Patents by Inventor Yi Gao Chen

Yi Gao Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device having wire bond and redistribution layer
    Patent number: 8058712
    Abstract: A semiconductor device comprises a copper redistribution line, a copper inductor and aluminum wire bond pads and the integration of the resulting device with an integrated circuit on a single chip, resulting in the decreased size of the chip.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: November 15, 2011
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Mitchell M. Hamamoto, Yi Gao Chen, Kim Hwee Tan