Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.

Abstract: A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.

Abstract: Provided are a light guiding element (100), a light guiding device (500), and a lighting module (800). The light guiding element (100) includes a light incident portion (1) and a light exit portion (2), where the light incident portion (1) includes a plurality of light guiding columns (11), each of which includes a first end surface (A) connected to the light exit portion (2), a second end surface (B) facing away from the light exit portion, and a side surface formed between the first end surface (A) and the second end surface (B), where the first end surface (A) has an area larger than that of the second end surface (B). Also provided are a light guiding device (500) including the light guiding element (100), and a lighting module (800) including the light guiding device (500). The light guiding element (100) enables, for a generated light type pattern, the shape to be complete, the color to be even, and the phenomena of vignette effect and dark lines to be reduced.

Abstract: Provided are a light guiding element (100), a light guiding device (500), and a lighting module (800). The light guiding element (100) includes a light incident portion (1) and a light exit portion (2), where the light incident portion (1) includes a plurality of light guiding columns (11), each of which includes a first end surface (A) connected to the light exit portion (2), a second end surface (B) facing away from the light exit portion, and a side surface formed between the first end surface (A) and the second end surface (B), where the first end surface (A) has an area larger than that of the second end surface (B). Also provided are a light guiding device (500) including the light guiding element (100), and a lighting module (800) including the light guiding device (500). The light guiding element (100) enables, for a generated light type pattern, the shape to be complete, the color to be even, and the phenomena of vignette effect and dark lines to be reduced.

Abstract: The present invention provides a light emitting apparatus and a lighting module, comprising: a circuit substrate, a plurality of optical sources and an optical element; the optical element comprises a translucent element and an interference element; the plurality of light sources are arranged on the circuit substrate for lighting the optical element; the optical element is arranged above the plurality of light sources; and the interference element is arranged on the translucent element, which is used to make light emitted from each of the light sources offset interference in a first polarization direction, enhance interference in a second polarization direction, and emit through the translucent element. The light emitting apparatus and the lighting module of the present invention are employed to provide a more diversified optical pattern to the user and improve the user experience.

Abstract: The invention provides a light emitting sensing device and a manufacturing method thereof. The light emitting sensing device comprises: a non-translucent substrate having a first surface with at least one recess formed on the first surface; a light emitting element disposed in the at least one recess; a light sensing element disposed on the first surface; a first transparent material disposed in the at least one recess and covering the light emitting element; and a second transparent material disposed on the first surface and covering the light sensing element. The light emitting sensing device provided in this embodiment solves the problem in the prior art, the infrared light emitted by the light emitting chip irradiates into the sensing chip and causes the sensing chip to be interfered by the light of the light emitting chip resulting in reduced sensing accuracy.

Abstract: The present invention provides a light emitting apparatus and a lighting module, comprising: a circuit substrate, a plurality of optical sources and an optical element; the optical element comprises a translucent element and an interference element; the plurality of light sources are arranged on the circuit substrate for lighting the optical element; the optical element is arranged above the plurality of light sources; and the interference element is arranged on the translucent element, which is used to make light emitted from each of the light sources offset interference in a first polarization direction, enhance interference in a second polarization direction, and emit through the translucent element. The light emitting apparatus and the lighting module of the present invention are employed to provide a more diversified optical pattern to the user and improve the user experience.