Patents by Inventor Yijia DING

Yijia DING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240095159
    Abstract: A method for assessing test adequacy of deep neural networks based on element decomposition is provided. The network testing is divided into black box testing and white box testing, of which key elements are decomposed and defined. Network parameters including a weight matrix and a bias vector are extracted. Importance values of neurons in individual layers of the deep neural network are calculated and clustered, and an importance value hot map of neurons in each layer is generated based on clustering results. Mutation testing, and index calculation and evaluation are performed.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 21, 2024
    Inventors: Yinxiao MIAO, Yifei LIU, Ping YANG, Xiujian ZHANG, Zhonghao CHENG, Long ZHANG, Tianqi WAN, Haoyi CHEN, Jing SUN, Yijia DING
  • Publication number: 20230292462
    Abstract: Disclosed are a heat sink base and a heat sink. The heat sink base includes a base body. The bottom of the base body is provided with at least one protruded structure, and the bottom of the base body abuts against the top of the CPU. Each of the at least one protruded structure includes a gentle region with a protrusion, and a slope region surrounding the protruded gentle region with the protrusion. The gentle region of the protruded structure abuts against a high heat flux region at the top of the CPU, thus forming a region with relatively high pressure and relatively stable pressure compared with the slope region. Therefore, the heat sink base provided by the present invention has a simple and reasonable structure, and can efficiently dissipate the heat generated by the CPU, thus improving the cooling efficiency and obtaining more stable and more consistent cooling performance.
    Type: Application
    Filed: March 16, 2023
    Publication date: September 14, 2023
    Applicant: BEIJING DEEPCOOL INDUSTRIES CO., LTD.
    Inventors: Dangsheng ZHAO, Yan LI, Yaojia LOU, Heng LI, Edward XIA, Yijia DING, Lucas LU