Patents by Inventor Yi-Liang Liao

Yi-Liang Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250101151
    Abstract: A hydrocarbon resin polymer including a repeating unit (A) is derived from dicyclopentadiene (DCPD). The hydrocarbon resin polymer has a fluorine substituent, and the content of the fluorine substituent is 100 to 4500 ppm based on the total weight of the hydrocarbon resin polymer. A manufacturing method of the above hydrocarbon resin polymer. The manufacturing method includes polymerizing a mixture in the presence of a fluorine-containing compound, wherein the fluorine-containing compound is a boron trifluoride complex and the mixture includes a dicyclopentadiene. A substrate structure includes a resin layer, and a conductive layer disposed on the resin layer. The resin layer is formed from a resin composition including the above hydrocarbon resin polymer using a cross-linking process.
    Type: Application
    Filed: September 25, 2024
    Publication date: March 27, 2025
    Inventors: Chien-Han CHEN, Wei-Liang LEE, Ming-Hung LIAO, Yu-Tien CHEN, Yu-Chen HSU, Ka Chun AU-YEUNG, Chiung-Yao HUANG, Tzu-Yin HUANG, Yi-Hsuan TANG
  • Publication number: 20250066582
    Abstract: A resin composition includes 100 parts by weight of hydrocarbon resin polymers and 0.01 to 50 parts by weight of divinyl aromatic compound. A substrate structure includes a resin layer and a conductive layer disposed on the resin layer, wherein the resin layer is formed from the resin composition. A manufacturing method of the resin composition includes the following steps: providing a mixture, wherein the mixture includes a monovinyl aromatic compound and a divinyl aromatic compound, and optionally includes a bridged ring compound; polymerizing the mixture to form a crude composition; and purifying the crude composition to prepare the resin composition.
    Type: Application
    Filed: August 22, 2024
    Publication date: February 27, 2025
    Inventors: Yi-Hsuan TANG, Chien-Han CHEN, Wei-Liang LEE, Ming-Hung LIAO, Yu-Tien CHEN, Yu-Chen HSU, Tzu-Yuan SHIH, Ka Chun AU-YEUNG
  • Patent number: 12206000
    Abstract: A method for forming a high electron mobility transistor is disclosed. A mesa structure having a channel layer and a barrier layer is formed on a substrate. The mesa structure has two first edges extending along a first direction and two second edges extending along a second direction. A passivation layer is formed on the substrate and the mesa structure. A first opening and a plurality of second openings connected to a bottom surface of the first opening are formed and through the passivation layer, the barrier layer and a portion of the channel layer. In a top view, the first opening exposes the two first edges of the mesa structure without exposing the two second edges of the mesa structure. A metal layer is formed in the first opening and the second openings thereby forming a contact structure.
    Type: Grant
    Filed: January 18, 2024
    Date of Patent: January 21, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Tung Yeh, Chun-Liang Hou, Wen-Jung Liao, Chun-Ming Chang, Yi-Shan Hsu, Ruey-Chyr Lee
  • Patent number: 11643715
    Abstract: A composite structure with an aluminum-based alloy layer containing boron carbide and a manufacturing method thereof are provided. The composite structure includes a substrate with an open hole in that surface and the aluminum-based alloy layer containing boron carbide. The aluminum-based alloy layer is disposed in the open hole and contains aluminum, boron, carbon, and oxygen, wherein the content of aluminum is between 4 at. % and 55 at. %, the content of boron is between 9 at. % and 32 at. %, the content of carbon is between 13 at. % and 32 at. %, the content of oxygen is between 2 at. % and 38 at. %, and the ratio of the content of boron to carbon is between 0.3 and 2.7.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: May 9, 2023
    Assignee: Industrial Technology Research Institute
    Inventors: Wu-Han Liu, Yi-Liang Liao, Tai-Sheng Chen, Wei-Tien Hsiao, Chang-Chih Hsu
  • Publication number: 20230074335
    Abstract: A composite structure with an aluminum-based alloy layer containing boron carbide and a manufacturing method thereof are provided. The composite structure includes a substrate with an open hole in that surface and the aluminum-based alloy layer containing boron carbide. The aluminum-based alloy layer is disposed in the open hole and contains aluminum, boron, carbon, and oxygen, wherein the content of aluminum is between 4 at. % and 55 at. %, the content of boron is between 9 at. % and 32 at. %, the content of carbon is between 13 at. % and 32 at. %, the content of oxygen is between 2 at. % and 38 at. %, and the ratio of the content of boron to carbon is between 0.3 and 2.7.
    Type: Application
    Filed: October 5, 2021
    Publication date: March 9, 2023
    Applicant: Industrial Technology Research Institute
    Inventors: Wu-Han Liu, Yi-Liang Liao, Tai-Sheng Chen, Wei-Tien Hsiao, Chang-Chih Hsu
  • Publication number: 20140219839
    Abstract: Disclosed is a power supply device of a rotary compressor, and an electrical connector is installed at a casing of the rotary compressor for electrically connecting a motor installed inside the casing and an external power supply. A planar portion is disposed on a lateral side of the casing for installing the electrical connector, so that the electrical connector installed on a lateral side of the casing of the rotary compressor casing will not cause an increase of height of the rotary compressor to achieve a convenient installation. In addition, a protective cover is mounted onto the planar portion for covering the electrical connector, and the bottom of the protective cover is attached onto the planar portion. The electrical connector is protected by the protective cover without being exposed.
    Type: Application
    Filed: October 14, 2013
    Publication date: August 7, 2014
    Applicant: RECHI PRECISION CO., LTD
    Inventors: Wen-Jen Kuo, Yi-Liang Liao