Patents by Inventor Yih-Jen D. Chen

Yih-Jen D. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9530439
    Abstract: A head gimbal assembly for a disk drive includes a flexure tail terminal region having flexure bond pads in electrical communication with the head. Each of the flexure bond pads includes a widened region of a corresponding one of a plurality of electrical traces in a conductive layer, and a discontinuous bond pad backing island in a structural layer that overlaps the widened region. The flexure tail terminal region also includes a plurality of discontinuous edge stiffener islands in the structural layer that do not overlap the widened region of any flexure bond pad, and that are disposed no more than 50 microns from one of the two opposing longitudinal outer edges of the flexure tail terminal region. At least one of the plurality of discontinuous bond pad backing islands is disposed no more than 50 microns from one of the two opposing longitudinal outer edges.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: December 27, 2016
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Yih-Jen D. Chen, Tzong-Shii Pan
  • Publication number: 20160300590
    Abstract: A method of manufacturing a microactuator. The method includes providing a sheet of a piezoelectric material having an electrically conductive layer on at least one side of the sheet. The method includes cutting the sheet to form a plurality of piezoelectric elements. Each of the piezoelectric elements includes a first element side with an electrically conductive layer. Each first element side includes a peripheral portion and an exposed portion interior to the peripheral portion. The method includes forming an encapsulation layer over the peripheral portion and not over the exposed portion of at least one of the sides. The encapsulation layer comprises a material of lesser electrical conductivity than the electrically conductive layer. An apparatus for manufacturing the microactuators may also be provided that includes a first fixture and first and second alignment combs.
    Type: Application
    Filed: June 15, 2016
    Publication date: October 13, 2016
    Inventors: YIH-JEN D. CHEN, ROBERT J. McNab
  • Patent number: 9379311
    Abstract: An apparatus for peripherally encapsulating a plurality of piezoelectric elements includes a first fixture with a fixture base and a plurality of protrusions extending from the fixture base. Each protrusion includes a distal support surface that is approximately the same size as an exposed portion of a first side of each of the plurality of piezoelectric elements. The apparatus includes first and second alignment combs, each including a plurality of tines that are spaced to position each of the plurality of piezoelectric elements there between. The tines of the second alignment comb are oriented approximately orthogonally relative to the tines of the first alignment comb.
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: June 28, 2016
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yih-Jen D. Chen, Robert J. McNab
  • Publication number: 20160012834
    Abstract: A head gimbal assembly for a disk drive includes a flexure tail terminal region having flexure bond pads in electrical communication with the head. Each of the flexure bond pads includes a widened region of a corresponding one of a plurality of electrical traces in a conductive layer, and a discontinuous bond pad backing island in a structural layer that overlaps the widened region. The flexure tail terminal region also includes a plurality of discontinuous edge stiffener islands in the structural layer that do not overlap the widened region of any flexure bond pad, and that are disposed no more than 50 microns from one of the two opposing longitudinal outer edges of the flexure tail terminal region. At least one of the plurality of discontinuous bond pad backing islands is disposed no more than 50 microns from one of the two opposing longitudinal outer edges.
    Type: Application
    Filed: September 21, 2015
    Publication date: January 14, 2016
    Inventors: YIH-JEN D. CHEN, TZONG-SHII PAN
  • Patent number: 9165580
    Abstract: A head gimbal assembly for a disk drive includes a flexure tail terminal region having flexure bond pads in electrical communication with the head. Each of the flexure bond pads includes a widened region of a corresponding one of a plurality of electrical traces in a conductive layer, and a discontinuous bond pad backing island in a structural layer that overlaps the widened region. The flexure tail terminal region also includes a plurality of discontinuous edge stiffener islands in the structural layer that do not overlap the widened region of any flexure bond pad, and that are disposed no more than 50 microns from one of the two opposing longitudinal outer edges of the flexure tail terminal region. At least one of the plurality of discontinuous bond pad backing islands is disposed no more than 50 microns from one of the two opposing longitudinal outer edges.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: October 20, 2015
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yih-Jen D. Chen, Tzong-Shii Pan
  • Publication number: 20150162034
    Abstract: A head gimbal assembly for a disk drive includes a flexure tail terminal region having flexure bond pads in electrical communication with the head. Each of the flexure bond pads includes a widened region of a corresponding one of a plurality of electrical traces in a conductive layer, and a discontinuous bond pad backing island in a structural layer that overlaps the widened region. The flexure tail terminal region also includes a plurality of discontinuous edge stiffener islands in the structural layer that do not overlap the widened region of any flexure bond pad, and that are disposed no more than 50 microns from one of the two opposing longitudinal outer edges of the flexure tail terminal region. At least one of the plurality of discontinuous bond pad backing islands is disposed no more than 50 microns from one of the two opposing longitudinal outer edges.
