Abstract: A heat dissipating device is used to be sandwiched between a motherboard and a chassis for transferring heat from the motherboard to the chassis. The heat dissipating device includes a body for contacting with a bottom side of the motherboard, and a plurality of wings extending from the body. Each wing includes a connecting section extending from the body and a contacting section extending further from the connecting section for contacting with the chassis. The body engages with the bottom side of the motherboard at a position corresponding to that a heat-generating electronic component is mounted to a top side of the motherboard. Heat generated by the electronic component is transferred to the chassis through the motherboard and the heat dissipating device. The heat dissipating device is formed by stamping a metal sheet with high heat conductivity.

Abstract: A locking device for mounting a heat sink (50) to a heat generating component surrounded by a retention module (60). The locking device includes a first locking member (10), a second locking member (20) and an operating member (30). The first locking member secures a first side of the heat sink with a first side of the retention module. The second locking member is disposed at a second side of the heat sink opposing to the first side. The operating member is pivotably attached to the second locking member and is capable of acting upon the heat sink to drive the second locking member moving from a released position to a locked position. The operating member has a cam (31) and a free end. At the locked position, the cam downwardly depresses the heat sink and upwardly pulls the second locking member, and the free end locks at the retention module.

Abstract: A light-emitting diode (LED) assembly and a method for fabrication thereof are disclosed. The LED assembly includes a heat-absorbing member in which a working fluid is provided, an LED die (60) directly attached to the heat-absorbing member, and a heat-dissipating member thermally attached to the heat-absorbing member. The heat-absorbing member absorbs heat via the working fluid from the LED die and transfers the heat to the heat-dissipating member for dissipation. The method involves directly attaching the LED die to the heat-absorbing member.

Abstract: A heat dissipating device is used to be sandwiched between a motherboard and a chassis for transferring heat from the motherboard to the chassis. The heat dissipating device includes a body for contacting with a bottom side of the motherboard, and a plurality of wings extending from the body. Each wing includes a connecting section extending from the body and a contacting section extending further from the connecting section for contacting with the chassis. The body engages with the bottom side of the motherboard at a position corresponding to that a heat-generating electronic component is mounted to a top side of the motherboard. Heat generated by the electronic component is transferred to the chassis through the motherboard and the heat dissipating device. The heat dissipating device is formed by stamping a metal sheet with high heat conductivity.

Abstract: A locking device for mounting a heat sink (50) to a heat generating component surrounded by a retention module (60). The locking device includes a first locking member (10), a second locking member (20) and an operating member (30). The first locking member secures a first side of the heat sink with a first side of the retention module. The second locking member is disposed at a second side of the heat sink opposing to the first side. The operating member is pivotably attached to the second locking member and is capable of acting upon the heat sink to drive the second locking member moving from a released position to a locked position. The operating member has a cam (31) and a free end. At the locked position, the cam downwardly depresses the heat sink and upwardly pulls the second locking member, and the free end locks at the retention module.