Patents by Inventor Yi-Jie Liao

Yi-Jie Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984261
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: May 14, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi-Chuan Teng, Yi Heng Tsai, You-Ru Lin, Yen-Wen Chen, Fu-Chun Huang, Fan Hu, Ching-Hui Lin, Yan-Jie Liao
  • Patent number: 10397717
    Abstract: The present invention provides an acoustic diaphragm including: a cone and a surround mounted around the cone; wherein an amorphous titanium-zirconium film is formed on a cone substrate, a surround substrate, or both of the substrates. The present invention also provides a speaker containing the acoustic diaphragm.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: August 27, 2019
    Assignee: Ming Chi University of Technology
    Inventors: Jyh-Wei Lee, Jen-Chun Chang, Yi-Jie Liao
  • Publication number: 20180343532
    Abstract: The present invention provides an acoustic diaphragm including: a cone and a surround mounted around the cone; wherein an amorphous titanium-zirconium film is formed on a cone substrate, a surround substrate, or both of the substrates. The present invention also provides a speaker containing the acoustic diaphragm.
    Type: Application
    Filed: May 24, 2018
    Publication date: November 29, 2018
    Inventors: Jyh-Wei LEE, Jen-Chun CHANG, Yi-Jie LIAO
  • Patent number: 8878985
    Abstract: Embodiments of this invention provide a flash module and an image-capturing apparatus having the flash module. The flash module includes a flash, a base, a solenoid, a linkage bar, a hook, a first elastic member, and a second elastic member. When necessary, the elements of the flash module perform a process to automatically move the flash to an open position.
    Type: Grant
    Filed: July 13, 2011
    Date of Patent: November 4, 2014
    Assignee: Ability Enterprise Co., Ltd.
    Inventors: Wei-Pong Lin, Yi-Jie Liao, Ting-Cheng Lin
  • Publication number: 20120182465
    Abstract: Embodiments of this invention provide a flash module and an image-capturing apparatus having the flash module. The flash module includes a flash, a base, a solenoid, a linkage bar, a hook, a first elastic member, and a second elastic member. When necessary, the elements of the flash module perform a process to automatically move the flash to an open position.
    Type: Application
    Filed: July 13, 2011
    Publication date: July 19, 2012
    Applicant: ABILITY ENTERPRISE CO., LTD.
    Inventors: Wei-Pong Lin, Yi-Jie Liao, Ting-Cheng Lin