Patents by Inventor Yih Hong Lee

Yih Hong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220216165
    Abstract: An interconnect structure comprises a first dielectric layer, a first metal layer, a second dielectric layer, a metal via, and a second metal layer. The first dielectric layer is over a substrate. The first metal layer is over the first dielectric layer. The first metal layer comprises a first portion and a second portion spaced apart from the first portion. The second dielectric layer is over the first metal layer. The metal via has an upper portion in the second dielectric layer, a middle portion between the first and second portions of the first metal layer, and a lower portion in the first dielectric layer. The second metal layer is over the metal via. From a top view the second metal layer comprises a metal line having longitudinal sides respectively set back from opposite sides of the first portion of the first metal layer.
    Type: Application
    Filed: March 28, 2022
    Publication date: July 7, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jian-Hong LIN, Kuo-Yen LIU, Hsin-Chun CHANG, Tzu-Li LEE, Yu-Ching LEE, Yih-Ching WANG
  • Publication number: 20210053317
    Abstract: Disclosed herein is a composite superhydrophobic material comprising: a substrate layer comprising a set of positively or negatively charged functional groups; a metal nanoparticle coating on top of the substrate layer, comprising a set of negatively or positively charged functional groups; a metal layer on top of the metal nanoparticle coating; and a first superhydrophobic layer on top of the metal layer. Also disclosed herein is a method of making said material, and a method of predicting increased risk of spontaneous miscarriage using said material.
    Type: Application
    Filed: January 15, 2019
    Publication date: February 25, 2021
    Applicant: Nanyang Technological University
    Inventors: Xing Yi Ling, Yih Hong Lee, Nguan Soon Tan, Xuemei Han, Hiang Kwee Lee, Ya-Chuan Kao