Abstract: The present provides a device for monitoring seeding and a method thereof, comprising a monitoring sensor and an algorithm control module, wherein the monitoring sensor comprises a first sensor-channel emitting end, a first sensor-channel receiving end, a second sensor-channel emitting end and a second sensor-channel receiving end, and are arranged, in a two-channel opposite-emission photoelectric induction mode, on two sides of a seed belt, respectively; and the algorithm control module is configured to perform counting of seeding, reseeding and missed seeding, monitoring of seed deficiency and seed blockage according to a duration time of a first low level and an interval time of two adjacent falling edges of signals of the two sensor-channels; further, to perform monitoring of a rotating speed of a motor according to an interval time of two adjacent falling edges of signals of the second sensor-channel.

Abstract: A device for monitoring seeding and a method thereof, including a monitoring sensor and an algorithm control module, wherein the monitoring sensor includes a first sensor-channel emitting end, a first sensor-channel receiving end, a second sensor-channel emitting end and a second sensor-channel receiving end, and are arranged, in a two-channel opposite-emission photoelectric induction mode, on two sides of a seed belt, respectively; and the algorithm control module is configured to perform counting of seeding, reseeding and missed seeding, monitoring of seed deficiency and seed blockage according to a duration time of a first low level and an interval time of two adjacent falling edges of signals of the two sensor-channels; further, to perform monitoring of a rotating speed of a motor according to an interval time of two adjacent falling edges of signals of the second sensor-channel.

Abstract: Various embodiments of the present disclosure relate to a leaf spring for coupling a heat sink to an integrated circuit, where the leaf spring includes a central portion that has an aperture, a first spring arm that is formed on a first side of the central portion and includes a first through-hole for a first fastener, and a second spring arm that is formed on a second side of the central portion and includes a second through-hole for a second fastener. In various embodiments, a first bending axis passes through the first side and is substantially perpendicular to a longitudinal axis of the leaf spring that passes through the first through-hole and the second through-hole, and a second bending axis passes through the second side and is substantially perpendicular to the longitudinal axis of the leaf spring.

Abstract: A leaf spring for coupling a heat sink to an integrated circuit includes a central portion that has an aperture; a first spring arm that is formed on a first side of the central portion and includes a first through-hole for a first fastener; a second spring arm that is formed on a second side of the central portion and includes a second through-hole for a second fastener; a first bending axis that passes through the first side and is substantially perpendicular to a longitudinal axis of the leaf spring that passes through the first through-hole and the second through-hole; and a second bending axis that passes through the second side and is substantially perpendicular to the longitudinal axis of the leaf spring.