Abstract: Described herein are methods for generating a coated device, electrode, or portion of an electrode for implanting into a subject. Such devices and electrodes are generated using methods like atomic layer deposition. In some cases, methods like etching are used to expose portions of a coated surface. The methods described herein improve overall hermeticity, biocompatibility, and biostability of implantable devices.

Abstract: In variants, a neural interface system (e.g., retinal implant system, neural implant system, etc.) can include: a display, a controller, a power source, and/or any other suitable components. The system can be used with an external device including a communication element, a display-brain interface (e.g., cells), and/or any other suitable components.

Abstract: In variants, a neural interface system (e.g., retinal implant, neural implant, etc.) can include: a display, a controller, a power source, and/or any other suitable components. The system can be used with an external device including a communication element, a display-brain interface (e.g., cells), and/or any other suitable components.

Abstract: In variants, a neural interface system (e.g., retinal implant system, neural implant system, etc.) can include: a display, a controller, a power source, and/or any other suitable components. The system can be used with an external device including a communication element, a display-brain interface (e.g., cells), and/or any other suitable components.

Abstract: In variants, a neural interface system (e.g., retinal implant, neural implant, etc.) can include: a display, a controller, a power source, and/or any other suitable components. The system can be used with an external device including a communication element, a display-brain interface (e.g., cells), and/or any other suitable components.

Abstract: Systems and methods for manufacturing and processing microwires for use as microelectrodes are disclosed. The disclosed techniques provide methods for creating microelectrode bundles with different organizations and patterns. Systems and methods of the present disclosure also provide methods for electrochemically modifying bundles of microelectrode ends.

Abstract: The present disclosure provides systems, devices, and methods for penetrating a biological membrane. The system may comprise a laser unit configured to generate one or more laser beams. The system may comprise a set of targeting optics configured to direct the one or more laser beams to a target region of the biological membrane. The system may comprise a raster scanner operatively coupled to the laser unit and the set of targeting optics. The system may comprise a non-transitory computer readable storage medium comprising a set of instructions. The set of instructions may be configured to control at least one of the laser unit, the set of targeting optics, or the raster scanner to photodisrupt the target region of the biological membrane to a target depth while minimizing damage to one or more blood vessels in proximity to the target region.

Abstract: An implantable device and methods for forming the same are provided. The device may comprise: (a) a substrate comprising a plurality of feedthroughs, wherein the plurality of feedthroughs comprises a first conductive material; and (b) an array of microwires extending from the substrate. The array of microwires may be connected or bonded to the plurality of feedthroughs using a biocompatible solder or braze material or intermediate filler material. The array of microwires may comprise a second conductive material that is different from the first conductive material.

Abstract: Methods for patterning highly sensitive materials, such as organic materials, organic semiconductors, biomolecular materials, and the like, with photolithographic resolution are disclosed. In some embodiments, a germanium mask (304) is formed on the surface of the sensitive material (302), thereby protecting it from subsequent processes that employ harsh chemicals that would otherwise destroy the sensitive material (302). A microlithography mask (306) is patterned on the germanium mask layer (304), after which the germanium exposed by the microlithography mask (306) is removed by dissolving it in water. After transferring the pattern of the germanium mask (304) into the sensitive material (302), the germanium and microlithography masks (304, 306) are completely removed by immersing the substrate in water, which dissolves the remaining germanium and lifts off the microlithography mask material.

Abstract: Systems and methods for manufacturing and processing microwires for use as microelectrodes are disclosed. The disclosed techniques provide methods for creating microelectrode bundles with different organizations and patterns. Systems and methods of the present disclosure also provide methods for electrochemically modifying bundles of microelectrode ends.

Abstract: A system and method for testing the quality of a conductor is disclosed. Specifically, a system of testing a conductor using voltage source generator that is capacitively-coupled through the conductor to voltage detector is disclosed. The voltage source generates a varying voltage signal which induces a voltage signal in the capacitively coupled microwire conductor. The voltage detector that is also capacitively-coupled to the conductor measures the induced voltage. Using the detected voltage signal, the voltage detector determines whether there are any conductive breaks in the conductor.

Abstract: Methods for patterning highly sensitive materials, such as organic materials, organic semiconductors, biomolecular materials, and the like, with photolithographic resolution are disclosed. In some embodiments, a germanium mask (304) is formed on the surface of the sensitive material (302), thereby protecting it from subsequent processes that employ harsh chemicals that would otherwise destroy the sensitive material (302). A microlithography mask (306) is patterned on the germanium mask layer (304), after which the germanium exposed by the microlithography mask (306) is removed by dissolving it in water. After transferring the pattern of the germanium mask (304) into the sensitive material (302), the germanium and microlithography masks (304, 306) are completely removed by immersing the substrate in water, which dissolves the remaining germanium and lifts off the microlithography mask material.

Abstract: A neural-interface probe is provided. The probe may comprise a chip, a wire bundle substrate, and an encapsulant material. The chip may comprise a plurality of bond pads. The wire bundle substrate may comprise a plurality of wires extending through the substrate. The plurality of wires may comprise: (1) a proximal portion connected to the plurality of bond pads to thereby couple the chip to the substrate, and (2) a flexible distal portion configured to interface with neural matter. The encapsulant material may be disposed at least between the chip and the wire bundle substrate.

Abstract: A system and method for creating desired splay patterned microelectrodes is disclosed. A bundle of microwires is arranged into a desired splay pattern. This may be performed mechanically with a rigid frame, electronically by charging the microwires, or with some other technique. The microwires in the desired splay pattern are then heated to release internal tension. Upon completion of heating, the microwires are then slowly cooled such that the splayed microwires will retain the desired splay pattern. Insulation may then be added to the microwires if the microwires are not already insulated.

Abstract: A neural-interface probe is provided. The probe may comprise a chip, a wire bundle substrate, and an encapsulant material. The chip may comprise a plurality of bond pads. The wire bundle substrate may comprise a plurality of wires extending through the substrate. The plurality of wires may comprise: (1) a proximal portion connected to the plurality of bond pads to thereby couple the chip to the substrate, and (2) a flexible distal portion configured to interface with neural matter. The encapsulant material may be disposed at least between the chip and the wire bundle substrate.