    Type: Application
    Filed: March 13, 2014
    Publication date: June 11, 2015
    Applicant: Western Digital Technologies, Inc.
    Inventors: YIH-JEN D. CHEN, TZONG-SHII PAN
  • Patent number: 8982513
    Abstract: A disk drive head gimbal assembly includes a laminated flexure with a tongue having an actuated portion that rotates about an axis of rotation by expansion of a first adhered piezoelectric element relative to a second adhered piezoelectric element. A non-actuated portion of the tongue adjoins and forms a bridge between two outrigger beams, with a dimple contact location that is in contact with a dimple of the load beam and through which the axis of rotation passes. A read head is adhered, closer to its leading end than to its trailing end, to the actuated portion of the tongue. Each of the first and second piezoelectric elements has an anchored end that is adhered to the bridge, closer to the trailing end of the read head, and an opposing actuated end adhered to the actuated portion of the tongue, closer to the leading end of the read head.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: March 17, 2015
    Assignee: Western Digital Technologies, Inc.
    Inventors: Jifang Tian, Jian Yang, Qiang Yang, William S. Wang, Yih-Jen D. Chen
  • Patent number: 8976491
    Abstract: A head suspension assembly for a disk drive includes a load beam extending from a load beam supported end to a load beam distal end, and a laminated flexure supported by the load beam. The laminated flexure includes a structural layer having a head mounting tongue, a conductive layer having a plurality of patterned traces, and a dielectric layer between the structural layer and the conductive layer. The structural layer of the laminated flexure includes a distal limiter that has a first limiter arm and a second limiter arm adjoining at a distal apex. The distal apex is disposed closer to the load beam distal end than is the head mounting tongue. Each of the first and second limiter arms splits into a plurality of branches.
    Type: Grant
    Filed: June 14, 2013
    Date of Patent: March 10, 2015
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yih-Jen D. Chen, Kia Moh Teo
  • Patent number: 8797691
    Abstract: A disk drive head gimbal assembly includes a laminated flexure with a tongue having an actuated portion that rotates about an axis of rotation by expansion of an adhered piezoelectric element. A non-actuated portion of the tongue adjoins and forms a bridge between two outrigger beams, with a dimple contact location that is in contact with a dimple of the load beam and through which the axis of rotation passes. The piezoelectric element has an anchored end that is adhered to the non-actuated portion of the tongue, and an opposing actuated end adhered to the actuated portion. The actuated portion of the tongue includes first and second head mounting plates that are each adhered to the read head. Each of the head mounting plates is connected to the non-actuated portion of the tongue by an elongated compliant member that is oriented radially with respect to the dimple contact location.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: August 5, 2014
    Assignee: Western Digital Technologies, Inc.
    Inventors: Jifang Tian, Jian Yang, Qiang Yang, William S. Wang, Yih-Jen D. Chen
  • Patent number: 8780504
    Abstract: A head suspension assembly for a disk drive includes a load beam, and first and second piezoelectric elements that are disposed within first and second piezoelectric element receiving windows in a mounting plate, respectively. The load beam includes a plurality of rails that includes first and second outer rails and first and second inner rails, each of the plurality of rails being oriented in the longitudinal direction and being formed or bent out of the load beam plane. The first and second inner rails are disposed between the first and second piezoelectric elements, and the first and second outer rails are disposed not between the first and second piezoelectric elements. The first piezoelectric element is disposed between the first outer rail and the first inner rail, and the second piezoelectric element is disposed between the second inner rail and the second outer rail.
