Patents by Inventor Yi-Liang Chen
Yi-Liang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250198948Abstract: A processing system capable of automatically monitoring surface features on an object, which is adapted to process a processing surface of the object, and the processing surface has at least one 3D feature marker. The processing system includes an image capturing device, a computing device, and a surface processing apparatus. The image capturing device is adapted to capture images of the processing surface. The computing device generates a 3D image data corresponding to the processing surface based on the images, and the 3D image data includes at least one marker label corresponding to the at least one 3D feature marker. The surface processing apparatus performs surface processing to the processing surface according to the 3D image data. The processing method conducted by using the processing system is provided herewith.Type: ApplicationFiled: February 16, 2023Publication date: June 19, 2025Applicant: GLORY STEEL ENTERPRISE CO., LTD.Inventors: YI-LIANG CHEN, PAO-HSIN WANG
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Publication number: 20250170794Abstract: A method of manufacturing a multicolor shoe material includes the following steps. Step S1: blank molds are provided, and a mold chamber of each of the blank molds is injected by one of the foamed materials in different colors to form unfoamed semi-finished products in different colors. Step S2: the semi-finished products are put into a foaming mold, when the foaming mold is preheated and completely closed, a ratio of a total volume of the semi-finished products to a volume of the mold chamber of the foaming mold is ranged between 0.96 and 1.04. Thus, the semi-finished products could be evenly foamed. After foaming, adjacent two of the semi-finished products could be connected by heat fusion to obtain the multicolor shoe material. Additionally, a semi-finished product and a multicolor shoe material are provided in the present invention.Type: ApplicationFiled: January 17, 2025Publication date: May 29, 2025Applicant: GLORY STEEL ENTERPRISE CO., LTD.Inventors: YI-LIANG CHEN, PAO-HSIN WANG
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Patent number: 12266484Abstract: A force-sensitive key module and a force-sensitive switch structure are provided. The force-sensitive switch structure includes a first protective layer, a second protective layer, a first conductive layer, a second conductive layer and a force-sensitive layer. The first protective layer receives a pressing force. The second conductive layer is aligned with the first conductive layer. The force-sensitive layer is installed on the first conductive layer or the second conductive layer. When the first protective layer receives the pressing force, an electric connection between the first conductive layer and the second conductive layer is established, and the force-sensitive layer generates an analog sensing signal in response to the pressing force. When a magnitude of the pressing force is changed, the analog sensing signal is correspondingly changed according to an impedance change of the force-sensitive layer.Type: GrantFiled: February 22, 2023Date of Patent: April 1, 2025Assignee: Primax Electronics Ltd.Inventors: Che-An Li, Yi-Liang Chen, Lei-Lung Tsai
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Publication number: 20250081333Abstract: Disclosed are an electronic device and a manufacturing method thereof. The electronic device includes a circuit structure and at least one contacting part. The at least one contacting part is disposed on the circuit structure, and includes an insulating part and a conductive layer. The conductive layer surrounds the insulating part, and the conductive layer is electrically connected to the circuit structure. The electronic device disclosed herein may have a buffering effect or reduce damage to an object to be detected.Type: ApplicationFiled: August 5, 2024Publication date: March 6, 2025Applicant: Innolux CorporationInventors: Chin-Lung Ting, Kuang-Ming Fan, Yi-Liang Chen, Lung-Shu Huang
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Patent number: 12240194Abstract: A method of manufacturing a multicolor shoe material includes the following steps. Step S1: blank molds are provided, and a mold chamber of each of the blank molds is injected by one of the foamed materials in different colors to form unfoamed semi-finished products in different colors. Step S2: the semi-finished products are put into a foaming mold, when the foaming mold is preheated and completely closed, a ratio of a total volume of the semi-finished products to a volume of the mold chamber of the foaming mold is ranged between 0.96 and 1.04. Thus, the semi-finished products could be evenly foamed. After foaming, adjacent two of the semi-finished products could be connected by heat fusion to obtain the multicolor shoe material. Additionally, a semi-finished product and a multicolor shoe material are provided in the present invention.Type: GrantFiled: April 13, 2022Date of Patent: March 4, 2025Assignee: GLORY STEEL ENTERPRISE CO., LTD.Inventors: Yi-Liang Chen, Pao-Hsin Wang
