Abstract: A robot controlling method includes following operations. A depth image is obtained by the depth camera. A processing circuit receives the depth image and obtains an obstacle parameter of an obstacle and a tool parameter of a tool according to the depth image. The tool is set on the end of a robot. The processing circuit obtains a distance vector between the end and the obstacle parameter. The processing circuit obtains a first endpoint vector and a second endpoint vector between the tool parameter and the obstacle parameter. The processing circuit establishes a virtual torque according to the distance vector, the first endpoint vector, and the second endpoint vector. The processing circuit outputs control signal to the robot according to the tool parameter, the obstacle parameter and the virtual torque to drive the robot to move or rotate the tool to a target.

Abstract: A robot controlling method includes following operations. A depth image is obtained by the depth camera. A processing circuit receives the depth image and obtains an obstacle parameter of an obstacle and a tool parameter of a tool according to the depth image. The tool is set on the end of a robot. The processing circuit obtains a distance vector between the end and the obstacle parameter. The processing circuit obtains a first endpoint vector and a second endpoint vector between the tool parameter and the obstacle parameter. The processing circuit establishes a virtual torque according to the distance vector, the first endpoint vector, and the second endpoint vector. The processing circuit outputs control signal to the robot according to the tool parameter, the obstacle parameter and the virtual torque to drive the robot to move or rotate the tool to a target.

Abstract: The invention is proposed to efficiently dispatch wafers into tools, and particularly to provide a real-time and automatic way to dispatch wafers. In addition, a method for dispatching wafers, a system for dispatching wafers into tools and a system for processing numerous lots by number of tools with automatic dispatch are present as examples. One main characteristic of the invention is that each pending wafer is given an individual priority before it is processed by any tool and the priority is automatically calculated in accordance with to a ranking algorithm. Another main characteristic of the invention is that whenever a tool is available to process at least one pending wafer, part of pending wafers is automatically assigned to the available tool in accordance with an assignment algorithm and a required limitation database that is provided by the dispatcher.