Abstract: In the BB transfer, or so called electrochemical delamination process, a transfer film is firstly spray-coated on a stack formed by two graphene sandwiching a metal (Cu or Cr) foil as a protection layer. Then, direct current (dc) voltage is applied to the first stack as a cathode and an anode (from be a platinum wire, a carbon rod, or others) in an electrolyte aqueous solution. With application of the electrolysis potential, hydrogen bubbles appear at the graphene/metal foil interfaces, while oxygen bubble appear at the anode due to the reduction of water. These H2 bubbles provide a gentle but persistent force to detach the graphene film from the copper foil at its edges, and the process is aided by the permeation of the electrolyte solution into the interlayers as the edges delaminate.

Abstract: Aspects of the invention are directed to a container comprising a tub, a basket, and a lid. The tub is adapted to hold a liquid and comprises a bottom and a tub sidewall having an upper rim defining an opening in the tub. The basket is disposed on the bottom of the tub and comprises a base and a basket sidewall. The base defines a perimeter, and the basket sidewall runs along at least a portion of this perimeter. The lid contacts the upper rim and comprises a filler piece. The filler piece occupies a volume inside the tub between the base and a plane defined by the upper rim. The container is adapted to hold a sensitive film stack without damage or degradation to the film stack. The container is further adapted to facilitate the easy transfer of the film stack to a new substrate.

Abstract: Aspects of the invention are directed to a method of forming a thin film adhered to a target substrate. The method comprises the steps of: (i) forming the thin film on a deposition substrate; (ii) depositing a support layer on the thin film; (iii) removing the deposition substrate without substantially removing the thin film and the support layer; (iv) drying the thin film and the support layer while the thin film is only adhered to the support layer; (v) placing the dried thin film and the dried support layer on the target substrate such that the thin film adheres to the target substrate; and (vi) removing the support layer without substantially removing the thin film and the target substrate.