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Publication number: 20250071470Abstract: A structure includes a sound-generating element, a first combining member, a plurality of second vibration membranes, a plurality of spacing portions, a vibration space, and a sound-absorbing element. Based on the structure, the arrangement of the first and second vibration membranes can enhance musicality of low frequencies of the sound-generating element and can also ensure the clearness of middle and high frequencies to allow most of the hearing impaired to clearly hear, and this, together with the arrangement of a combination curvature and spacing portions, makes the transmission path of sound waves wider and also makes the sound more transmittable, while the sound-absorbing element provides dual functions of noise reduction and supporting to the second vibration membranes.Type: ApplicationFiled: November 15, 2023Publication date: February 27, 2025Inventor: YI-LIANG CHEN
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Publication number: 20240310926Abstract: A composite function keyboard circuit includes a first matrix circuit, a first bias resistor group, a second matrix circuit, a second bias resistor group and a controller. Each switch unit in the first matrix circuit is an ink-type force sensing switch. A resistance of the ink-type force sensing switch is variable according to a pressing mode of a keypress action. An electrical connection path is formed between the ink-type force sensing switch and the corresponding bias resistor of the second bias resistor group. When the ink-type force sensing switch is electrically conducted, a divided sensing voltage is generated by the electrical connection path, and the controller generates a corresponding key control instruction according to a level of the divided sensing voltage. Furthermore, the cooperation of the first matrix circuit and the first bias resistor group can achieve a ghost key preventing function.Type: ApplicationFiled: May 4, 2023Publication date: September 19, 2024Inventors: Yi-Liang Chen, Chih-Chen Chang, Chien-Ming Li
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Publication number: 20240177949Abstract: A force-sensitive key module and a force-sensitive switch structure are provided. The force-sensitive switch structure includes a first protective layer, a second protective layer, a first conductive layer, a second conductive layer and a force-sensitive layer. The first protective layer receives a pressing force. The second conductive layer is aligned with the first conductive layer. The force-sensitive layer is installed on the first conductive layer or the second conductive layer. When the first protective layer receives the pressing force, an electric connection between the first conductive layer and the second conductive layer is established, and the force-sensitive layer generates an analog sensing signal in response to the pressing force. When a magnitude of the pressing force is changed, the analog sensing signal is correspondingly changed according to an impedance change of the force-sensitive layer.Type: ApplicationFiled: February 22, 2023Publication date: May 30, 2024Inventors: Che-An Li, Yi-Liang Chen, Lei-Lung Tsai
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Publication number: 20240113731Abstract: A ghost key preventing circuit includes plural driving lines, plural sensing lines, plural key switches, plural bias resistors and a controller. The plural driving lines and the plural sensing lines are collaboratively formed as a matrix circuit. The plural key switches are included in the matrix circuit. The plural bias resistors are connected with the corresponding sensing lines. When the key switch of a specified switch circuit is turned on, a divided voltage is generated and outputted from the specified switch circuit. The controller judges whether the key switch of the specified switch circuit is normally turned on or the key switch is a ghost key according to the divided voltage.Type: ApplicationFiled: January 5, 2023Publication date: April 4, 2024Inventors: Chih-Chen Chang, Yi-Liang Chen, Yu-Ting Lo
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Publication number: 20230189924Abstract: A method of manufacturing the foamed shoe material and semi-finished product including the following steps. Step S1: a foamable material is injected into a cavity of a blank mold to solidify, thereby generating a semi-finished product of the shoe material and a runner waste that are unfoamed. The runner waste could be shed for reusing directly as the foamable material without a granulating process. Step S2: the semi-finished product is cooled down and put into a cavity of the foaming mold, and the semi-finished product is evenly foamed in the cavity of the foaming mold to obtain a shoe material wherein the waste generated during the method of manufacturing the foamed shoe material could be effectively reused, and the yield rate of the shoe material thereby enhanced.Type: ApplicationFiled: April 28, 2022Publication date: June 22, 2023Inventors: Yi-Liang Chen, Pao-Ling Wang
