Patents by Inventor Yifei DOU

Yifei DOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12129901
    Abstract: Various embodiments of the present disclosure relate to a leaf spring for coupling a heat sink to an integrated circuit, where the leaf spring includes a central portion that has an aperture, a first spring arm that is formed on a first side of the central portion and includes a first through-hole for a first fastener, and a second spring arm that is formed on a second side of the central portion and includes a second through-hole for a second fastener. In various embodiments, a first bending axis passes through the first side and is substantially perpendicular to a longitudinal axis of the leaf spring that passes through the first through-hole and the second through-hole, and a second bending axis passes through the second side and is substantially perpendicular to the longitudinal axis of the leaf spring.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: October 29, 2024
    Assignee: NVIDIA Corporation
    Inventors: Shenglei Wang, Qiang Chen, Yifei Dou, John Harold Drew
  • Publication number: 20240356766
    Abstract: The present disclosure provides an architecture of a cloud computing oriented high-performance blockchain including a cloud computing oriented blockchain network architecture and a cloud computing oriented blockchain system architecture; wherein the cloud computing oriented blockchain network architecture enables each blockchain node to be directly connected to an RDMA, and to bypass an operating system kernel and directly communicate with a network card in a high efficiency communication mode; and the cloud computing oriented blockchain system architecture includes a network layer, a consensus layer, and a blockchain layer. According to the present disclosure, network communication is implemented by the RDMA, and a block broadcasting speed is improved, and a block synchronization latency is shortened.
    Type: Application
    Filed: March 10, 2021
    Publication date: October 24, 2024
    Inventors: Dongxiao YU, Jinfeng DOU, Minghui XU, Shuo LIU, Yifei ZOU
  • Publication number: 20240019009
    Abstract: A leaf spring for coupling a heat sink to an integrated circuit includes a central portion that has an aperture; a first spring arm that is formed on a first side of the central portion and includes a first through-hole for a first fastener; a second spring arm that is formed on a second side of the central portion and includes a second through-hole for a second fastener; a first bending axis that passes through the first side and is substantially perpendicular to a longitudinal axis of the leaf spring that passes through the first through-hole and the second through-hole; and a second bending axis that passes through the second side and is substantially perpendicular to the longitudinal axis of the leaf spring.
    Type: Application
    Filed: April 20, 2021
    Publication date: January 18, 2024
    Inventors: Shenglei WANG, Qiang CHEN, Yifei DOU, John Harold DREW