Patents by Inventor Yi-Fan LIANG

Yi-Fan LIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat transfer device and method of making the same
    Patent number: 9738061
    Abstract: A heat transfer device includes a first and second substrate, and a heat transfer layer. The first substrate includes a first plate and a first adhesive layer that is formed on the first plate. The second substrate includes a second plate and a second adhesive layer that is formed on the second plate. The heat transfer layer is sandwiched between the first adhesive and second adhesive layers, and includes a plurality of carbon flakes that is made from one of graphene or graphite. The carbon flakes lies on the first adhesive layer with partial overlap of the carbon flakes.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: August 22, 2017
    Assignee: HONMOUNTECH CO., LTD.
    Inventor: Yi-Fan Liang
  • HEAT TRANSFER DEVICE AND METHOD OF MAKING THE SAME
    Publication number: 20160238331
    Abstract: A heat transfer device includes a first and second substrate, and a heat transfer layer. The first substrate includes a first plate and a first adhesive layer that is formed on the first plate. The second substrate includes a second plate and a second adhesive layer that is formed on the second plate. The heat transfer layer is sandwiched between the first adhesive and second adhesive layers, and includes a plurality of carbon flakes that is made from one of graphene or graphite. The carbon flakes lies on the first adhesive layer with partial overlap of the carbon flakes.
    Type: Application
    Filed: February 16, 2016
    Publication date: August 18, 2016
    Inventor: Yi-Fan LIANG