Abstract: An optical transmission module includes a housing having a cavity therein and an optical transmission device encapsulated in the cavity. The optical transmission device includes an optical waveguide substrate, laser assemblies, an optical multiplexing assembly and main waveguides. The optical waveguide substrate includes a surface and a first reflection inclined surface having an acute angle therebetween. The laser assemblies are disposed on the surface of the optical waveguide substrate, and are configured to emit laser beams towards the surface of the optical waveguide substrate. The optical multiplexing assembly is disposed in the optical waveguide substrate, and is configured to combine the laser beams into a laser beam. The main waveguides are disposed inside the optical waveguide substrate, light inlet ends of the main waveguides face the first inclined surface, and light outlet ends of the main waveguides are communicated with the optical multiplexing assembly.

Abstract: Disclosed are a method and apparatus for compressing a topology recognition model, an electronic device, and a medium. The method includes: pruning a to-be-compressed model to obtain a pruned model, and training the pruned model to obtain a trained pruned model; quantifying a bit quantity of a weight parameter of each neural network layer in the trained pruned model from a first bit quantity to a second bit quantity to obtain a highly-quantified pruned model, and training the highly-quantified pruned model to obtain a trained highly-quantified pruned model; using the trained highly-quantified pruned model as the to-be-compressed model, continuously pruning and quantifying the to-be-compressed model until a compressed topology recognition model is obtained, and deploying the compressed topology recognition model on an Internet of Things in Power Systems (IOTIPS) terminal, to reduce a size of the topology recognition model while ensuring the topology recognition model meets an accuracy requirement.

Abstract: The present invention discloses a rapid dot matrix micro-nano impact indentation testing system. The rapid dot matrix micro-nano impact indentation testing system comprises a three-dimensional electric positioning module, wherein the three-dimensional electric positioning module comprises an XY translation stage and a Z-axis lifting stage; a dot matrix impact indentation module, wherein the dot matrix impact indentation module comprises a three-degree-of-freedom piezoelectric platform arranged on the Z-axis lifting stage, one surface of the three-degree-of-freedom piezoelectric platform is provided with a piezoelectric ceramic actuator, and one end of the piezoelectric ceramic actuator is connected to an indenter; a clamp, wherein the clamp clamps a test piece, and the test piece faces the indenter; and an imaging module, wherein the imaging module comprises a microscope lens.

Abstract: The present disclosure discloses an optical module including a circuit board; a housing assembly including a light-receiving portion and a light-emitting cavity separated via a separation board and stacked one above the other, one side of the housing assembly adjacent to the circuit board being provided with a first notch through which one end of the circuit board is inserted into the housing assembly; a light-receiving assembly disposed in the light-receiving portion and electrically connected to an upper surface of the circuit board; and a light-emitting assembly disposed in the light-emitting cavity and electrically connected to a lower surface of the circuit board; a concave region is formed in the light-emitting cavity, and a laser assembly of the light-emitting assembly is arranged therein to lift the laser assembly to reduce height difference between wire bonding surface of the laser assembly and lower surface of the circuit board.

Abstract: In one aspect of the invention, the adjustable bed includes a headboard assembly having a headboard and an upper rail attached to the headboard; a footboard assembly having a footboard and a lower rail attached to the footboard; a pair of sideboard assemblies having a pair of sideboards and a pair of side rails respectively attached to the pair of sideboards, wherein the pair of sideboard assemblies is transversely spaced and longitudinally aligned in parallel, and detachably attached to the headboard assembly and the footboard assembly; and a lifting mechanism attached to the side rails of the pair of sideboard assemblies for operably adjusting the adjustable bed at a desired position.

Abstract: An adjustable bed includes a frame structure having a first frame, a second frame, and a pair of connection bars detachably connecting the first frame and the second frame to one another; a plurality of platforms disposed on the frame structure; and an adjustable assembly coupled with the frame structure for operably adjusting one or more of the plurality of platforms in desired positions.

