Abstract: A pickup apparatus for separating a semiconductor die adhered on an adhesive film therefrom includes a frame, an UV light emitting element, and a collector element. The frame is configurated to hold the adhesive film adhered with the semiconductor die thereon. The UV light emitting element is disposed inside the frame, where the adhesive film is disposed between the semiconductor die and the UV light emitting element. The collector element is disposed over the frame.

Abstract: A pickup apparatus for separating a semiconductor die adhered on an adhesive film therefrom includes a frame, an UV light emitting element, and a collector element. The frame is configurated to hold the adhesive film adhered with the semiconductor die thereon. The UV light emitting element is disposed inside the frame, where the adhesive film is disposed between the semiconductor die and the UV light emitting element. The collector element is disposed over the frame.

Abstract: A display device includes a multiple of light-emitting elements and a multiple of driving circuits. Each of the multiple of driving circuits is configured to generate a driving current flowing through one of the multiple of light-emitting elements. Each of the multiple of driving circuits includes a first transistor, a second transistor, a reset circuit, a first control circuit and a second control circuit. The driving current flows from a first system high voltage terminal through the first transistor, the second transistor and one of the multiple of light-emitting elements to a system low voltage terminal. The first control circuit is configured to control the first transistor to modulate pulse amplitude of the driving current. The second control circuit is configured to control the second transistor to modulate pulse width of the driving current.

Abstract: A display device and a bezel thereof are provided. The display device includes a display panel and a bezel. The display panel has a first surface and a second surface. The first surface includes at least one pixel pad section, and the second surface includes at least one circuit pad section. The bezel includes a first surface connecting portion, a second surface connecting portion and at least one conductive wire. The edge of the display panel having the pixel pad section and the circuit pad section is accommodated between the first surface connecting portion and the second surface connecting portion. Each conductive wire has a first end and a second end. The first end is disposed on the first surface connecting portion and the second end is disposed on the second surface connecting portion. The part of the first connecting portion having the first end corresponds to the pixel pad section, and the part of the second connecting portion having the second end corresponds to the circuit pad section.

Abstract: A semiconductor device includes a first semiconductor die and a second semiconductor die connected to the first semiconductor die. Each of the first semiconductor die and the second semiconductor die includes a substrate, a conductive bump formed on the substrate and a conductive contact formed on the conductive bump. The conductive contact has an outer lateral sidewall, there is an inner acute angle included between the outer lateral sidewall and the substrate is smaller than 85°, and the conductive contact of the first semiconductor die is connected opposite to the conductive contact of the second semiconductor die.

Abstract: In an embodiment, a device bonding apparatus is provided. The device bonding apparatus includes a first process station configured to receive a wafer; a first bond head configured to carry a die to the wafer, wherein the first bonding head includes a first rigid body and a vacuum channel in the first rigid body for providing an attaching force for carrying the die to the wafer; and a second bond head configured to press the die against the wafer, the second bond head including a second rigid body and an elastic head disposed over the second rigid body for pressing the die, the elastic head having a center portion and an edge portion surrounding the center portion, the center portion of the elastic head having a first thickness, the edge portion of the elastic head having a second thickness, the second thickness being greater than the second thickness.

Abstract: A method for forming a semiconductor device is provided. The method includes providing a wafer with multiple semiconductor dies on the adhesive film held by the frame element. The method also includes lifting a semiconductor die up from the wafer using an ejector element. The method includes picking up the semiconductor die with a collector element. The method further includes flip-chipping the semiconductor die with the collector element, and picking up the semiconductor die from the collector element using a bond-head element. In addition, the method includes measuring the warpage of the semiconductor die on the bond-head element using a sensor, then bonding the semiconductor die to a carrier using the bond-head element.

Abstract: Integrated circuit package structures and methods of forming integrated circuit package structures are discussed. An integrated circuit package structure, in accordance with some embodiments, includes an integrated circuit package substrate with a heterogeneous bonding scheme that includes conductive pillars for bonding semiconductor devices to as well as a region including conductive connectors embedded in a dielectric for bonding additional semiconductor devices.

Abstract: A display device includes a multiple of light-emitting elements and a multiple of driving circuits. Each of the multiple of driving circuits is configured to generate a driving current flowing through one of the multiple of light-emitting elements. Each of the multiple of driving circuits includes a first transistor, a second transistor, a reset circuit, a first control circuit and a second control circuit. The driving current flows from a first system high voltage terminal through the first transistor, the second transistor and one of the multiple of light-emitting elements to a system low voltage terminal. The first control circuit is configured to control the first transistor to modulate pulse amplitude of the driving current. The second control circuit is configured to control the second transistor to modulate pulse width of the driving current.

Abstract: A package structure includes an optical die, an optical die, a supporting structure, and a lens structure. The optical die includes a photonic region. The optical die is disposed on and electrically coupled to the optical die. The supporting structure is disposed on the optical die, where the electric die is disposed between the supporting structure and the optical die. The lens structure is disposed on the supporting structure and optically coupled to the photonic region of the optical die, where the supporting structure is disposed between the lens structure and the electric die.

