Abstract: A system for displaying images is disclosed. A display panel comprises a first substrate and a second substrate with a liquid crystal layer interposed therebetween. A sealant is interposed between the first substrate and a second substrate for sealing the liquid crystal layer. A dielectric layer is overlying the first substrate. Metal lines are overlying the dielectric layer under and/or near the sealant. A planarization layer covers and contacts the dielectric layer and the metal lines to form a first interface between the metal lines and the planarization layer and a second interface between the dielectric layer and the planarization layer. Bridge lines without contacting the planarization layer are disposed under and/or near the sealant, instead of at least a portion of the metal lines contacting the planarization layer.

Abstract: A system for displaying images is disclosed. A display panel comprises a first substrate and a second substrate with a liquid crystal layer interposed therebetween. A sealant is interposed between the first substrate and a second substrate for sealing the liquid crystal layer. A dielectric layer is overlying the first substrate. Metal lines are overlying the dielectric layer under and/or near the sealant. A planarization layer covers and contacts the dielectric layer and the metal lines to form a first interface between the metal lines and the planarization layer and a second interface between the dielectric layer and the planarization layer. Bridge lines without contacting the planarization layer are disposed under and/or near the sealant, instead of at least a portion of the metal lines contacting the planarization layer.

Abstract: A manufacturing method of monolithic integrated thermal bubble inkjet print heads and the structure for the same. The method utilizes semiconductor manufacturing technologies to configure various elements in a thermal bubble inkjet print head, such as ink channels, an ink slot, an energy transducer, an orifice plate, on a single substrate. The ink channels are formed on an top surface of the substrate using the anisotropic etching technique. The ink slot is formed on a back surface of the substrate using the anisotropic etching technique. The energy transducer and the orifice plate are formed in order above the ink channels using the coating and etching techniques. This thermal bubble inkjet print head manufacturing method is particularly useful in the all batch process without employing the steps of precision alignment joint for the orifice plate in a conventional inkjet print head. Therefore, the method can greatly increase production efficiency and lower production costs.

Abstract: A manufacturing method of monolithic integrated thermal bubble inkjet print heads and the structure for the same. The method utilizes semiconductor manufacturing technologies to configure various elements in a thermal bubble inkjet print head, such as ink channels, an ink slot, an energy transducer, an orifice plate, on a single substrate. The ink channels are formed on an top surface of the substrate using the anisotropic etching technique. The ink slot is formed on a back surface of the substrate using the anisotropic etching technique. The energy transducer and the orifice plate are formed in order above the ink channels using the coating and etching techniques. This thermal bubble inkjet print head manufacturing method is particularly useful in the all batch process without employing the steps of precision alignment joint for the orifice plate in a conventional inkjet print head. Therefore, the method can greatly increase production efficiency and lower production costs.