Abstract: An interconnect structure comprises a first dielectric layer, a first metal layer, a second dielectric layer, a metal via, and a second metal layer. The first dielectric layer is over a substrate. The first metal layer is over the first dielectric layer. The first metal layer comprises a first portion and a second portion spaced apart from the first portion. The second dielectric layer is over the first metal layer. The metal via has an upper portion in the second dielectric layer, a middle portion between the first and second portions of the first metal layer, and a lower portion in the first dielectric layer. The second metal layer is over the metal via. From a top view the second metal layer comprises a metal line having longitudinal sides respectively set back from opposite sides of the first portion of the first metal layer.

Abstract: Disclosed herein is a composite superhydrophobic material comprising: a substrate layer comprising a set of positively or negatively charged functional groups; a metal nanoparticle coating on top of the substrate layer, comprising a set of negatively or positively charged functional groups; a metal layer on top of the metal nanoparticle coating; and a first superhydrophobic layer on top of the metal layer. Also disclosed herein is a method of making said material, and a method of predicting increased risk of spontaneous miscarriage using said material.