Patents by Inventor Yih-Rern Peng

Yih-Rern Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION AND PREPREG, LAMINATE AND CIRCUIT BOARD THEREOF
    Publication number: 20130075136
    Abstract: A resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 25 parts by weight of nitrogen and oxygen containing heterocyclic compound; (C) 5 to 75 parts by weight of polyphenylene oxide resin; and (D) 5 to 100 parts by weight of oligomer of phenylmethane maleimide. By using specific components at specific proportions, the resin composition of the invention offers the features of low dielectric constant and low dissipation factor and can be made into prepreg that may be used in printed circuit board.
    Type: Application
    Filed: September 22, 2011
    Publication date: March 28, 2013
    Inventors: Li-Chih YU, Tse-An LEE, Jen-Chun WANG, Yu-Te LIN, Yih-Rern PENG
  • Resin composition and prepreg, laminate and circuit board thereof
    Patent number: 8404764
    Abstract: A resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 25 parts by weight of nitrogen and oxygen containing heterocyclic compound; (C) 5 to 75 parts by weight of polyphenylene oxide resin; and (D) 5 to 100 parts by weight of oligomer of phenylmethane maleimide. By using specific components at specific proportions, the resin composition of the invention offers the features of low dielectric constant and low dissipation factor and can be made into prepreg that may be used in printed circuit board.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: March 26, 2013
    Assignee: Elite Material Co., Ltd.
    Inventors: Li-Chih Yu, Tse-An Lee, Jen-Chun Wang, Yu-Te Lin, Yih-Rern Peng