Abstract: The invention provides a device that can be used to record the motion of a wafer and fine perturbations and vibrations in its motion during its progress through and between semiconductor process and inspection machines in the course of the actual manufacturing process or during a test cycle of the processing or inspection machine. It also provides a system and a method which uses this record mechanical malfunction of the processing or inspection machine which has caused, or could cause, defects in the manufactured wafer whether directly or indirectly.

Abstract: The invention provides a device that can be used to record the motion of a wafer and fine perturbations and vibrations in its motion during its progress through and between semiconductor process and inspection machines in the course of the actual manufacturing process or during a test cycle of the processing or inspection machine. It also provides a system and a method which uses this record mechanical malfunction of the processing or inspection machine which has caused, or could cause, defects in the manufactured wafer whether directly or indirectly.

Abstract: A magnetron sputtering apparatus and method for achieving via step coverage symmetry in a process for depositing a metal layer over a semiconductor substrate relies upon simultaneous rotational and lateral movements of the magnetron. When the magnetron is rotated and and moved laterally at the same time, the uniformity of the magnetic field across the target is improved significantly compared to prior art magnetron sputtering systems. Simultaneous rotational and lateral movements are achieved utilizing a planetary gear system.