Patents by Inventor Yik Loong Leong

Yik Loong Leong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130170936
    Abstract: Various embodiments of methods and devices are provided for a self-aligning pick and place collet having proximal and distal ends configured for use with a tape and reel machine. A suction area is located at a distal end of the collet. A pick and place collet contact area is located adjacent to and outwardly from the suction area, and comprises tapered sidewalls that depend downwardly and outwardly away from the outer periphery of the suction area. The tapered sidewalls and the outer periphery of the suction area are configured and dimensioned to cause an electronic device to substantially self-align and center itself with respect to the collet when engaged thereby.
    Type: Application
    Filed: January 3, 2012
    Publication date: July 4, 2013
    Applicant: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
    Inventors: Hong Sia Tan, Chee Mang Wong, Yik Loong Leong
  • Publication number: 20130168553
    Abstract: Various embodiments of methods and devices are provided for a thermally-sensitive optocoupler package. A layer in the optocoupler package has an upper surface and a lower surface, and comprises a thermally-sensitive material. In the package, an LED emits infrared or near-infrared light and a photodetector receives at least a portion of such emitted light and in response provides isolated output signals therefrom. The LED is located above the upper surface, and the photodetector is located beneath the lower surface. The thermally-sensitive material is configured such that an amount of light emitted by the LED, incident on the material and the layer, and transmitted through the material and the layer, changes in accordance with changes in ambient temperature or local thermal conditions.
    Type: Application
    Filed: January 18, 2012
    Publication date: July 4, 2013
    Applicant: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
    Inventors: Chee Mang Wong, Yik Loong Leong, Stephanie Febianty Lie