Patents by Inventor Yin-Chen Chen

Yin-Chen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190355039
    Abstract: Methods of managing and querying product inventory data and an inventory management server are disclosed. The method is applicable to at least one electronic communication device and a server, wherein each of the at least one electronic communication device comprises a camera. The method of managing product inventory data includes: capturing an image of a product by the camera to obtain product image data; performing image recognition on the product image data to obtain at least one image characteristic and retrieving at least one product information of the respective product based on at least one of the at least one image characteristic; and creating or updating product inventory data for the product in the server based on the at least one product information.
    Type: Application
    Filed: August 30, 2018
    Publication date: November 21, 2019
    Inventors: Yau-Tai Tzeng, Yin-Chen Chen
  • Publication number: 20170025370
    Abstract: This present invention provides a method of manufacturing a chip scale sensing chip package, comprising the steps of: providing a sensing device wafer having a first top surface and a first bottom surface opposite to each other, whereby the sensing device wafer comprises a plurality of chip areas, and each of the chip areas comprising a sensing device and a plurality of conductive pads adjacent to the sensing chip nearby the first top surface; providing a cap wafer having a second top surface and a second bottom surface opposite to each other, and bonding the second surface of the cap wafer to the first top surface of the sensing device wafer by sandwiching a first adhesive layer therebetween; providing a temporary carrier substrate, and bonding the temporary carrier substrate to the second top surface of the cap wafer by sandwiching a second adhesive layer therebetween; forming a wiring layer connecting to each of the conductive pads on the first bottom surface of the sensing device wafer; providing a first
    Type: Application
    Filed: July 13, 2016
    Publication date: January 26, 2017
    Inventors: Yin-Chen CHEN, Jan-Lian LIAO, Ming-Chieh HUANG, Jyh-Wei CHEN, Hsi-Chien LIN
  • Publication number: 20160211293
    Abstract: An image sensor device is provided, and includes pixel units. Each of the pixel units includes a light sensing element, a first transistor and a second transistor. The first transistor is coupled to the light sensing element. The second transistor is coupled to the light sensing element and the first transistor. The first transistor includes a first gate structure having a first width, and the second transistor includes a second gate structure having a second width, in which a distance between the first gate structure and the second gate structure is substantially greater than the first width and the second width.
    Type: Application
    Filed: January 20, 2015
    Publication date: July 21, 2016
    Inventors: Chia-Yu WEI, Yin-Chen CHEN, Yen-Liang LIN, Yung-Lung HSU, Hsin-Chi CHEN
  • Patent number: 9379151
    Abstract: An image sensor device is provided, and includes pixel units. Each of the pixel units includes a light sensing element, a first transistor and a second transistor. The first transistor is coupled to the light sensing element. The second transistor is coupled to the light sensing element and the first transistor. The first transistor includes a first gate structure having a first width, and the second transistor includes a second gate structure having a second width, in which a distance between the first gate structure and the second gate structure is substantially greater than the first width and the second width.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: June 28, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Yu Wei, Yin-Chen Chen, Yen-Liang Lin, Yung-Lung Hsu, Hsin-Chi Chen