Patents by Inventor Yik Chiu SZE

Yik Chiu SZE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal superconductive finned heat sink and electrical equipment cabinet
    Patent number: 10980149
    Abstract: The present disclosure provides a thermal superconductive finned heat sink and an electrical equipment cabinet. The thermal superconductive finned heat sink includes: a base plate; a plurality of thermal superconductive fins inserted into the surface of the base plate; the thermal superconductive fin has a composite plate structure, a thermal superconductive channel line is formed in the thermal superconductive fin, the thermal superconductive channel line is a closed channel line, and is filled with heat-transfer working medium; the thermal superconductive fin has a U-shaped plate structure, including a flat plate main body and sides which bend relative to the flat plate main body; the projection area of the plurality of thermal superconductive fins, onto the plane where the base plate is located, is greater than the area of the base plate.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: April 13, 2021
    Assignee: Karhe Technology Co., Ltd.
    Inventors: Aixing Tong, Yik Chiu Sze, Qihong Luo
  • Thermal Superconductive Finned Heat Sink and Electrical Equipment Cabinet
    Publication number: 20200037470
    Abstract: The present disclosure provides a thermal superconductive finned heat sink and an electrical equipment cabinet. The thermal superconductive finned heat sink includes: a base plate; a plurality of thermal superconductive fins inserted into the surface of the base plate; the thermal superconductive fin has a composite plate structure, a thermal superconductive channel line is formed in the thermal superconductive fin, the thermal superconductive channel line is a closed channel line, and is filled with heat-transfer working medium; the thermal superconductive fin has a U-shaped plate structure, including a flat plate main body and sides which bend relative to the flat plate main body; the projection area of the plurality of thermal superconductive fins, onto the plane where the base plate is located, is greater than the area of the base plate.
    Type: Application
    Filed: July 31, 2017
    Publication date: January 30, 2020
    Applicant: Karhe Technology Co., Ltd.
    Inventors: Aixing TONG, Yik Chiu SZE, Qihong LUO