Patents by Inventor Yi-Jia Chen

Yi-Jia Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10190235
    Abstract: A method for forming a wafer supporting structure comprises growing a single crystal using a floating zone crystal growth process, forming a silicon ingot having an oxygen concentration equal to or less than 1 parts-per-million-atomic (ppma), slicing a wafer from the silicon ingot, cutting portions of the wafer to form a supporting structure through a mechanical lathe and applying a high temperature anneal process to the supporting structure.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: January 29, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: An-Li Ho, Chi-En Huang, Yi Jia Chen, Pu-Fang Chen, Cary Chia-Chung Lo
  • Publication number: 20140349466
    Abstract: A method for forming a wafer supporting structure comprises growing a single crystal using a floating zone crystal growth process, forming a silicon ingot having an oxygen concentration equal to or less than 1 parts-per-million-atomic (ppma), slicing a wafer from the silicon ingot, cutting portions of the wafer to form a supporting structure through a mechanical lathe and applying a high temperature anneal process to the supporting structure.
    Type: Application
    Filed: May 24, 2013
    Publication date: November 27, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: An-Li Ho, Chi-En Huang, Yi Jia Chen, Pu-Fang Chen, Cary Chia-Chung Lo
  • Patent number: 7927415
    Abstract: The present invention relates to a starch adhesive mixed with zeolite powder to provide suitable absorption function for corrugated cardboards, and a method for making the adhesive. The adhesive comprises: corn starch as main ingredient, zeolite powder suitably mixed with said corn starch, water, and additives like caustic soda and borax. The corn starch is mixed with zeolite powder in an amount of zeolite powder being 20˜33% of the total weight of corn starch and the zeolite powder, and said adhesive is prepared and adjusted to have a lower gelation temperature. The present invention solves the problem that the initial adhesive strength of adhesive would decrease because of addition of the zeolite powder to the adhesive and would make the drying time longer and then deteriorating the initial adhesive strength. The present invention will make it more efficient and predictable for the mass production of the zeolite starch corrugated cardboards.
    Type: Grant
    Filed: April 27, 2009
    Date of Patent: April 19, 2011
    Assignee: Taiwan Magnetic Innovation Technology, Inc.
    Inventors: Yi-Jia Chen, Jui-Min Wang, Yi-Chen Tsai
  • Publication number: 20100032092
    Abstract: The present invention relates to a starch adhesive mixed with zeolite powder to provide suitable absorption function for corrugated cardboards, and a method for making the adhesive. The adhesive comprises: corn starch as main ingredient, zeolite powder suitably mixed with said corn starch, water, and additives like caustic soda and borax. The corn starch is mixed with zeolite powder in an amount of zeolite powder being 20˜33% of the total weight of corn starch and the zeolite powder, and said adhesive is prepared and adjusted to have a lower gelation temperature. The present invention solves the problem that the initial adhesive strength of adhesive would decrease because of addition of the zeolite powder to the adhesive and would make the drying time longer and then deteriorating the initial adhesive strength. The present invention will make it more efficient and predictable for the mass production of the zeolite starch corrugated cardboards.
    Type: Application
    Filed: April 27, 2009
    Publication date: February 11, 2010
    Inventors: Yi-Jia Chen, Jui-Min Wang, Yi-Chen Tsai