    Type: Grant
    Filed: June 14, 2013
    Date of Patent: July 15, 2014
    Assignee: Western Digital Technologies, Inc.
    Inventors: Kia Moh Teo, Yih-Jen D. Chen, Tzong-Shii Pan, Wing C. Shum, Yanning Liu
  • Patent number: 8756776
    Abstract: A method of manufacturing a microactuator. The method includes providing a sheet of a piezoelectric material having an electrically conductive layer on at least one side of the sheet. The method includes cutting the sheet to form a plurality of piezoelectric elements. Each of the piezoelectric elements includes a first element side with an electrically conductive layer. Each first element side includes a peripheral portion and an exposed portion interior to the peripheral portion. The method includes forming an encapsulation layer over the peripheral portion and not over the exposed portion of at least one of the sides. The encapsulation layer comprises a material of lesser electrical conductivity than the electrically conductive layer. An apparatus for manufacturing the microactuators may also be provided that includes a first fixture and first and second alignment combs.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: June 24, 2014
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yih-Jen D. Chen, Robert J. McNab
  • Patent number: 8760812
    Abstract: A head stack assembly (HSA) for a disk drive includes a flexible printed circuit (FPC). The FPC includes a plurality of electrically conductive FPC traces, each leading to a respective one of a plurality of FPC bond pads. The HSA also includes a head gimbal assembly (HGA) having a laminated flexure with a plurality of electrically conductive flexure bond pads that are bonded to the plurality of FPC bond pads. The laminated flexure includes a flexure tail having an overlap region that overlaps the FPC. A structural layer of the laminated flexure includes a jumper in the overlap region. The jumper is electrically connected to at least two of the plurality of flexure electrical traces in the flexure conductive layer. The jumper is disposed at least 50 microns from any of the plurality of FPC electrical traces or FPC bond pads.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: June 24, 2014
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yih-Jen D. Chen, Tzong-Shii Pan, Yanning Liu
  • Patent number: 8665566
    Abstract: A method of assembling a head stack assembly of a magnetic storage drive is provided. The method includes attaching a flexible printed circuit (FPC) with a suspension tail of a head gimbal assembly, wherein the suspension tail includes a plurality of discrete segments positioned within a bonding area and other portions of a structural layer outside of the bonding area, and pressing tail bond pads of the suspension tail against corresponding ones of FPC bond pads of the FPC by bringing a single flat surface of a thermode in contact with each of the discrete segments.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: March 4, 2014
    Assignee: Western Digital Technologies, Inc.
    Inventors: Tzong-Shii Pan, Yih-Jen D. Chen
  • Patent number: 8276256
    Abstract: A method of assembling a head stack assembly (HSA) includes securing a flex cable to an actuator including an actuator arm having a side slot with a slot end. A first head gimbal assembly (HGA) is attached to the actuator arm. The first HGA includes a first laminated flexure having a first flexure tail with a first raised region that includes an out-of-plane bend. The first raised region is squeezed while inserting the first flexure tail partially within the side slot with the first raised region adjacent the slot end. The first raised region is allowed to expand into contact with the side slot adjacent the slot end. The first flexure tail is electrically connected to the flex cable.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: October 2, 2012
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yiduo Zhang, Tzong-Shii Pan, Yih-Jen D. Chen
  • Patent number: 8274760
    Abstract: Disclosed herein are embodiments directed to a head gimbal assembly including a novel suspension assembly that includes a flexure tail with a first plurality of apertures in its structural layer. Each of the first plurality of apertures underlies a first trace but not a second trace. Each of a second plurality of apertures in the structural layer underlies a second trace but not the first trace. Each of the first plurality of apertures includes a corresponding region of maximum width, and each of the second plurality of apertures includes a corresponding region of maximum width, as measured in the width direction. None of the corresponding regions of maximum width of the first plurality of apertures is disposed in an overlapping position along the long axis as any of the corresponding regions of maximum width of the second plurality of apertures.
