Patents by Inventor Yih-Wen Shiao

Yih-Wen Shiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Temperature probe with improved structure integrity and operation reliability over high temperature and voltage
    Patent number: 6568849
    Abstract: The present invention discloses a temperature probe. The temperature probe includes a temperature-sensing chip contained in a ceramic holder. The temperature probe further includes a pair of high-temperature sustainable conductive lines connected to the temperature-sensing chip. The temperature probe further includes an electrical insulation layer wrapping over the ceramic holder and high-temperature sustainable conductive lines.
    Type: Grant
    Filed: April 7, 2000
    Date of Patent: May 27, 2003
    Assignee: Cyntec Company
    Inventors: Shih-Chang Chen, Yih-Wen Shiao
  • Leadframe resistance device and process for the same
    Publication number: 20030090360
    Abstract: A leadframe resistance structure comprises: at least a resistance foil; a plurality of leads, each of the plurality of leads respectively having a first lead surface and an opposite second lead surface, wherein the resistance foil is disposed on the first lead surface of the leads and connected to the leads; and an encapsulating material that encapsulates the resistance foil, and a portion of the first surface of the leads.
    Type: Application
    Filed: November 13, 2001
    Publication date: May 15, 2003
    Inventors: Steven Liu, Horng-Yih Juang, Yih-Wen Shiao, Cheng-Er Fan
  • Leadframe resistance device and process for the same
    Publication number: 20030090361
    Abstract: A leadframe resistance structure comprises: at least a resistance foil; a plurality of leads, each of the plurality of leads respectively having a first lead surface and an opposite second lead surface, wherein the resistance foil is disposed on the first lead surface of the leads and connected to the leads; and an encapsulating material that encapsulates the resistance foil, and a portion of the first surface of the leads.
    Type: Application
    Filed: August 27, 2002
    Publication date: May 15, 2003
    Inventors: Steven Liu, Horng-Yih Juang, Yih-Wen Shiao, Cheng-Er Fan