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Publication number: 20230191735Abstract: A method of manufacturing a multicolor shoe material includes the following steps. Step S1: blank molds are provided, and a mold chamber of each of the blank molds is injected by one of the foamed materials in different colors to form unfoamed semi-finished products in different colors. Step S2: the semi-finished products are put into a foaming mold, when the foaming mold is preheated and completely closed, a ratio of a total volume of the semi-finished products to a volume of the mold chamber of the foaming mold is ranged between 0.96 and 1.04. Thus, the semi-finished products could be evenly foamed. After foaming, adjacent two of the semi-finished products could be connected by heat fusion to obtain the multicolor shoe material. Additionally, a semi-finished product and a multicolor shoe material are provided in the present invention.Type: ApplicationFiled: April 13, 2022Publication date: June 22, 2023Inventors: Yi-Liang Chen, Pao-Ling Wang
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Patent number: 10361036Abstract: The instant disclosure provides a capacitor package structure including a capacitor unit, a first enclosing layer and a second enclosing layer. The capacitor unit includes a capacitor, a first conductive pin and a second conductive pin. The first enclosing layer encloses the entire capacitor, a part of the first conductive pin and a part of the second conductive pin. The second enclosing layer encloses the entire first enclosing layer, a part of the first conductive pin and a part of the second conductive pin. One of the first enclosing layer and the second enclosing layer is a package gel formed by a package material, and another one of the first enclosing layer and the second enclosing layer is a moisture and air resistant film formed by a moisture and air resistant material.Type: GrantFiled: November 27, 2017Date of Patent: July 23, 2019Assignee: APAQ TECHNOLOGY CO., LTD.Inventors: Shang-Che Lan, Yi-Liang Chen, Ming-Tsung Chen
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Patent number: 10236395Abstract: A manufacturing method of antireflection substrate structure includes: providing a silicon wafer having a first rough surface; forming an antireflection optical film on the silicon wafer, wherein the antireflection optical film conformally overlays the first rough surface; performing a surface treatment on the antireflection optical film so that the antireflection optical film has a hydrophilic surface, and the hydrophilic surface is relatively far away from the silicon wafer; dropping a colloidal solution on the hydrophilic surface of the antireflection optical film, wherein the colloidal solution includes a solution and multiple nano-balls and the nano-balls are adhered onto the hydrophilic surface; and performing an etching process on the hydrophilic surface of the antireflection optical film by taking the nano-balls as an etching mask so as to form a second rough surface, wherein the roughness of the second rough surface is different from the roughness of the first rough surface.Type: GrantFiled: November 24, 2015Date of Patent: March 19, 2019Assignees: Tatung Company, TATUNG UNIVERSITYInventors: Chiung-Wei Lin, Jheng-Jie Ruan, Yi-Liang Chen, Hsien-Chieh Lin
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Publication number: 20180254148Abstract: The instant disclosure provides a capacitor package structure including a capacitor unit, a first enclosing layer and a second enclosing layer. The capacitor unit includes a capacitor, a first conductive pin and a second conductive pin. The first enclosing layer encloses the entire capacitor, a part of the first conductive pin and a part of the second conductive pin. The second enclosing layer encloses the entire first enclosing layer, a part of the first conductive pin and a part of the second conductive pin. One of the first enclosing layer and the second enclosing layer is a package gel formed by a package material, and another one of the first enclosing layer and the second enclosing layer is a moisture and air resistant film formed by a moisture and air resistant material.Type: ApplicationFiled: November 27, 2017Publication date: September 6, 2018Inventors: SHANG-CHE LAN, YI-LIANG CHEN, MING-TSUNG CHEN
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Publication number: 20160079449Abstract: A manufacturing method of antireflection substrate structure includes: providing a silicon wafer having a first rough surface; forming an antireflection optical film on the silicon wafer, wherein the antireflection optical film conformally overlays the first rough surface; performing a surface treatment on the antireflection optical film so that the antireflection optical film has a hydrophilic surface, and the hydrophilic surface is relatively far away from the silicon wafer; dropping a colloidal solution on the hydrophilic surface of the antireflection optical film, wherein the colloidal solution includes a solution and multiple nano-balls and the nano-balls are adhered onto the hydrophilic surface; and performing an etching process on the hydrophilic surface of the antireflection optical film by taking the nano-balls as an etching mask so as to form a second rough surface, wherein the roughness of the second rough surface is different from the roughness of the first rough surface.Type: ApplicationFiled: November 24, 2015Publication date: March 17, 2016Inventors: Chiung-Wei Lin, Jheng-Jie Ruan, Yi-Liang Chen, Hsien-Chieh Lin