Abstract: An adjustable bed includes a frame structure; an upper support bracket and a lower support bracket pivotally connected to the frame structure; a plurality of platforms disposed on the frame structure and supported by the upper support bracket and the lower support bracket without using hinging means; and an adjustable assembly coupled with the frame structure and the upper support bracket and the lower support bracket for operably adjusting one or more of the plurality of platforms in desired positions.

Abstract: An optical module includes a base, a first cover, a circuit board, a light emitting assembly and a light receiving assembly. Part of the circuit board is arranged on a surface of the base, and part thereof arranged outside the base. The light emitting assembly includes a plurality of light-emitting chips disposed on the base and an optical multiplexer disposed on the first cover and located in a laser exit direction of the plurality of light-emitting chips. The light receiving assembly includes an optical demultiplexer disposed on the first cover, a plurality of light-receiving chips disposed on the circuit board and are located in a laser exit direction of the optical demultiplexer, a reflection prism disposed at a side of the plurality of light-receiving chips away from the circuit board, and an optical receiving case covering the plurality of light-receiving chips and the reflection prism.

Abstract: Provided are a method and a device of multivariable time series processing. The method comprises obtaining a time series set comprising a plurality of first time series segments having a same length and being a multivariable time series; inputting the first time series segment into a graph neural network to predict a multivariable reference value corresponding to a first time point that is a next time point adjacent to a latest time point in the first time series segment; determining an optimization function based on multivariable reference values corresponding to a plurality of the first time points and corresponding multivariable series tags; determining values of respective parameters in the causal matrix with an objective of minimizing the optimization function; and determining, based on the values of the respective parameters in the causal matrix, a causal relationship between multiple variables in the multivariable time series.

Abstract: An optical module includes a base, a first cover, a circuit board, a light emitting assembly and a light receiving assembly. The light emitting assembly includes a plurality of light-emitting chips and an optical multiplexer. The plurality of light-emitting chips are disposed on the first bottom plate. The optical multiplexer is disposed on the first cover and is located in a laser exit direction of the plurality of light-emitting chips. The light receiving assembly includes an optical demultiplexer and a plurality of light-receiving chips. The optical demultiplexer is disposed on the first cover. The plurality of light-receiving chips are disposed on the circuit board and are located in a laser exit direction of the optical demultiplexer.

Abstract: An optical module includes a circuit board and an optical transmitter device. The optical transmitter device includes a substrate, a spacer disposed on and electrically connected to the circuit board, a laser chip disposed on and electrically connected to the spacer, an optical fiber adapter disposed on the substrate in a light exit direction of the laser chip, a focusing lens disposed between the laser chip and the optical fiber adapter, light incident surface of the optical fiber adapter has a first inclination angle with respect to an axis of the optical fiber adapter, the axis of the optical fiber adapter being located in a plane parallel to the substrate, the optical fiber adapter is obliquely disposed on the substrate such that an axis of the internal optical fiber has a second inclination angle with respect to optical axis of the focusing lens.

Abstract: The present application provides a photovoltaic profile, a photovoltaic roof tile module and a photovoltaic roof installation system. The photovoltaic profile comprises: a first frame, a second frame, a third frame and a fourth frame, the splicing corners of the frames are connected in sequence, and the splicing angle of the first splicing corner and the third splicing corner are both larger than the splicing angle of the second splicing corner and the fourth corners, and the first drainage channel and the second drainage channel are interconnecting to each other. The photovoltaic profiles, photovoltaic roof tile module and photovoltaic roof installation system of the present application can effectively drain rainwater through the interconnected drainage channels in the photovoltaic frame, avoiding rainwater damage to photovoltaic profiles and photovoltaic module, and improving the reliability of the overall waterproof performance of the roof.

Abstract: The present disclosure discloses an optical module including a circuit board; a housing assembly including a light-receiving portion and a light-emitting cavity separated via a separation board and stacked one above the other, one side of the housing assembly adjacent to the circuit board being provided with a first notch through which one end of the circuit board is inserted into the housing assembly; a light-receiving assembly disposed in the light-receiving portion and electrically connected to an upper surface of the circuit board; and a light-emitting assembly disposed in the light-emitting cavity and electrically connected to a lower surface of the circuit board; a concave region is formed in the light-emitting cavity, and a laser assembly of the light-emitting assembly is arranged therein to lift the laser assembly to reduce height difference between wire bonding surface of the laser assembly and lower surface of the circuit board.