Abstract: A flip-chip bonding method includes following operations. A wafer is provided with multiple semiconductor dies on an adhesive film held by a frame element. A semiconductor die is lifted up from the wafer by an ejector element. The semiconductor die is picked up with a collector element. The semiconductor die is flip-chipped with the collector element. An alignment check is performed to determine a position of the semiconductor die, so as to determine a process tolerance between a center of the collector element and a center of the semiconductor die. The semiconductor die with the collector element is transferred to a location underneath a bonder element based on the process tolerance of the alignment check. The semiconductor die is picked up from the collector element by the bonder element. The semiconductor die is bonded to a carrier by the bonder element.

Abstract: A display device includes a multiple of light-emitting elements and a multiple of driving circuits. Each of the multiple of driving circuits is configured to generate a driving current to illuminate one of the multiple of light-emitting elements. Each of the multiple of driving circuits includes a first transistor, a second transistor, a reset circuit, a first control circuit and a second control circuit. The driving current flows from a first system high voltage terminal through the first transistor, the second transistor and one of the multiple of light-emitting elements to a system low voltage terminal. The first control circuit is configured to control the first transistor to modulate pulse amplitude of the driving current. The second control circuit is configured to control the second transistor to modulate pulse width of the driving current.

Abstract: A semiconductor package includes a first integrated circuit, a plurality of first through vias and a plurality of fin-shaped through vias. The first through vias surround the first integrated circuit. The fin-shaped through vias are physically connected to the first through vias respectively, wherein the first through vias are disposed between the first integrated circuit and the fin-shaped through vias.

Abstract: A pixel driving device includes at least one data line and at least one driver integrated circuit. The at least one data line includes a first area and a second area on both sides. The first area and the second area are separated by the at least one data line. The at least one driver integrated circuit includes a first circuit and a second circuit. The first circuit is disposed in the first area, is configured to receive at least one first high-frequency signal so as to at least one first driving signal. The second circuit is disposed in the second area, is coupled to the first circuit and is configured to receive at least one low-frequency signal.

Abstract: A display device includes a substrate and pixels. The substrate has an intermediate region and a peripheral region. Each of the pixels includes sub-pixels. Each of the sub-pixels includes a pad group and a light emitting diode (LED) element. The pad group has a first pad and a second pad. The LED element is electrically connected to the first pad and the second pad. The pixels include standard pixels disposed in the intermediate region and peripheral pixels disposed in the peripheral region. The first pads and the second pads of the pad groups of the sub-pixels of each of the standard pixels are arranged in a first direction. The peripheral pixels include a first peripheral pixel. The first pads and the second pads of the pad groups of the sub-pixels of the first peripheral pixel are arranged in a second direction, and the first direction crosses over the second direction.

Abstract: A driving circuit includes a light-emitting element, a first transistor, a second transistor, a third transistor, a fourth transistor, a first capacitor and a regulator circuit. The first transistor, the second transistor and the light-emitting element are coupled in series between a first system voltage terminal and a second system voltage terminal. A first terminal of the first transistor is coupled to the first system voltage terminal. The third transistor is electrically coupled between a gate terminal and a second terminal of the first transistor. The fourth transistor is electrically coupled between the gate terminal of the first transistor and the second system voltage terminal. A first terminal of the first capacitor is electrically coupled to the gate terminal of the first transistor. A regulator circuit is electrically coupled to a second terminal of the first capacitor.

Abstract: A display apparatus includes a substrate and pixels disposed on the substrate. Each of the pixels includes sub-pixels. The substrate has an intermediate region and a peripheral region, where the peripheral region is located between an edge of the substrate and the intermediate region. The pixels include standard pixels disposed in the intermediate region and peripheral pixels disposed in the peripheral region. A color displayed by a sub-pixel of a standard pixel and a color displayed by a sub-pixel of a peripheral pixel are the same, and a distance between a second transistor of the sub-pixel of the standard pixel and a pad of the sub-pixel of the standard pixel is not equal to a distance between a second transistor of the sub-pixel of the peripheral pixel and a pad of the sub-pixel of the peripheral pixel.

Abstract: A pixel array substrate includes a base, pixel structures, first bonding pads, first wirings, and a first testing element. The pixel structures are disposed on an active area of a first surface of the base. The first bonding pads are disposed on a peripheral region of the first surface. Each of the first wirings is disposed on a corresponding first bonding pad, a first sidewall of the base, and a corresponding second bonding pad. The first testing element is disposed on the active area of the first surface and has a first testing line. The first testing line is electrically connected to at least one of the first bonding pads, and an end of the first testing line is substantially aligned with an edge of the base.

Abstract: A pickup apparatus for separating a semiconductor die adhered on an adhesive film therefrom includes a frame, an UV light emitting element, and a collector element. The frame is configurated to hold the adhesive film adhered with the semiconductor die thereon. The UV light emitting element is disposed inside the frame, where the adhesive film is disposed between the semiconductor die and the UV light emitting element. The collector element is disposed over the frame.

Abstract: A display device includes a plurality of transparent voltage-dividing common electrodes and a plurality of pixel units. The transparent voltage-dividing common electrodes are electrically isolated from each other in a first direction. Each of the pixel units includes a first pixel electrode, a second pixel electrode, and a voltage-dividing switch. The first pixel electrode is configured to receive a data voltage. The second pixel electrode is configured to receive the data voltage. The voltage-dividing switch is configured to divide the data voltage on the second pixel electrode to one of the transparent voltage-dividing common electrodes.