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Patent number: 9224893Abstract: A manufacturing method of antireflection substrate structure includes: providing a silicon wafer having a first rough surface; forming an antireflection optical film on the silicon wafer, wherein the antireflection optical film conformally overlays the first rough surface; performing a surface treatment on the antireflection optical film so that the antireflection optical film has a hydrophilic surface, and the hydrophilic surface is relatively far away from the silicon wafer; dropping a colloidal solution on the hydrophilic surface of the antireflection optical film, wherein the colloidal solution includes a solution and multiple nano-balls and the nano-balls are adhered onto the hydrophilic surface; and performing an etching process on the hydrophilic surface of the antireflection optical film by taking the nano-balls as an etching mask so as to form a second rough surface, wherein the roughness of the second rough surface is different from the roughness of the first rough surface.Type: GrantFiled: February 7, 2013Date of Patent: December 29, 2015Assignees: Tatung Company, TATUNG UNIVERSITYInventors: Chiung-Wei Lin, Jheng-Jie Ruan, Yi-Liang Chen, Hsien-Chieh Lin
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Patent number: 8925854Abstract: A paper roll fixing device of a printer is provided. The paper roll fixing device includes a first supporting member and a second supporting member. The first supporting member includes a first supporting protrusion part and plural first auxiliary rollers. The second supporting member includes a second supporting protrusion part and plural second auxiliary rollers. The first supporting protrusion part and the second supporting protrusion part are inserted into two ends of a hollow shaft of a paper roll. Consequently, the paper roll is fixed in the space between the first supporting member and the second supporting member, and supported by the first auxiliary rollers and the second auxiliary rollers. Moreover, especially, the paper roll fixing device is applicable to a variety of paper rolls with different diameters.Type: GrantFiled: January 9, 2013Date of Patent: January 6, 2015Assignee: Primax Electronics Ltd.Inventors: Yi-Liang Chen, Wen-Hsien Yen
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Patent number: 8891238Abstract: An electronic device with a detachable communication module is provided. The electronic device includes an electronic device casing and the communication module. The electronic device casing includes a receiving space and an opening. The communication module includes a covering plate, a fixing plate, a first circuit board, and a first connector. The covering plate has an aperture. The first connector has a connecting port. Moreover, the first circuit board is connected with a supporting member. The first connector is connected with the first circuit board. The connecting port is exposed to the aperture of the covering plate. After the first circuit board and the first connector are accommodated within the receiving space, the opening of the electronic device casing is covered by the covering plate. Moreover, by the fixing plate, the communication module is fixed on the electronic device casing.Type: GrantFiled: July 27, 2012Date of Patent: November 18, 2014Assignee: Primax Electronics Ltd.Inventors: Yi-Liang Chen, Ming-Wei Yu
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Patent number: 8830494Abstract: A sheet sensing module and a duplex scanning apparatus having the sheet sensing module are provided. The sheet sensing module includes a first sensing arm, a second sensing arm, and an electronic sensor. The first sensing arm is partially exposed to a sheet feeding channel of the duplex scanning apparatus. The second sensing arm is partially exposed to an inverting channel of the duplex scanning apparatus. When a document is transferred through the sheet feeding channel to trigger said first sensing arm or the document is transferred through the inverting channel to trigger the second sensing arm, the electronic sensor generates a sensing signal.Type: GrantFiled: May 3, 2012Date of Patent: September 9, 2014Assignee: Primax Electronics Ltd.Inventors: Ping-Hung Kuo, Yi-Liang Chen, Wei-Hsun Hsu, Szu-Chieh Wu
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Patent number: 8810874Abstract: A duplex scanning apparatus and a sheet-feeding control method thereof are provided. The duplex scanning apparatus includes a sheet feeding channel, a sheet transfer channel, an inverting channel, and a sheet sensing module. A first end of the inverting channel is connected to a junction between said sheet feeding channel and the sheet transfer channel. A second end of the inverting channel is connected to the sheet transfer channel. A distance between the sheet sensing module and the first end of the inverting channel is greater than a distance between the sheet sensing module and the second end of the inverting channel. When a document is transferred through the sheet sensing module at the second time, a next document is fed into the sheet feeding channel through a sheet entrance.Type: GrantFiled: August 15, 2012Date of Patent: August 19, 2014Assignee: Primax Electronics Ltd.Inventors: Ping-Hung Kuo, Yi-Liang Chen, Wei-Hsun Hsu, Szu-Chieh Wu