Abstract: A method for manufacturing micro pressure sensors and the structure of the micro pressure sensor are disclosed. A bulk silicon wafer is provided to have an upper face formed thereon a desired circuit arrangement including a plurality of contact pads. The bulk silicon wafer defines a cutoff in an upper side portion thereof. A glass substrate is then provided to have an upper face defined therein a shallow cavity. The glass substrate has a plurality of contact pads formed on the upper face thereof. The bulk silicon wafer is bonded to the glass substrate in such a manner that the upper face of the bulk silicon wafer is attached to the upper face of the glass substrate and the plurality of contact pads on the bulk silicon wafer securely attach to the plurality of contact pads on the glass substrate. An etching process is undertaken to reduce the bulk silicon wafer down to a thin membrane. Finally the bulk silicon wafer is etched to expose the contact pads on said glass substrate.

Abstract: A digital tire gauge adapted to be electrically connected to a power supply for measuring a pressure of a fluid in a tire includes, a transducing oscillator mounted in a gauge housing for transducing an imposed pressure of said fluid into a signal of a periodic sequence of cycles, and including a pressure sensor having at least one resistor having a resistance thereof which changes with imposed pressure, a capacitor electrically connected to the pressure sensor for forming therewith an oscillating circuit; and a plurality of inverters electrically connected to the capacitor and pressure sensor to provide a gain for the transducing oscillator, an isolating inverter electrically connected to the transducing oscillator, and functioning as a buffer for impedance matching of the transducing oscillator, a processor electrically connected to the buffer for generating a numerical value in response to a signal from said buffer, a display electrically connected to the processor for displaying a digital reading in accor