
    Assignee: Motorola, Inc.
    Inventors: Chunsheng Zhang, Jong-Kai Lin, Scott E. Lindsey, Yifan Guo, Li Li
  • Patent number: 6013355
    Abstract: Registration of the layers in a multilayer electronic device is tested and measured by X-ray moire interferometry.
    Type: Grant
    Filed: December 30, 1996
    Date of Patent: January 11, 2000
    Assignee: International Business Machines Corp.
    Inventors: William Tze-You Chen, Douglas Howard Strope, Natalie Barbara Feilchenfeld, Yifan Guo, George Dean Ogden
  • Patent number: 5898486
    Abstract: A moire interferometer which is both portable and shielded from the environment, as well as a corresponding moire interferometric method, are disclosed.
    Type: Grant
    Filed: March 25, 1994
    Date of Patent: April 27, 1999
    Assignee: International Business Machines Corporation
    Inventors: James Francis Chesko, Sr., Yifan Guo, Bongtae Han, Chun Kil Lim
  • Patent number: 5877043
    Abstract: An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: March 2, 1999
    Assignee: International Business Machines Corporation
    Inventors: David James Alcoe, Steven Wayne Anderson, Yifan Guo, Eric Arthur Johnson
  • Patent number: 5825093
    Abstract: An attachment system (10,30) for electronic devices utilizes an interconnect substrate (11) and an attachment area (12,32) formed thereon. A non-wettable material (16,36) on a surface (13) of the substrate (11) substantially prevents an attachment material (17) from forming stress or cracks in the substrate (11).
    Type: Grant
    Filed: March 31, 1997
    Date of Patent: October 20, 1998
    Assignee: Motorola, Inc.
    Inventors: Yifan Guo, Rao Bonda, Geoff Swan
  • Patent number: 5760465
    Abstract: An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.
    Type: Grant
    Filed: February 1, 1996
    Date of Patent: June 2, 1998
    Assignee: International Business Machines Corporation
    Inventors: David James Alcoe, Steven Wayne Anderson, Yifan Guo, Eric Arthur Johnson