Abstract: An optical module includes a shell, a circuit board, a light-receiving device and an optical fiber ribbon. The circuit board is located in the shell. The light-receiving device is disposed on the circuit board and is electrically connected to the circuit board. An end of the optical fiber ribbon is connected to the light-receiving device. The light-receiving device includes a light-receiving chip and a focusing lens. The light-receiving chip is disposed on a surface of the circuit board and has a photosensitive surface. The focusing lens is disposed opposite to the photosensitive surface of the light-receiving chip, and is configured to converge light transmitted by the optical fiber ribbon to the photosensitive surface of the light-receiving chip.

Abstract: The present disclosure discloses an optical module including: a circuit board; a housing assembly divided by a separation board into a first portion and a second portion that are stacked one above the other, wherein a light-emitting cavity is formed in the second portion, and a partition wall is provided in the first portion to separate the first portion into a light-receiving cavity and a slot, and is provided with a plurality of light-passing holes via which the light-receiving cavity is in communication with the slot; an optical fiber adapter disposed in the housing assembly and in communication with the light-receiving cavity; a light-emitting assembly arranged in the light emitting cavity and electrically connected to the circuit board, wherein heat generated by the light-emitting assembly is conducted to a surface of the housing assembly via the partition wall; and a light-receiving assembly.

Abstract: An optical module includes a shell, a circuit board and an optical transmitter device. The circuit board is disposed in the shell. The optical transmitter device is disposed in the shell, and includes a plate-shaped substrate and a laser assembly. The laser assembly is disposed on a surface of the substrate, is electrically connected to the circuit board, and is configured to emit an optical signal. The substrate is fixedly connected to an end of the circuit board.

Abstract: The present application provides a photovoltaic tile and sloped photovoltaic roof, the tile base comprises a base plate, a raising portion, a splicing area and a first connecting part, the base plate has a first surface and a second surface opposite to each other, the tile base has a first side and a second side opposite to each other, the splicing area is close to the second side, the raising portion is located on the second surface and extends along the first direction, and the raising portion has a first end and a second end opposite to each other along the first direction; photovoltaic component, comprising a photovoltaic panel and a second connecting part, wherein the photovoltaic panel is arranged on the raising portion and is detachable from the tile base through the cooperation between the first connecting part and the second connecting part, wherein the height of the second end of the raising portion relative to the second surface is the same as the thickness of the tile base at the first side.

Abstract: An optical sub-module includes a first casing, a second casing, an adhesive layer and an optical device. The first casing has a top wall and a first sidewall. The second casing has a bottom wall and a second sidewall. A height of the second sidewall in a thickness direction of the bottom wall is greater than a height of the first sidewall in a thickness direction of the top wall, and the second casing and the first casing is connected to form a chamber. The adhesive layer is disposed between a surface of the first sidewall and a surface of the second sidewall, and a coefficient of thermal expansion of the adhesive layer is greater than a coefficient of thermal expansion of the first casing and a coefficient of thermal expansion of the second casing. The optical device is disposed in the chamber and fixedly connected to the second casing.

Abstract: An optical module includes a circuit board, a light-emitting housing, a first optical fiber adapter, a first internal optical fiber, and an optical fiber connector. An end of the first internal optical fiber is connected to the first optical fiber adapter, and the optical fiber connector is optically connected to the light-emitting component and wraps another end of the first internal optical fiber. The first internal optical fiber and the optical fiber connector are transparent material members, and light transmittance of the two is different. The light-emitting housing includes a bottom wall and a concave groove. The optical fiber connector is disposed on the bottom wall, and a portion of the optical fiber connector is located above the concave groove. An orthogonal projection of the another end of the first internal optical fiber on the bottom wall is located in the concave groove.

Abstract: Provided are a PCR primer pair and an application thereof.