Abstract: Disclosed is a method of manufacturing a semiconductor device. The method includes forming a patterned hardmask over an underlying target layer on a substrate; and performing plasma fabrication operations in parallel on the patterned hardmask and underlying target layer in a plasma etching chamber using a plasma etch gas and a selective source gas. The plasma operations include forming a protective cap on the patterned hardmask; and removing portions of the underlying layer that are not covered by the patterned hardmask. In various embodiments, the selective source gas includes a chemical compound that includes a halogen gas that can be dissociated into a metal and a halogen, and the plasma operations include dissociating the metal and the halogen in the selective source gas and forming a protective cap on the patterned hardmask using the metal that has been dissociated.

Abstract: A transformer includes a bobbin and a plurality of coils wound on the bobbin. The plurality of coils includes a first primary coil; a second primary coil, located above the first primary coil and electrically connected to the first primary coil; a secondary coil, located between the first primary coil and the second primary; a first auxiliary coil, located above the second primary coil; and a second auxiliary coil, located on the first auxiliary coil and electrically connected to the first auxiliary coil.

Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.

Abstract: A reference circuit for generating a reference current includes a plurality of resistive elements including at least one magnetic tunnel junction (MTJ). A control circuit is coupled to a first terminal of the at least one MTJ and is configured to selectively flow current through the at least one MTJ in the forward and inverse direction to generate a reference current.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a channel layer, a barrier layer, a compound semiconductor layer, a gate electrode, and a stack of dielectric layers. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The compound semiconductor layer is disposed on the barrier layer. The gate electrode is disposed on the compound semiconductor layer. The stack of dielectric layers is disposed on the gate electrode. The stack of dielectric layers includes layers having different etching rates.

Abstract: An optical fiber network device includes a fiber and a photonic integrated circuit. Fiber receives a first optical signal and transmits a second optical signal. A first wavelength of first optical signal is different from a second wavelength of second optical signal. Photonic integrated circuit includes a laser chip, a photodetector, a wavelength division multiplexing coupler, a first optical modulation element and a second optical modulation element. Laser chip is disposed on photonic integrated circuit, and is configured to generate first optical signal. Photodetector detects second optical signal. Wavelength division multiplexing coupler is configured to couple first optical signal to fiber, and receives second optical signal. First optical modulation element is coupled to wavelength division multiplexing coupler and laser chip, and is configured to modulate first optical signal.

Abstract: An optical fiber transmission device includes a substrate, a photonic integrated circuit, and an optical fiber assembly. The photonic integrated circuit is disposed on an area of the substrate. The substrate has a protruding structure at an interface with an edge of the photonic integrated circuit. The optical fiber assembly includes an optical fiber and a ferrule that sleeves the optical fiber. The protruding structure of the substrate is configured to abut against the ferrule to limit the position of the optical fiber assembly in a vertical direction of the substrate, such that the protruding structure is a stopper for the optical fiber assembly in the vertical direction.

Abstract: An exemplary backlight module includes a diffuser plate, a bottom plate facing the diffuser plate, lamps arranged between the diffuser plate and the bottom plate, and holders positioned between the diffuser plate and the bottom plate. Each holder includes a fixing part for holding the corresponding lamp, and two supporting parts extending from the fixing part. The supporting parts are configured for supporting the diffuser plate.

Abstract: An exemplary backlight module includes a diffuser plate, a bottom plate facing the diffuser plate, lamps arranged between the diffuser plate and the bottom plate, and holders positioned between the diffuser plate and the bottom plate. Each holder includes a fixing part for holding the corresponding lamp, and two supporting parts extending from the fixing part. The supporting parts are configured for supporting the diffuser plate.

Abstract: An exemplary backlight module includes a light guide plate, a light reflector, and a frame accommodating the light guide plate and the light reflector. The light reflector includes a main surface and a protruding portion provided at the main surface with the grounding portion configured for electrically connecting the lamp reflector with the frame. An exemplary liquid crystal display device using the backlight module is also provided.

Abstract: An exemplary backlight module (22) includes a light guide plate (23), a light source (27) adjacent to a lateral side of the light guide plate, a reflector (25) under the light guide plate, and an optical dot sheet (24) between the light guide plate and the reflector. The optical dot sheet includes a transparent film (241), and numerous optical diffusion dots (244) formed on a surface of the transparent film that is adjacent to the light guide plate.

Abstract: An exemplary backlight module (20) includes a bottom tray (280), a light guide plate (250), and a light source assembly (270). The bottom tray includes a bottom plate (281) and a pair of opposite holding arms (282) extending from the bottom plate. The light guide plate is provided on the bottom plate, and includes a light incident surface (252). The light source assembly includes a light source (271) located adjacent the light incident surface of the light guide plate and a reflective shell (272) accommodating the light source. The reflective shell includes two fixing arms (275) extending from two opposite ends thereof. The light source assembly is fixed to the bottom tray by engagement of the holding arms of the bottom tray and the fixing arms of the light source assembly.