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: September 25, 2012
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yiduo Zhang, Tzong-Shii Pan, Yih-Jen D. Chen, William D. Huber
  • Patent number: 8194354
    Abstract: A novel suspension assembly includes a flexure tail with a first plurality of apertures in its structural layer. Each of the first plurality of apertures underlies a first trace but not a second trace. Each of a second plurality of apertures in the structural layer underlies a second trace but not the first trace. Each of the first plurality of apertures includes a corresponding region of maximum width, and each of the second plurality of apertures includes a corresponding region of maximum width, as measured in the width direction. None of the corresponding regions of maximum width of the first plurality of apertures is disposed in an overlapping position along the long axis as any of the corresponding regions of maximum width of the second plurality of apertures.
    Type: Grant
    Filed: May 23, 2008
    Date of Patent: June 5, 2012
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yiduo Zhang, Tzong-Shii Pan, Yih-Jen D. Chen, William D. Huber
  • Patent number: 8064168
    Abstract: A novel head stack assembly (HSA), and method for HSA assembly, are disclosed and claimed. A first flexure tail has a long axis approximately parallel to a side of the actuator arm. The actuator arm includes a slot in the side having a slot end. The first flexure tail is disposed partially within the slot. The first flexure tail includes a first raised region in contact with the slot adjacent the slot end. The first raised region includes an out-of-plane bend with cross-sectional curvature along the long axis. The first raised region may be squeezed while inserting the first flexure tail partially within the side slot, with the first raised region adjacent the slot end, and then allowed to expand into contact with the slot adjacent the slot end.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: November 22, 2011
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yiduo Zhang, Tzong-Shii Pan, Yih-Jen D. Chen
  • Patent number: 7898770
    Abstract: A disk drive suspension assembly includes a load beam, a first hinge arm, a second hinge arm, a base plate, and a flexure that includes a head mounting surface. The base plate has a first base plate layer that includes a first base plate side and an opposing second base plate side. The first base plate side has a main base plate surface and a recessed base plate surface parallel to and offset from the main base plate surface. A first hinge arm is attached to the main base plate surface. A second hinge arm is attached to the recessed base plate surface. The first and second hinge arms are attached to the load beam. The base plate has a first thickness at the main base plate surface and a second thickness at the recessed base plate surface that is the same as the first thickness.
    Type: Grant
    Filed: May 18, 2010
    Date of Patent: March 1, 2011
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yiduo Zhang, Yih-Jen D. Chen, Martin J. McCaslin, Tzong-Shii Pan, Drew B. Lawson
  • Patent number: 6977790
    Abstract: An actuator arm assembly has an actuator arm and an actuator for moving the actuator arm whereby the arm assembly experiences vibrations. The actuator has a body with a recess formed therein, and a strain sensor is fitted essentially inside the recess such that the sensor generates signals correlated to the vibrations. This arrangement produces a high gain boost from the strain based sensor, making an amplifier circuit unnecessary. The sensor signals are used to damp the vibrations.
    Type: Grant
    Filed: May 3, 2002
    Date of Patent: December 20, 2005
    Assignee: Maxtor Corporation
    Inventors: Yih-Jen D. Chen, David M. Tung, Lin Guo, Wei Guo, Bill Wang
  • Patent number: 6967800
    Abstract: A disk drive suspension assembly. The suspension assembly includes a load beam and a base plate with a longitudinal axis. The base plate includes an actuator arm and an opposing actuator arm end. The head gimbal end is disposed in mechanical communication with the load beam for distally supporting the load beam. The head gimbal end defines opposing first and second distal corners. The base plate includes first and second mass reduction openings formed through the base plate symmetrically about the longitudinal axis at the head gimbal end for locally reducing mass to mitigate torsional vibration mode frequency about the longitudinal axis. The first mass reduction opening is disposed at the head gimbal end between the first distal corner and the longitudinal axis. The second mass reduction opening is disposed at the head gimbal end between the second distal corner and the longitudinal axis.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: November 22, 2005
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yih-Jen D. Chen, Gwo-Jeng Lo