Abstract: A test cell conditioner (TCC) surrogate cleaning device for cleaning the pin elements in a socket or electrical interface receptacle of a load board includes a main testing frame, a plurality of trays, testing chip receptacles and one or more pick up devices. Chips to be tested (electronic elements) are entrained on a tray, and a plurality of adhesive cleaning chips are entrained on another tray. The adhesive cleaning chip contains a solid layer and an adhesive layer, and an abrasive material is mingled in the adhesive layer. The pick up device removes the adhesive cleaning chip to a position above the testing chip receptacle and cleans up the oxides and other foreign materials sticking on the receptacle by absorption or abrasion. Interrupting the operation of the apparatus to clean the test probe by etching can be excluded so as to improve the working efficiency.

Abstract: A system for testing integrated circuits by testing the change of integrated circuits under various temperatures comprises: at least one two-dimensional matrix testing module which includes a testing section having arrays for plugging integrated circuits to be tested, a heating section corresponding with the above testing section for heating integrated circuits respectively; a computer mainframe for connecting said two-dimensional matrix testing module and controlling the whole operations of the testing system, and a database. With the above-described structure, said database and said two-dimensional matrix testing module can be connected with the computer mainframe such that the temperature control information can be transmitted to provide each heater of said heating section to generate a suitable temperature, heat the integrated circuit to be tested, and store the test information.

Abstract: A system for testing integrated circuits by testing the change of integrated circuits under various temperatures comprises: at least one two-dimensional matrix testing module which includes a testing section having arrays for plugging integrated circuits to be tested, a heating section corresponding with the above testing section for heating integrated circuits respectively; a computer mainframe for connecting said two-dimensional matrix testing module and controlling the whole operations of the testing system, and a database. With the above-described structure, said database and said two-dimensional matrix testing module can be connected with the computer mainframe such that the temperature control information can be transmitted to provide each heater of said heating section to generate a suitable temperature, heat the integrated circuit to be tested, and store the test information.